Patents by Inventor Shan Zhong

Shan Zhong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9629869
    Abstract: The present invention relates to a new application of Fructus schisandrae total polysaccharides in preparation of medicine or nutraceuticals for treating coughing, and more specifically to a new application of Fructus schisandrae total polysaccharides in preparation of medicine or nutraceuticals for preventing and relieving coughing and eliminating airway inflammation. Experiments demonstrate that the Fructus schisandrae total polysaccharides can remarkably reduce the coughing times of a guinea pig with increased cough sensitivity induced by cigarette smoke and an acute cough guinea pig induced by citric acid smoke, prolong the latent period of cough, and significantly reduce the airway inflammation of the guinea pig with increased cough susceptibility induced by cigarette smoke, so that the Fructus schisandrae total polysaccharides can be used for preparing drugs for preventing cough, relieving cough and eliminating airway inflammation.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: April 25, 2017
    Inventors: Kefang Lai, Shan Zhong, Zhenyong Gan, Xiaodong Liu, Yichu Nie, Nanshan Zhong
  • Patent number: 9613934
    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations of interconnect structures having a polymer core in integrated circuit (IC) package assemblies. In one embodiment, an apparatus includes a first die having a plurality of transistor devices disposed on an active side of the first die and a plurality of interconnect structures electrically coupled with the first die, wherein individual interconnect structures of the plurality of interconnect structures have a polymer core, and an electrically conductive material disposed on the polymer core, the electrically conductive material being configured to route electrical signals between the transistor devices of the first die and a second die. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: April 4, 2017
    Assignee: INTEL CORPORATION
    Inventors: Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson
  • Publication number: 20170056431
    Abstract: The present invention relates to a new application of Fructus schisandrae total polysaccharides in preparation of medicine or nutraceuticals for treating coughing, and more specifically to a new application of Fructus schisandrae total polysaccharides in preparation of medicine or nutraceuticals for preventing and relieving coughing and eliminating airway inflammation. Experiments demonstrate that the Fructus schisandrae total polysaccharides can remarkably reduce the coughing times of a guinea pig with increased cough sensitivity induced by cigarette smoke and an acute cough guinea pig induced by citric acid smoke, prolong the latent period of cough, and significantly reduce the airway inflammation of the guinea pig with increased cough susceptibility induced by cigarette smoke, so that the Fructus schisandrae total polysaccharides can be used for preparing drugs for preventing cough, relieving cough and eliminating airway inflammation.
    Type: Application
    Filed: November 15, 2016
    Publication date: March 2, 2017
    Inventors: Kefang Lai, Shan Zhong, Zhenyong Gan, Xiaodong Liu, Yichu Nie, Nanshan Zhong
  • Publication number: 20170025392
    Abstract: Package assemblies for and methods of packaging integrated circuit chips are described. Disclosed package assemblies have spacers and recessed regions comprising IC chips. Architectural structures are provided that enable, for example, three dimensional (3D) packaging (or system in package (SiP) or multi-chip modules), systems-on-chip 3D packaging, and hybrid 3D bonding. Embodiments of the invention can be used, for example, to create logic-to-memory, memory-to-memory, and logic-to-logic interface stacking assemblies.
    Type: Application
    Filed: October 7, 2016
    Publication date: January 26, 2017
    Inventors: Weng Hong Teh, John S. GUZEK, Shan ZHONG
  • Publication number: 20160360978
    Abstract: This application discloses a potable, easy-to-use miniature cardiovascular sensor that is capable of monitoring heart rate, blood flow and blood pressure 24/7, using optical non-invasive method. It utilizes interferometric detection to improve signal to noise ratio. It also utilizes phase controlled focusing beam to reduce the optical power needed and therefore minimizing the power consumption, making it practical for continuous monitoring. The integrated optical chip assembly shrinks the total sensor size and makes it suitable for wearable devices, hence, this device will be portable and removable.
    Type: Application
    Filed: May 4, 2016
    Publication date: December 15, 2016
    Applicant: Omnisensing Photonics LLC
    Inventors: Wei Chen, Jin Zhang, Shan Zhong, Zhonghua Zhu
  • Publication number: 20160339054
    Abstract: The present invention discloses an Asarum total polysaccharide extract with antitussive activity, an extraction method thereof and an application in the preparation of a medicine for preventing and treating coughs. The present invention proves that the Asarum total polysaccharide extract has a significant effect of suppressing cough for the first time through a large number of pharmacodynamic tests, has the therapeutic effect approximate to codeine, has the effect of prolonging the cough latent period better than codeine, and also finds that the total Asarum polysaccharide extract has the effects of reducing the cough sensitivity and suppressing the airway inflammation for the first time, has excellent preventive and therapeutic effects on various types of coughs, and can be used for preparing the medicines for preventing and treating cough-related diseases.
    Type: Application
    Filed: March 25, 2015
    Publication date: November 24, 2016
    Applicants: THE FIRST AFFILIATED HOSPITAL OF GUANGZHOU MEDICAL UNIVERSITY, GUANGZHOU INSTITUTE OF RESPIRATORY DISEASE
    Inventors: Kefang LAI, Xiaodong LIU, Bonian ZHONG, Shan ZHONG, Yichu NIE
  • Patent number: 9490196
    Abstract: Package assemblies for and methods of packaging integrated circuit chips are described. Disclosed package assemblies have spacers and recessed regions comprising IC chips. Architectural structures are provided that enable, for example, three dimensional (3D) packaging (or system in package (SiP) or multi-chip modules), systems-on-chip 3D packaging, and hybrid 3D bonding. Embodiments of the invention can be used, for example, to create logic-to-memory, memory-to-memory, and logic-to-logic interface stacking assemblies.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: November 8, 2016
    Assignee: Intel Corporation
    Inventors: Weng Hong Teh, John S. Guzek, Shan Zhong
  • Publication number: 20160306518
    Abstract: The present invention is applicable to the field of terminal technologies, and provides a processing method and apparatus, and a terminal. The method includes: acquiring a sensing position on a sensitive screen of a screen; acquiring, according to the acquired sensing position on the sensitive screen and a preset correspondence between a sensing position on the sensitive screen and a display position on the screen, a display position, corresponding to the acquired sensing position on the sensitive screen, on the screen; displaying, when the display position is located in an operable area displayed on the screen, a touch button at the sensing position, corresponding to the operable area displayed on the screen, on the sensitive screen; and receiving an operation instruction for the touch button, where the operation instruction is used to instruct to perform an operation on the operable area.
    Type: Application
    Filed: December 3, 2013
    Publication date: October 20, 2016
    Inventors: Zhiqing Liao, Shan Zhong, Zhaojie Xia, Lifu Xu
  • Patent number: 9435957
    Abstract: A demultiplexer includes an input optical link to receive an input signal. A grating receives the input signal from the input optical link and generates individual optical wavelength signals. A mirror array operative as a beam steering engine receives the individual optical wavelength signals and redirects them to the grating. Output optical links receive the individual optical wavelength signals from the grating.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: September 6, 2016
    Assignee: Coadna Photonics Inc.
    Inventors: Shan Zhong, Shijun (Shawn) Xiao
  • Patent number: 9299660
    Abstract: A process of bumping a die backside includes opening a recess in a die backside film (DBF) to expose a through-silicon via (TSV) contact in a die, followed by filling the recess with a conductive material that contacts the TSV contact. Added solder is coupled to the conductive material at a level of the DBF. A subsequent die is coupled to the first die at the added solder to form an electrical coupling consisting of the TSV contact, the conductive material, and the added solder, an electrical bump coupled to the subsequent die. Apparatus and computer systems are assembled using the process.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: March 29, 2016
    Assignee: Intel Corporation
    Inventors: Weng Hong Teh, Shan Zhong
  • Publication number: 20160037038
    Abstract: An information processing method applied to a terminal, where the method includes acquiring existing photographing status information; generating notification information according to the existing photographing status information; outputting the notification information, so that a user adjusts a photographing status of the terminal according to the notification information. In addition, the embodiments of the present disclosure further provide a terminal. The method and the terminal can help a user acquire a better photographing result.
    Type: Application
    Filed: October 9, 2015
    Publication date: February 4, 2016
    Inventors: Zhaojie Xia, Shan Zhong, Zhiqing Liao, Lifu Xu
  • Publication number: 20150162313
    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations of interconnect structures having a polymer core in integrated circuit (IC) package assemblies. In one embodiment, an apparatus includes a first die having a plurality of transistor devices disposed on an active side of the first die and a plurality of interconnect structures electrically coupled with the first die, wherein individual interconnect structures of the plurality of interconnect structures have a polymer core, and an electrically conductive material disposed on the polymer core, the electrically conductive material being configured to route electrical signals between the transistor devices of the first die and a second die. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: February 13, 2015
    Publication date: June 11, 2015
    Inventors: Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson
  • Publication number: 20150098700
    Abstract: A system has a first rack with a first set of servers and a first top of rack switch and a second rack with a second set of servers and a second top of rack switch. A first optical switch is connected to the first top of rack switch. A second optical switch is connected to the second top of rack switch and the first optical switch. The first optical switch and the second optical switch each employ wavelength selective switching.
    Type: Application
    Filed: October 3, 2014
    Publication date: April 9, 2015
    Applicant: Coadna Photonics Inc.
    Inventors: Zhonghua Zhu, Shan Zhong
  • Patent number: 8987918
    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations of interconnect structures having a polymer core in integrated circuit (IC) package assemblies. In one embodiment, an apparatus includes a first die having a plurality of transistor devices disposed on an active side of the first die and a plurality of interconnect structures electrically coupled with the first die, wherein individual interconnect structures of the plurality of interconnect structures have a polymer core, and an electrically conductive material disposed on the polymer core, the electrically conductive material being configured to route electrical signals between the transistor devices of the first die and a second die. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: March 24, 2015
    Assignee: Intel Corporation
    Inventors: Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson
  • Publication number: 20150054630
    Abstract: A remote controller and an information processing method and system, which relate to the field of electronic technologies and can improve user experience, where the remote controller is easy to carry. The remote controller includes a remote control main body, where the remote control main body is a wearable ring body; a sensor configured to detect a signal generated by an operation gesture input by a user; a processor, where the processor is connected to the sensor, and is configured to analyze the signal generated by the operation gesture, and generate a corresponding control signal according to an analysis result; and a first wireless communications module, connected to the processor, and configured to send the control signal to a terminal device, so that the terminal device performs a corresponding operation according to the control signal.
    Type: Application
    Filed: September 23, 2014
    Publication date: February 26, 2015
    Inventors: Lifu Xu, Shan Zhong, Zhaojie Xia
  • Publication number: 20150001736
    Abstract: Die connections are described using different underfill types for different regions. In one example, a first electrically-non-conductive underfill paste (NCP) type is applied to an I/O region of a first die. A second NCP type is applied outside the I/O region of the first die, the second NCP type having more filler than the first NCP type, and the second die is bonded to a first die using the NCP.
    Type: Application
    Filed: June 29, 2013
    Publication date: January 1, 2015
    Inventors: Hualiang Shi, Shengquan Ou, Sairam Agraharam, Shan Zhong, Sivakumar Nagarajan, Weihua Tang
  • Publication number: 20140264910
    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations of interconnect structures having a polymer core in integrated circuit (IC) package assemblies. In one embodiment, an apparatus includes a first die having a plurality of transistor devices disposed on an active side of the first die and a plurality of interconnect structures electrically coupled with the first die, wherein individual interconnect structures of the plurality of interconnect structures have a polymer core, and an electrically conductive material disposed on the polymer core, the electrically conductive material being configured to route electrical signals between the transistor devices of the first die and a second die. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventors: Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson
  • Patent number: 8731125
    Abstract: The present invention discloses a method and apparatus for aligning the phases of a master clock and a slave clock; and the method comprises the following steps: A. locking a phase of a master clock; B. measuring phase difference between a slave clock and the master clock; and C. adjusting a phase output by the slave clock so as to align it with the phase of the master clock based on the phase difference measured in Step B. The present invention also discloses an apparatus for aligning the phases of a master clock and a slave clock. By measuring the phase difference between the master clock and the slave clock, and aligning the phases of the master clock and the slave clock according to the phase difference the present invention improves the precision of phase alignment without increasing costs.
    Type: Grant
    Filed: September 2, 2009
    Date of Patent: May 20, 2014
    Assignee: ZTE Corporation
    Inventor: Shan Zhong
  • Publication number: 20140115450
    Abstract: This application provides a method and system of evidence preservation for digital documents. The method comprises: converting, by a client, the digital document to a document code, which is uniquely corresponding to the digital document; uploading, from the client, the document code and first attribute information of the client to a server, wherein the first attribute information includes user information and geographical position information of the client; and incorporating, by the server, second attribute information into the document code and the first attribute information to form a code file, and preserving the code file in a code file database of the server, wherein the second attribute information includes time information indicating when the document code is received by the server; wherein when contents of the digital document are changed, contents of the document code are changed accordingly.
    Type: Application
    Filed: December 23, 2011
    Publication date: April 24, 2014
    Applicant: DOMINATOR IP CO., LTD.
    Inventors: Shan Zhong, Yaou Li, Di Li, Dalong Shi, Peng Wang, HuiChung Che, Hsiangshuai Wu
  • Patent number: 8598479
    Abstract: An electronic device includes a switch, a housing, a button, and an elastic element. The housing includes a cover and a sidewall enclosing the cover. The sidewall defines a receiving hole. The button is received in the receiving hole. The elastic element includes a base, a resisting portion, and an angled elastic arm connecting the resisting portion to the base. The resisting portion abuts against the button. The base is fixed to the cover. The elastic arm deflects when the button is pushed by an external force to actuate the switch, and rebounds to cause the button to move back when the external force has ceased.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: December 3, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Tong-You Quan, Hai-Shan Zhong