Abstract: A dual release actuator for a vehicle seat includes a motor, a cable carrier configured to receive power of the motor, thereby rotating to selectively pull one of two different cables, a Hall sensor to sense rotation of the motor, and a controller configured to count a sensing pulse of the Hall sensor for controlling rotation of the motor.

Abstract: An apparatus for generating a roll map of a merge-wound electrode includes a position measurement device configured to acquire coordinate value data for a longitudinal position of an electrode according to an amount of rotation of the rewinder. The apparatus includes an input device configured to input an input signal indicating a start of merge-winding or an end of merge-winding, a seam detector configured to detect a seam, a reference point detector configured to detect a plurality of reference points of the merge-wound electrode, and a roll map generator configured to generate a roll map for simulating the merge-wound electrode moving in a roll-to-roll state based on the input signal of the input device, and to display the longitudinal coordinate values of the electrode, the electrode coordinate values of the seam, and the electrode coordinate values of the plurality of reference points of the merge-wound electrode on the roll map.

Abstract: The present invention relates to a novel use of NCKAP1 gene in neurodegenerative diseases. More specifically, the present invention relates to a marker composition for predicting the prognosis of a neurodegenerative disease, comprising a NCKAP1 protein or a gene encoding same, a composition and a kit for predicting the prognosis of a neurodegenerative disease, which comprises a formulation for measuring the level of the protein or an mRNA of the gene encoding same, and a pharmaceutical composition for preventing or treating neurodegenerative disease, comprising the protein or the gene encoding same as an active ingredient.

Abstract: Methods and systems for executing tracking and monitoring manufacturing data of a battery are disclosed. One method includes: receiving, by a server system, sensing data of the battery from a sensing system; generating, by the server system, mapping data based on the sensing data; generating, by the server system, identification data of the battery based on the sensing data; generating, by the server system, monitoring data of the battery based on the sensing data, the identification data, and the mapping data; and generating, by the server system, display data for displaying a simulated electrode of the battery on a graphical user interface based on the monitoring data of the battery.

Abstract: A method of providing flight vehicle operation information is provided. The method may comprise providing a first control screen, which displays first operation information of a plurality of monitored flight vehicles, inputting the first operation information and context information to a pre-established operation information prediction model and generating second operation information of the monitored flight vehicles at a future time point based on data output from the operation information prediction model, and providing a second control screen, which displays the second operation information.

Abstract: A method of controlling the operations of flight vehicles is provided. The method may comprise assigning neighboring virtual flight vehicles to each of monitored flight vehicles, inputting operation information of the monitored flight vehicles to a collision detection model, and if information indicating that a collision has occurred between neighboring virtual flight vehicles of the first monitored flight vehicle and neighboring virtual flight vehicles of the second monitored flight vehicle is output from the collision detection model, outputting a collision warning message, wherein the collision detection model is a model that utilizes operation information of the neighboring virtual flight vehicles, which is obtained by applying the operation information of the monitored flight vehicles to their respective neighboring virtual flight vehicles, to determine and output the occurrence of a collision between the neighboring virtual flight vehicles of the first and second monitored flight vehicles.

Abstract: A semiconductor package includes a substrate; a sub semiconductor package disposed over the substrate, the sub semiconductor package including a sub semiconductor chip with chip pads on its active surface that faces the substrate, a sub molding layer that surrounds side surfaces of the sub semiconductor chip, the sub molding layer with a surface that faces the substrate, and redistribution conductive layers that connect to the chip pads and extend under the surface of the sub molding layer, wherein the redistribution conductive layers include a signal redistribution conductive layer that extends toward an edge of the sub molding layer, the signal redistribution conductive layer with a signal redistribution pad on its end portion, and a power redistribution conductive layer that has a length that is shorter than a length of the signal redistribution conductive layer, the power redistribution conductive layer with a power redistribution pad on its end portion; a signal sub interconnector with an upper surface t

Abstract: A part assembling system of an automation line includes: a station frame in which a part assembling tool is installed and that includes at least one mounting part; at least one positioner mounted on the at least one mounting part; a part conveying pallet including at least one positioning pin coupled to the at least one positioner; and a moving carriage that transports the part conveying pallet to a predetermined position on a floor of a process work area.

Abstract: The present disclosure provides a method for polymerizing ultra-high molecular weight polyethylene and a method for preparing the catalyst thereof by reacting a main catalyst, a cocatalyst mixed with two or more types of organoaluminum, and an organosilane compound in the polymerization of ultra-high molecular weight polyethylene to have high activity, high bulk density, and high molecular weight while simultaneously having low particle agglomeration.

Abstract: A semiconductor package includes a substrate; a sub semiconductor package disposed over the substrate, the sub semiconductor package including a sub semiconductor chip with chip pads on its active surface that faces the substrate, a sub molding layer that surrounds side surfaces of the sub semiconductor chip, the sub molding layer with a surface that faces the substrate, and redistribution conductive layers that connect to the chip pads and extend under the surface of the sub molding layer, wherein the redistribution conductive layers include a signal redistribution conductive layer that extends toward an edge of the sub molding layer, the signal redistribution conductive layer with a signal redistribution pad on its end portion, and a power redistribution conductive layer that has a length that is shorter than a length of the signal redistribution conductive layer, the power redistribution conductive layer with a power redistribution pad on its end portion; a signal sub interconnector with an upper surface t

Abstract: An apparatus for assembling an engine includes an engine jig configured to load the engine on which a pump sprocket, a cam sprocket, an auto tensioner, and an engine belt are preliminarily mounted. The apparatus includes: a pump sprocket fastening unit disposed on a first die disposed on a first side of the engine jig and configured to clamp and fully fasten the pump sprocket in order to fixedly mount the pump sprocket preliminarily mounted to the engine; a cam sprocket fastening unit disposed on the first die and configured to clamp, rotate, and fully fasten the cam sprocket in order to fixedly mount the cam sprocket preliminarily mounted to the engine; and an auto tensioner fastening unit disposed on the first die, and configured to clamp, rotate, and fully fasten the auto tensioner in order to fixedly mount the auto tensioner preliminarily mounted to the engine.

Abstract: Provided is an apparatus for piston insertion, including an insertion robot having a plurality of robot arms connected by a plurality of articulated joints, a piston insertion module directly mounted on the insertion robot, gripping a piston assembly, and inserting the piston assembly into a cylinder bore of a cylinder block, and a controller controlling an operation of the insertion robot and an operation of the piston insertion module.

Abstract: A part assembling system of an automation line includes: a station frame in which a part assembling tool is installed and that includes at least one mounting part; at least one positioner mounted on the at least one mounting part; a part conveying pallet including at least one positioning pin coupled to the at least one positioner; and a moving carriage that transports the part conveying pallet to a predetermined position on a floor of a process work area.

Abstract: A semiconductor package includes a substrate and a sub semiconductor package disposed over the substrate. The sub semiconductor package includes a sub semiconductor chip which has chip pads on its active surface facing the substrate, a sub molding layer which surrounds side surfaces of the sub semiconductor chip and has one surface facing the substrate, and redistribution conductive layers which are connected to the chip pads and extend over the one surface of the sub molding layer. The redistribution conductive layers include a signal redistribution conductive layer, which extends onto an edge of the sub molding layer and has a signal redistribution pad on its end portion, and a power redistribution conductive layer, which has a length shorter than a length of the signal redistribution conductive layer and has a power redistribution pad on its end portion.

Abstract: Mineralogical method and apparatus for removal of cesium ion in aqueous solution are provided. In particular, a mineralogical method for removal of cesium ion in aqueous solution including controlling a temperature of radioactive wastewater containing cesium from 25 to 45° C., controlling an initial pH of the radioactive wastewater from 6.0 to 8.5, and adding iron(II) and sulfide(?II) containing sulfur in the ?2 oxidation state to the radioactive wastewater, to convert the cesium ion in aqueous solution into a cesium mineral, and a mineralogical apparatus for removal of cesium ion in aqueous solution, capable of being applied to such a method, are provided.

Abstract: A semiconductor package includes a substrate and a sub semiconductor package disposed over the substrate. The sub semiconductor package includes a sub semiconductor chip which has chip pads on its active surface facing the substrate, a sub molding layer which surrounds side surfaces of the sub semiconductor chip and has one surface facing the substrate, and redistribution conductive layers which are connected to the chip pads and extend over the one surface of the sub molding layer. The redistribution conductive layers include a signal redistribution conductive layer, which extends onto an edge of the sub molding layer and has a signal redistribution pad on its end portion, and a power redistribution conductive layer, which has a length shorter than a length of the signal redistribution conductive layer and has a power redistribution pad on its end portion.

Abstract: A semiconductor package includes a substrate; a sub semiconductor package disposed over the substrate, the sub semiconductor package including a sub semiconductor chip with chip pads on its active surface that faces the substrate, a sub molding layer that surrounds side surfaces of the sub semiconductor chip, the sub molding layer with a surface that faces the substrate, and redistribution conductive layers that connect to the chip pads and extend under the surface of the sub molding layer, wherein the redistribution conductive layers include a signal redistribution conductive layer that extends toward an edge of the sub molding layer, the signal redistribution conductive layer with a signal redistribution pad on its end portion, and a power redistribution conductive layer that has a length that is shorter than a length of the signal redistribution conductive layer, the power redistribution conductive layer with a power redistribution pad on its end portion; a signal sub interconnector with an upper surface t

Abstract: A semiconductor integrated circuit device may include a pad, a first voltage protection circuit and a second voltage protection circuit. The first voltage protection circuit may be connected with the pad. The second voltage protecting circuit may be connected between the first voltage protection circuit and a ground terminal. The first voltage protection circuit may include a gate positive p-channel metal oxide semiconductor (GPPMOS) transistor. The second voltage protection circuit may include serially connected GPPMOS transistors.

Abstract: Disclosed are a semiconductor device and a stacked semiconductor package. The semiconductor device may include a semiconductor chip and a plurality of chip pads disposed on the semiconductor chip in a second horizontal direction perpendicular to a first horizontal direction. The plurality of chip pads may include: a first chip pad connected to a wire extending in the first horizontal direction, when seen from the top; and a second chip pad connected to a diagonal wire extending in a direction at an angle to the first and second horizontal directions, when seen from the top. The width of the first chip pad in the second horizontal direction may be smaller than the width of the second chip pad in the second horizontal direction.

Abstract: A semiconductor integrated circuit device may include a pad, a first voltage protection unit and a second voltage protection unit. The first voltage protection unit may be connected with the pad. The first voltage protection unit may be configured to maintain a turn-off state when a test voltage having a negative level may be applied from the pad. The second voltage protection unit may be connected between the first voltage protection unit and a ground terminal. The second voltage protection unit may be turned-on when an electrostatic voltage having a positive level may be applied from the pad. The second voltage protection unit may include a plurality of gate positive p-channel metal oxide semiconductor (GPPMOS) transistors serially connected with each other.