Abstract: The present invention relates to an apparatus and method of performing wireless communication using multiple directional antennas. The transportation means according to the present invention includes at least two communication devices, wherein one of the at least two communication devices, communication device A, includes a directional antenna group 1, and the other communication device, communication device B, includes a directional antenna group 2, and wherein the communication device A performs directional antenna selection control of the directional antenna group 1 included in the communication device A depending on whether the communication device B is connected with a network. According to the present invention, one of the communication devices gains access to a satellite station, a base station, or other ships, at least one antenna of another communication device may be used to relay wireless communication and may play a role as a base station or an AP.

Abstract: A semiconductor memory and a method of programming the same are provided. A semiconductor memory device may include a memory cell array including a plurality of normal memory cells, a select transistor, and a dummy memory cell. The semiconductor memory device may include a voltage generator configured for generating a program voltage applied to a normal memory cell selected among the plurality of normal memory cells, and for generating a dummy word line voltage applied to the dummy memory cell in a program operation. The semiconductor memory device may include a control logic configured for controlling the voltage generator to adjust the dummy word line voltage based on the program voltage.

Abstract: A semiconductor memory apparatus includes a memory block including memory cells coupled between a bit line and a source line and operating in response to voltages applied to word lines, and a peripheral circuit suitable for performing operations relating to data input and output of the memory cells, wherein the peripheral circuit is suitable for applying a precharge voltage to the bit line when word lines adjacent to a selected word line are set to a floating state.

Abstract: A nonvolatile memory device includes a channel vertically extending from a substrate, a plurality of memory cells stacked along the channel; a source region connected to a first end portion of the channel, and a bit line connected to a second end portion of the channel, wherein the first end portion of the channel that adjoins the source region is formed as an undoped semiconductor layer or a semiconductor layer doped with P-type impurities.

Abstract: A memory string includes a pass transistor, first memory cells connected in series to a drain terminal of the pass transistor, and first to kth memory cell groups connected in parallel to a source terminal of the pass transistor and each including a plurality of second memory cells connected in series. Here, ‘k’ denotes an integer that is equal to or greater than ‘2’.

Abstract: Disclosed herein are a maritime communication apparatus and method. The maritime communication apparatus includes a land-based network communication unit, a maritime network communication unit, and a communication control unit. The land-based network communication unit communicates with a land-based communication network. The maritime network communication unit communicates with a maritime communication network. The communication control unit links the communication of the land-based network communication unit with the communication of the maritime network communication unit in accordance with a destination address of data provided by any one of the land-based network communication unit and the maritime network communication unit.

Abstract: A semiconductor device may include memory blocks having a plurality of strings including drain select transistors and memory cells electrically coupled in series between a bit line and a pipe transistor and source select transistors and memory cells electrically coupled in series between a common source line and the pipe transistor; a circuit group configured to float drain select lines electrically coupled to the drain select transistors included in unselected memory blocks and source select lines electrically coupled to the source select transistors included in the unselected memory blocks and to ground a pipe line electrically coupled to the pipe transistor when a program operation of a selected memory block among the memory blocks is performed; and a control circuit configured to control the circuit group.

Abstract: A non-volatile memory device in accordance with one embodiment of the present invention includes a substrate including a P-type impurity-doped region, a channel structure comprising a plurality of interlayer insulating layers that are alternately stacked with a plurality of channel layers on the substrate, a P-type semiconductor pattern that contacts sidewalls of the plurality of channel layers, wherein a lower end of the P-type semiconductor pattern contacts the P-type impurity-doped region, and source lines that are disposed at both sides of the P-type semiconductor pattern and contact the sidewalls of the plurality of channel layers.

Abstract: A three-dimensional (3-D) nonvolatile memory device includes a support protruded from a surface of a substrate and configured to have an inclined sidewall; channel structures each configured to comprise interlayer insulating layers and channel layers which are alternately stacked over the substrate including the support, bent along the inclined sidewall of the support, wherein each of the channel structures comprises a cell region and a contact region, and the channel layers are exposed in the contact region; select lines formed over the channel structures; and a pillar type channels coupled to respective channel layers at the contact region and penetrating the select lines.

Abstract: Disclosed herein is a method of manufacturing a container for absorbing fluid shock or mechanical shock. The method includes preparing a raw material pipe, forming a coupling pipe by reducing a diameter of at least one side of the raw material pipe, and forming an inner circumference of the coupling pipe and bending it. Accordingly, a container body and a coupling pipe coupled to at least one side of the container body are integrated together, so that an additional process for coupling the container body with the coupling pipe is not required, and thus the cost of production is reduced.

Abstract: An antenna switching system according to an exemplary embodiment of the present invention includes a plurality of directional antenna which is mounted in a ship to receive a wireless signal; an antenna switch which selects one of the plurality of directional antennas; a modem which is connected to the directional antennas through the antenna switch to extract a strength of a received signal; and a switching determining unit which outputs an antenna selection signal to the antenna switch based on the strength of the received signal and GPS/DR information of a transmission side ship and its own ship.

Abstract: A non-volatile memory device includes first and second vertical channel layers generally protruding upwardly from a semiconductor substrate substantially in parallel; a first gate group configured to include a plurality of memory cell gates which are stacked substantially along the first vertical channel layer and are isolated from each other with an interlayer insulating layer interposed substantially between the memory cell gates; a second gate group configured to include a plurality of memory cell gates which are stacked substantially along the second vertical channel layer and are isolated from each other with the interlayer insulating layer interposed substantially between the memory cell gates; a pipe channel layer configured to couple the first and the second vertical channel layers; and a channel layer extension part generally extended from the pipe channel layer to the semiconductor substrate and configured to couple the pipe channel layer and the semiconductor substrate.

Abstract: A nonvolatile memory device includes a channel vertically extending from a substrate, a plurality of memory cells stacked along the channel; a source region connected to a first end portion of the channel, and a bit line connected to a second end portion of the channel, wherein the first end portion of the channel that adjoins the source region is formed as an undoped semiconductor layer or a semiconductor layer doped with P-type impurities.

Abstract: A non-volatile memory device in accordance with one embodiment of the present invention includes a substrate including a P-type impurity-doped region, a channel structure comprising a plurality of interlayer insulating layers that are alternately stacked with a plurality of channel layers on the substrate, a P-type semiconductor pattern that contacts sidewalls of the plurality of channel layers, wherein a lower end of the P-type semiconductor pattern contacts the P-type impurity-doped region, and source lines that are disposed at both sides of the P-type semiconductor pattern and contact the sidewalls of the plurality of channel layers.

Abstract: A memory string includes a pass transistor, first memory cells connected in series to a drain terminal of the pass transistor, and first to kth memory cell groups connected in parallel to a source terminal of the pass transistor and each including a plurality of second memory cells connected in series. Here, ‘k’ denotes an integer that is equal to or greater than ‘2’.

Abstract: A nonvolatile memory device includes a channel vertically extending from a substrate, a plurality of memory cells stacked along the channel; a source region connected to a first end portion of the channel, and a bit line connected to a second end portion of the channel, wherein the first end portion of the channel that adjoins the source region is formed as an undoped semiconductor layer or a semiconductor layer doped with P-type impurities.

Abstract: A non-volatile memory device includes first and second vertical channel layers generally protruding upwardly from a semiconductor substrate substantially in parallel; a first gate group configured to include a plurality of memory cell gates which are stacked substantially along the first vertical channel layer and are isolated from each other with an interlayer insulating layer interposed substantially between the memory cell gates; a second gate group configured to include a plurality of memory cell gates which are stacked substantially along the second vertical channel layer and are isolated from each other with the interlayer insulating layer interposed substantially between the memory cell gates; a pipe channel layer configured to couple the first and the second vertical channel layers; and a channel layer extension part generally extended from the pipe channel layer to the semiconductor substrate and configured to couple the pipe channel layer and the semiconductor substrate.

Abstract: A semiconductor memory apparatus includes a memory block including memory cells coupled between a bit line and a source line and operating in response to voltages applied to word lines, and a peripheral circuit suitable for performing operations relating to data input and output of the memory cells, wherein the peripheral circuit is suitable for applying a precharge voltage to the bit line when word lines adjacent to a selected word line are set to a floating state.

Abstract: Disclosed herein are a method and apparatus for generating multiband Radio Frequency (RF) signals in maritime wireless communication. The apparatus includes a baseband conversion unit, a phase compensation unit, a Direct Current (DC) offset compensation unit, and an RF transmission unit. The baseband conversion unit converts RF signals corresponding to a baseband modulation signal having a negative frequency and a baseband modulation signal having a positive frequency into baseband signals, respectively. The phase compensation unit eliminates the images of multiband signals so as to correspond to the baseband signals. The DC offset compensation unit compensates the baseband modulation signals for DC offsets using the multiband signals from which the images have been eliminated. The RF transmission unit generates the RF signals using the signals which have been compensated for the DC offsets, and sends the RF signals via an antenna.

Abstract: A three-dimensional (3-D) nonvolatile memory device includes a support protruded from a surface of a substrate and configured to have an inclined sidewall; channel structures each configured to comprise interlayer insulating layers and channel layers which are alternately stacked over the substrate including the support, bent along the inclined sidewall of the support, wherein each of the channel structures comprises a cell region and a contact region, and the channel layers are exposed in the contact region; select lines formed over the channel structures; and a pillar type channels coupled to respective channel layers at the contact region and penetrating the select lines.