Patents by Inventor Seung Yong Choi

Seung Yong Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having solder joint of improved reliability
    Publication number: 20030209785
    Abstract: A semiconductor package mounted on a printed circuit board using improved-reliability solder joints is described. The semiconductor package includes a lead frame pad and lead frame lead attached to the solder joints, a semiconductor chip mounted on top of the lead frame pad, wires electrically connecting the semiconductor chip and the lead frame lead, an epoxy molding compound that exposes the lower portion surface of the lead frame pad and part of the lead frame lead, and protrusions fixed to the lower portion surface of the epoxy molding compound and positioned between the solder joints, with the protrusions supporting the semiconductor package when the epoxy molding compound is mounted on the printed circuit board.
    Type: Application
    Filed: March 4, 2003
    Publication date: November 13, 2003
    Inventors: Seung-Yong Choi, Seung-Han Paek
  • Stacked intelligent power module package
    Patent number: 6574107
    Abstract: A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: June 3, 2003
    Assignee: Fairchild Korea Semiconductor Ltd.
    Inventors: O-seob Jeon, Gi-young Jeon, Seung-yong Choi, Seung-won Lim, Seung-jin Kim, Eul-bin Im, Byeong Gon Kim
  • Amino acid derivatives
    Publication number: 20030064976
    Abstract: The present invention provides certain alpha-amino acids and derivatives thereof, such as, but not limited to, esters, amides and salts. The present invention also provides a novel method for the synthesis of alpha-amino acids and derivatives thereof.
    Type: Application
    Filed: July 24, 2002
    Publication date: April 3, 2003
    Inventors: Sekar Alla, Seung-Yong Choi, Dale Dhanoa, Elso DiFranco, Galina Krokhina, Keqiang Li, Thiagarajan Balasubramanian, Wen-Chun Zhang
  • Stacked intelligent power module package
    Publication number: 20020057553
    Abstract: A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.
    Type: Application
    Filed: February 26, 2001
    Publication date: May 16, 2002
    Applicant: Fairchild Korea Semiconductor Ltd.
    Inventors: O-seob Jeon, Gi-young Jeon, Seung-yong Choi, Seung-won Lim, Seung-jin Kim, Eul-bin Im, Byeong Gon Kim