Patents by Inventor Shan Zhong

Shan Zhong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10636769
    Abstract: Package assemblies for and methods of packaging integrated circuit chips are described. Disclosed package assemblies have spacers and recessed regions comprising IC chips. Architectural structures are provided that enable, for example, three dimensional (3D) packaging (or system in package (SiP) or multi-chip modules), systems-on-chip 3D packaging, and hybrid 3D bonding. Embodiments of the invention can be used, for example, to create logic-to-memory, memory-to-memory, and logic-to-logic interface stacking assemblies.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: April 28, 2020
    Assignee: Intel Corporation
    Inventors: Weng Hong Teh, John S. Guzek, Shan Zhong
  • Publication number: 20200073099
    Abstract: Various embodiments disclosed relate to an assembly. The assembly includes a compound parabolic concentrator including an exit aperture that has a generally circular perimeter, which defines a circumference of the exit aperture. The assembly further includes a photodiode sensor generally that is aligned with the exit aperture of the compound parabolic concentrator. An optical adhesave layer adheres the exit aperture of the compound parabolic concentrator to the photodiode sensor. A protrusion extends between at least a portion of the perimeter of the compound parabolic concentrator exit aperture and the photodiode.
    Type: Application
    Filed: September 30, 2016
    Publication date: March 5, 2020
    Inventors: Chia-Pin Chiu, Anna M. Prakash, Amanuel M. Abebaw, Olga Gorbounova, Ching-Ping Janet Shen, Shan Zhong, Mark Saltas
  • Patent number: 10561392
    Abstract: The object of the present invention is to disclose a novel optical miniaturized handheld medical device for convenient monitoring and/or data collection of detailed signals on human cardiovascular function. The implementation consists of a number of advanced technologies, including interferometric detection, phase controlled focusing beam steering, auto-tracking scheme and algorism, and integrated optical chip assembly to enhance the device's performance and miniaturization. Briefly, this handheld medical device directs a single or dual output laser beam(s) onto certain skin surface to detect the surface vibration velocity at the point where the laser hits the surface. The skin surface vibrates in response to cardiovascular signals, such as blood pressure pulses, turbulent blood flow through narrowed arteries, pumping actions of the heart, or the closure of the heart valves etc.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: February 18, 2020
    Inventors: Jin Zhang, Shan Zhong, Wei Chen, Zhonghua Zhu, Lei Wu
  • Patent number: 10501470
    Abstract: The invention discloses a use of asarinin in preparation of medicines for treating various coughs. The asarinin is used for preparing medicines for treating various coughs separately or in combination with other medicines. The asarinin can be extracted by an SFE-CO2 method. The asarinin and usable drug carriers or excipients are made into various formulations. And the formulations are granules, tablets, capsules, soft capsules, pills, dripping pills, ointments, syrups, injection, oral liquid, tinctures, sustained-releasing drugs, controlled release drugs or targeting preparations.
    Type: Grant
    Filed: September 4, 2017
    Date of Patent: December 10, 2019
    Assignees: THE FIRST AFFILIATED HOSPITAL OF GUANGZHOU MEDICAL UNIVERSITY, GUANGZHOU INSTITUTE OF RESPIRATORY DISEASE
    Inventors: Kefang Lai, Xiaodong Liu, Bonian Zhong, Shan Zhong, Chuqin Huang
  • Publication number: 20190355644
    Abstract: An IGBT module includes a heat dissipation base plate. A first ceramic heat dissipation element is embedded in the heat dissipation base plate. A first wiring layer is provided on the surface of the heat dissipation base plate. The first side of an IGBT chip is mounted onto the first wiring layer. The second side of the IGBT chip is provided with a heat conductive metal plate. A first heat dissipation plate having a first through hole is provided on a side of the first wiring layer. The IGBT chip and the heat conductive metal plate are located in the first through hole. A second wiring layer is provided on a side of the first heat dissipation plate away from the IGBT chip. The second wiring layer is provided on a side of the heat conductive metal plate.
    Type: Application
    Filed: January 22, 2017
    Publication date: November 21, 2019
    Applicant: RAYBEN TECHNOLOGIES (ZHUHAI) LIMITED
    Inventors: Shan ZHONG, Weidong GAO, Qizhao HU, Wai Kin Raymond LAM
  • Publication number: 20190323356
    Abstract: A compressor blade having a leading edge and a trailing edge, and a surface pattern between the leading and trailing edges, the surface pattern comprising at least one set of herringbone riblets formed of a plurality of v-shaped riblets, wherein the v-shaped riblets are spaced apart by a distance of between 200-400 ?m, and have a height of between 50-120 ?m.
    Type: Application
    Filed: November 17, 2017
    Publication date: October 24, 2019
    Applicant: Dyson Technology Limited
    Inventors: Qiang LIU, Shan ZHONG, Mark Andrew JOHNSON, Matthieu Michel Xavier DE MAILLARD
  • Publication number: 20190304808
    Abstract: A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 3, 2019
    Inventors: Ziyin LIN, Vipul MEHTA, Edvin CETEGEN, Yuying WEI, Sushrutha GUJJULA, Nisha ANANTHAKRISHNAN, Shan ZHONG
  • Publication number: 20190025308
    Abstract: The present invention provides therapeutic, diagnostic, and prognostic methods for cancer. The invention provides methods of treating a cancer, methods of determining whether an individual having a cancer is likely to respond to a treatment including an immune checkpoint inhibitor (e.g., a PD-L1 axis binding antagonist), methods of predicting responsiveness of an individual having a cancer to a treatment including an immune checkpoint inhibitor (e.g., a PD-L1 axis binding antagonist), methods of selecting a therapy for an individual having a cancer, methods of providing a prognosis for an individual having a cancer, and methods of monitoring a response of an individual having a cancer, based on a blood tumor mutational burden (bTMB) score or a maximum somatic allele frequency (MSAF) from a sample (e.g., a whole blood sample, a plasma sample, a serum sample, or a combination thereof) from the individual.
    Type: Application
    Filed: July 20, 2018
    Publication date: January 24, 2019
    Inventors: Craig Anthony CUMMINGS, Yan LI, Sarah Margaret PAUL, Erica Beth SCHLEIFMAN, David SHAMES, David FABRIZIO, Daniel LIEBER, Geoffrey Alan OTTO, Mark KENNEDY, Travis CLARK, Doron LIPSON, Jie HE, Shan ZHONG
  • Publication number: 20190006325
    Abstract: Package assemblies for and methods of packaging integrated circuit chips are described. Disclosed package assemblies have spacers and recessed regions comprising IC chips. Architectural structures are provided that enable, for example, three dimensional (3D) packaging (or system in package (SiP) or multi-chip modules), systems-on-chip 3D packaging, and hybrid 3D bonding. Embodiments of the invention can be used, for example, to create logic-to-memory, memory-to-memory, and logic-to-logic interface stacking assemblies.
    Type: Application
    Filed: September 10, 2018
    Publication date: January 3, 2019
    Inventors: Weng Hong TEH, John S. GUZEK, Shan ZHONG
  • Publication number: 20180328503
    Abstract: A wall-mounted check valve structure comprises a base and a connecting assembly. A flow tunnel is arranged at center of the base. An inner threading section is arranged at top of the flow tunnel. A first sealing sheet is arranged at top of the inner threading section. The connecting assembly includes a main body and a fixing seat. A connecting section is arranged in the main body. A stop surface is arranged at a lower side of the connecting section. The fixing seat has a head end and an outer threading section. Two sides of the fixing seat respectively have a plurality of water holes and a sealing piston. The sealing piston has a shielding section and a linking section. The linking section inserts into one of the water holes arranged at center of the fixing seat and the shielding section shields other water holes to make water flow unidirectionally.
    Type: Application
    Filed: May 10, 2017
    Publication date: November 15, 2018
    Inventor: SONG-SHAN ZHONG
  • Patent number: 10128225
    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations of interconnect structures having a polymer core in integrated circuit (IC) package assemblies. In one embodiment, an apparatus includes a first die having a plurality of transistor devices disposed on an active side of the first die and a plurality of interconnect structures electrically coupled with the first die, wherein individual interconnect structures of the plurality of interconnect structures have a polymer core, and an electrically conductive material disposed on the polymer core, the electrically conductive material being configured to route electrical signals between the transistor devices of the first die and a second die. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: November 13, 2018
    Assignee: INTEL CORPORATION
    Inventors: Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson
  • Publication number: 20180305372
    Abstract: The invention discloses a use of asarinin in preparation of medicines for treating various coughs. The asarinin is used for preparing medicines for treating various coughs separately or in combination with other medicines. The asarinin can be extracted by an SFE-CO2 method. The asarinin and usable drug carriers or excipients are made into various formulations. And the formulations are granules, tablets, capsules, soft capsules, pills, dripping pills, ointments, syrups, injection, oral liquid, tinctures, sustained-releasing drugs, controlled release drugs or targeting preparations.
    Type: Application
    Filed: September 4, 2017
    Publication date: October 25, 2018
    Inventors: Kefang LAI, Xiaodong LIU, Bonian ZHONG, Shan ZHONG, Chuqin HUANG
  • Publication number: 20180271896
    Abstract: The present invention discloses an Asarum total polysaccharide extract with antitussive activity, an extraction method thereof and an application in the preparation of a medicine for preventing and treating coughs. The present invention proves that the Asarum total polysaccharide extract has a significant effect of suppressing cough for the first time through a large number of pharmacodynamic tests, has the therapeutic effect approximate to codeine, has the effect of prolonging the cough latent period better than codeine, and also finds that the total Asarum polysaccharide extract has the effects of reducing the cough sensitivity and suppressing the airway inflammation for the first time, has excellent preventive and therapeutic effects on various types of coughs, and can be used for preparing the medicines for preventing and treating cough-related diseases.
    Type: Application
    Filed: June 3, 2018
    Publication date: September 27, 2018
    Inventors: Kefang LAI, Xiaodong LIU, Bonian ZHONG, Shan ZHONG, Yichu NIE
  • Patent number: 10083936
    Abstract: Package assemblies for and methods of packaging integrated circuit chips are described. Disclosed package assemblies have spacers and recessed regions comprising IC chips. Architectural structures are provided that enable, for example, three dimensional (3D) packaging (or system in package (SiP) or multi-chip modules), systems-on-chip 3D packaging, and hybrid 3D bonding. Embodiments of the invention can be used, for example, to create logic-to-memory, memory-to-memory, and logic-to-logic interface stacking assemblies.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: September 25, 2018
    Assignee: Intel Corporation
    Inventors: Weng Hong Teh, John S. Guzek, Shan Zhong
  • Patent number: 10073613
    Abstract: The present invention is applicable to the field of terminal technologies, and provides a processing method and apparatus, and a terminal. The method includes: acquiring a sensing position on a sensitive screen of a screen; acquiring, according to the acquired sensing position on the sensitive screen and a preset correspondence between a sensing position on the sensitive screen and a display position on the screen, a display position, corresponding to the acquired sensing position on the sensitive screen, on the screen; displaying, when the display position is located in an operable area displayed on the screen, a touch button at the sensing position, corresponding to the operable area displayed on the screen, on the sensitive screen; and receiving an operation instruction for the touch button, where the operation instruction is used to instruct to perform an operation on the operable area.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: September 11, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Zhiqing Liao, Shan Zhong, Zhaojie Xia, Lifu Xu
  • Publication number: 20180192898
    Abstract: The object of the present invention is to disclose a novel optical miniaturized handheld medical device for convenient monitoring and/or data collection of detailed signals on human cardiovascular function. The implementation consists of a number of advanced technologies, including interferometric detection, phase controlled focusing beam steering, auto-tracking scheme and algorism, and integrated optical chip assembly to enhance the device's performance and miniaturization. Briefly, this handheld medical device directs a single or dual output laser beam(s) onto certain skin surface to detect the surface vibration velocity at the point where the laser hits the surface. The skin surface vibrates in response to cardiovascular signals, such as blood pressure pulses, turbulent blood flow through narrowed arteries, pumping actions of the heart, or the closure of the heart valves etc.
    Type: Application
    Filed: January 11, 2017
    Publication date: July 12, 2018
    Applicant: OmniSensing Photonics, LLC
    Inventors: Jin Zhang, Shan Zhong, Wei Chen, Zhonghua Zhu, Lei Wu
  • Patent number: 9978261
    Abstract: A remote controller and an information processing method and system, which relate to the field of electronic technologies and can improve user experience, where the remote controller is easy to carry. The remote controller includes a remote control main body, where the remote control main body is a wearable ring body; a sensor configured to detect a signal generated by an operation gesture input by a user; a processor, where the processor is connected to the sensor, and is configured to analyze the signal generated by the operation gesture, and generate a corresponding control signal according to an analysis result; and a first wireless communications module, connected to the processor, and configured to send the control signal to a terminal device, so that the terminal device performs a corresponding operation according to the control signal.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: May 22, 2018
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Lifu Xu, Shan Zhong, Zhaojie Xia
  • Patent number: 9879027
    Abstract: The invention discloses a method for extracting high-purity asarinin and use thereof. The method comprises: putting crude asarum powder in an SFE-CO2 device; under the conditions that an extraction kettle has a pressure of 30-40 Mpa and a temperature of 45-70° C., separating kettles I and II have a pressure of 5-10 Mpa, a temperature of 30-50° C. and the flow rate of CO2 is 35-60 L/h, extracting for 60-240 min to obtain total volatile oil of asarum; standing the total volatile oil of asarum for 24-72 h at a low temperature, and carrying out suction filtration under reduced pressure to obtain crude asarinin; and re-crystallizing the crude asarinin in absolute ethanol twice to obtain pure asarinin. It is found for the first time that asarinin has a good cough-relieving activity and thus can be used in preparing medicines for treating various types of coughs.
    Type: Grant
    Filed: April 23, 2017
    Date of Patent: January 30, 2018
    Inventors: Kefang Lai, Xiaodong Liu, Bonian Zhong, Shan Zhong, Chuqin Huang
  • Publication number: 20170283428
    Abstract: The invention discloses a method for extracting high-purity asarinin and use thereof. The method comprises: putting crude asarum powder in an SFE-CO2 device; under the conditions that an extraction kettle has a pressure of 30-40 Mpa and a temperature of 45-70° C., separating kettles I and II have a pressure of 5-10 Mpa, a temperature of 30-50° C. and the flow rate of CO2 is 35-60 L/h, extracting for 60-240 min to obtain total volatile oil of asarum; standing the total volatile oil of asarum for 24-72 h at a low temperature, and carrying out suction filtration under reduced pressure to obtain crude asarinin; and re-crystallizing the crude asarinin in absolute ethanol twice to obtain pure asarinin. It is found for the first time that asarinin has a good cough-relieving activity and thus can be used in preparing medicines for treating various types of coughs.
    Type: Application
    Filed: April 23, 2017
    Publication date: October 5, 2017
    Applicant: GUANGZHOU INSTITUTE OF RESPIRATORY DISEASE
    Inventors: Kefang LAI, Xiaodong LIU, Bonian ZHONG, Shan ZHONG, Chuqin HUANG
  • Publication number: 20170229438
    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations of interconnect structures having a polymer core in integrated circuit (IC) package assemblies. In one embodiment, an apparatus includes a first die having a plurality of transistor devices disposed on an active side of the first die and a plurality of interconnect structures electrically coupled with the first die, wherein individual interconnect structures of the plurality of interconnect structures have a polymer core, and an electrically conductive material disposed on the polymer core, the electrically conductive material being configured to route electrical signals between the transistor devices of the first die and a second die. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: February 17, 2017
    Publication date: August 10, 2017
    Inventors: Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson