Abstract: Provided are a mineralizing removal method and apparatus for highly concentrated iodine in radioactive wastewater. According to the present invention, since only a small amount of sludge is discharged as compared to the previous treatment methods, a generation amount of the radioactive waste may be significantly decreased, such that wastewater containing highly or ultra-highly concentrated iodine may also be effectively treated. Further, only iodine may be selectively removed regardless of the presence of competitive anions in the wastewater. Treatment may be performed under a neutral or weak alkaline condition rather than an acidic condition, such that a volatilization of radioactive iodine was fundamentally blocked, and at the time of discharging the wastewater, a neutralization treatment process is not required.

Abstract: The present invention provides a fed-batch culture method comprising a step of fed-batch-feeding a carbon source base and a base in such a manner that the pH level can be maintained at a level suitable for the growth of microorganisms for fermentation of a carbon source. The present invention also provides a method for preparing organic acids using the fed-batch culture method. The present invention fed-batch-feeds a neutralizing agent such as ammonium bicarbonate, ammonium carbonate or alkali metal-containing weak base, and a carbon source substrate in preparing organic acids by microorganism fermentation. Thus, a pH level suitable for the survival of microorganisms for carbon source fermentation can be maintained, and the speed of injecting the carbon source base which is the source material can be appropriately adjusted.

Abstract: Disclosed is a method of preparing alkyl butyrate, which comprises: (a) producing a fermented liquid containing butyrate salt through a fermentation process using butyric acid-producing strains; (b) obtaining an extracted liquid containing butyric acid from a continuous extracting apparatus using an extraction solvent, after converting the butyrate salt into butyric acid by adding an inorganic acid except for carbonic acid or carbon dioxide into the fermented liquid, wherein the continuous extracting apparatus includes a plurality of extraction plates which are installed inside an extraction column and perform a reciprocating motion vertically, and the broth and the extraction solvent are supplied to upper and lower portions of the column, respectively; and (c) reacting the extracted liquid and alcohol having a carbon number of 4 or less or a mixture thereof in an esterification reactor to convert a resultant product into alkyl butyrate.

Abstract: Provided are a purification method and apparatus for radioactive wastewater. The purification method and apparatus for radioactive wastewater according to the present invention, which is a biological purification apparatus for radioactive wastewater containing radioactive iodine, includes: an anoxic tank into which wastewater containing radioactive iodine is introduced; and a microbial purification tank connected to the anoxic tank so as to allow wastewater in an anaerobic state to be introduced and supplied with a metal reducing bacteria source, an electron donor, and a copper ion source, wherein radioactive iodine and copper ions are bound to each other to form copper iodide by metal reducing bacteria, and the formed copper iodide is precipitated in the microbial purification tank, such that the radioactive iodide in the wastewater is removed as sludge.

Abstract: Provided is a method for removing radionuclides using microalgae and A composition for removing radionuclides. The method includes bring the radionuclides into contact with microalgae, and thus a method for easily removing radionuclides in eco-friendly manner is provided, and also a method for removing radionuclides with high efficiency is provided. A composition for removing radionuclides includes microalgae.

Abstract: A multi-chip package includes a lower substrate; at least two semiconductor chips stacked over the lower substrate and each defined with a via hole; an upper substrate coupled to a semiconductor chip positioned uppermost among the semiconductor chips; a light emitting part coupled to the lower substrate corresponding to the via hole; an electrowetting liquid lens coupled to a lower surface of the upper substrate for receiving a signal transferred from the light emitting part through the via hole; a light receiving part coupled to a sidewall of the via hole of each semiconductor chip configured to receive a signal from the electrowetting liquid lens.

Abstract: A semiconductor device includes a semiconductor chip and an inner interconnection structure. The semiconductor chip includes a front surface that exposes first connection terminals and a rear surface that is opposite to the front surface and exposes second connection terminals separated from the first connection terminals. The inner interconnection structure includes horizontal buried conductive lines and vertical connection lines disposed to pierce the semiconductor chip to connect the first connection terminals and the second connection terminals.

Abstract: A semiconductor chip includes a semiconductor substrate having one surface, the other surface which faces away from the one surface, and an integrated circuit which is formed on the one surface; and a shielding layershielding layer formed in the semiconductor substrate to correspond to the other surface.

Abstract: A stamp includes a metal supporting layer, a pattern forming layer and an adhesive layer. The metal supporting layer has a first thermal conductivity. The pattern forming layer is disposed on the metal supporting layer and has a surface with a molding pattern formed thereon. The adhesive layer is disposed between the metal supporting layer and the pattern forming layer to couple the pattern forming layer to the metal supporting layer, and has a second thermal conductivity lower than the first thermal conductivity. Thus, strength of the stamp may be improved, and deformation of the stamp during the process of manufacturing a light guide plate may be reduced or prevented.

Abstract: Disclosed is a method of preparing alkyl butyrate, which comprises: (a) producing a fermented liquid containing butyrate salt through a fermentation process using butyric acid-producing strains; (b) obtaining an extracted liquid containing butyric acid from a continuous extracting apparatus using an extraction solvent, after converting the butyrate salt into butyric acid by adding an inorganic acid except for carbonic acid or carbon dioxide into the fermented liquid, wherein the continuous extracting apparatus includes a plurality of extraction plates which are installed inside an extraction column and perform a reciprocating motion vertically, and the broth and the extraction solvent are supplied to upper and lower portions of the column, respectively; and (c) reacting the extracted liquid and alcohol having a carbon number of 4 or less or a mixture thereof in an esterification reactor to convert a resultant product into alkyl butyrate.

Abstract: A multi-chip package includes a lower substrate; at least two semiconductor chips stacked over the lower substrate and each defined with a via hole; an upper substrate coupled to a semiconductor chip positioned uppermost among the semiconductor chips; a light emitting part coupled to the lower substrate corresponding to the via hole; an electrowetting liquid lens coupled to a lower surface of the upper substrate for receiving a signal transferred from the light emitting part through the via hole; a light receiving part coupled to a sidewall of the via hole of each semiconductor chip configured to receive a signal from the electrowetting liquid lens.

Abstract: A semiconductor chip module includes a chip unit including at least two semiconductor chips disposed with a scribe lane interposed therebetween and each of which has a first surface on which bonding pads are disposed and a second surface that faces away from the first surface. Redistribution lines formed on the first surface of each semiconductor chip have first ends, which are connected with the bonding pads of each semiconductor chip, and second ends that extend to and are disposed on the scribe lane. Through electrodes formed to pass through the scribe lane are electrically connected with the second ends of the redistribution lines.

Abstract: A semiconductor chip module includes a first semiconductor chip possessing a first surface and a second surface which faces away from the first surface, and having a first transmission and reception unit which includes at least two light emitting sections and at least two light receiving sections arranged in a form of a matrix on the first surface and configured to transmit and receive optical signals; and a second semiconductor chip disposed over the first surface of the first semiconductor chip, and having a second transmission and reception unit which includes at least two light emitting sections and at least two light receiving sections arranged in a form of a matrix on a surface of the second semiconductor chip facing the first semiconductor chip and configured to transmit and receive optical signals.

Abstract: A display apparatus includes first and second frames in which a display panel is seated and optical sheets are received, and a method of manufacturing the display apparatus. The display apparatus includes a display panel displaying an image, a light source supplying light to the display panel, a first frame supporting the display panel and having the light source positioned therein, and a second frame combined with the first frame, wherein the second frame includes a cover portion that receives the light source, and a support portion, which extends from the cover portion along sidewalls of the first frame, where the support portion combines with the first frame, and includes an opening, the opening formed opposite to and facing the cover portion.

Abstract: A semiconductor device includes a semiconductor chip and an inner interconnection structure. The semiconductor chip includes a front surface that exposes first connection terminals and a rear surface that is opposite to the front surface and exposes second connection terminals separated from the first connection terminals. The inner interconnection structure includes horizontal buried conductive lines and vertical connection lines disposed to pierce the semiconductor chip to connect the first connection terminals and the second connection terminals.

Abstract: A stamp includes a metal supporting layer, a pattern forming layer and an adhesive layer. The metal supporting layer has a first thermal conductivity. The pattern forming layer is disposed on the metal supporting layer and has a surface with a molding pattern formed thereon. The adhesive layer is disposed between the metal supporting layer and the pattern forming layer to couple the pattern forming layer to the metal supporting layer, and has a second thermal conductivity lower than the first thermal conductivity. Thus, strength of the stamp may be improved, and deformation of the stamp during the process of manufacturing a light guide plate may be reduced or prevented.

Abstract: A semiconductor package includes a semiconductor chip including a body unit having one or more circuit units. A first bonding pad is disposed in a first face of the body unit and is connected to a circuit unit. A second bonding pad is disposed in the first face of the body unit in the bonding pad region so as to be positioned in an adjacent surrounding area of the first bonding pad and borders at least one side face of the first bonding pad while being insulated from the first bonding pad. A first connection terminal is attached onto the first bonding pad, and a second connection terminal is attached onto the second bonding pad and is positioned in an adjacent surrounding area of the first connection terminal and borders at least one side face of the first connection terminal while being insulated from the first connection terminal.

Abstract: The present invention provides a biofilm reactor comprising a spiral structure and a water treatment facility using the same. The biofilm reactor comprises an inlet pipe for supplying water, an air supply pipe for supplying air, and an outlet pipe for discharging the water and air that passed through the reactor, wherein the reactor is provided therein with a spiral structure for forming a spiral bubble flow passage from the air supply pipe to the outlet pipe such that the oxygen transfer rate is increased by inducing the flow of bubbles supplied from the air supply pipe and by increasing residence time of the bubbles.

Abstract: A semiconductor package includes a semiconductor chip including a body unit having one or more circuit units. A first bonding pad is disposed in a first face of the body unit and is connected to a circuit unit. A second bonding pad is disposed in the first face of the body unit in the bonding pad region so as to be positioned in an adjacent surrounding area of the first bonding pad and borders at least one side face of the first bonding pad while being insulated from the first bonding pad. A first connection terminal is attached onto the first bonding pad, and a second connection terminal is attached onto the second bonding pad and is positioned in an adjacent surrounding area of the first connection terminal and borders at least one side face of the first connection terminal while being insulated from the first connection terminal.

Abstract: A display apparatus includes first and second frames in which a display panel is seated and optical sheets are received, and a method of manufacturing the display apparatus. The display apparatus includes a display panel displaying an image, a light source supplying light to the display panel, a first frame supporting the display panel and having the light source positioned therein, and a second frame combined with the first frame, wherein the second frame includes a cover portion that receives the light source, and a support portion, which extends from the cover portion along sidewalls of the first frame, where the support portion combines with the first frame, and includes an opening, the opening formed opposite to and facing the cover portion.