Patent number: 8462149
Abstract: An apparatus for 3D mesh compression based on quantization, includes a data analyzing unit (510) for decomposing data of an input 3D mesh model into vertices information (511) property information (512) representing property of the 3D mesh model, and connectivity information (515) between vertices constituting the 3D mesh model: and a mesh model quantizing unit (520) for producing quantized vertices and property information of the 3D mesh model by using the vertices, property and connectivity information (511, 512, 513). Further, the apparatus for 3D mesh compression based on quantization includes a decision bit encoding unit (535) for calculating a decision bit by using the quantized connectivity information and then encoding the quantized vertex information, property information and connectivity information (511, 512, 513) by using the decision bit.
Type:
Grant
Filed:
April 16, 2009
Date of Patent:
June 11, 2013
Assignees:
Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Hanyang University
Inventors:
Seung Wook Lee, Bon Ki Koo, Jin Seo Kim, Young Jik Lee, Ji Hyung Lee, Ho Won Kim, Chang Woo Chu, Bon Woo Hwang, Jeung Chul Park, Ji Young Park, Seong Jae Lim, Il Kyu Park, Yoon-Seok Choi, Kap Kee Kim, Euee Seon Jang, Daiyong Kim, Byoungjun Kim, Jaebum Jun, Giseok Son, Kyoung Soo Son