Patents by Inventor Shang-Ying Tsai

Shang-Ying Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS devices and methods of forming the same
    Patent number: 8853801
    Abstract: A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.
    Type: Grant
    Filed: April 19, 2012
    Date of Patent: October 7, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shang-Ying Tsai, Jung-Huei Peng, Hsin-Ting Huang, Yao-Te Huang, Lung Yuan Pan, Hung-Hua Lin
  • GYROSCOPE SENSORS
    Publication number: 20140283369
    Abstract: A method of forming a structure for a gyroscope sensor includes forming a first dielectric over a substrate and a material layer over the first dielectric layer. A first portion of the material layer is removed to form a recess and a second portion of the material layer is removed to define a first channel between a gyro disk and a frame. A second channel is formed in the substrate corresponding to the first channel, and a portion of the first dielectric is removed to form a second dielectric between the gyro disk and the substrate.
    Type: Application
    Filed: June 10, 2014
    Publication date: September 25, 2014
    Inventors: Ting-Hau WU, Chun-Ren CHENG, Jiou-Kang LEE, Jung-Huei PENG, Shang-Ying TSAI
  • Systems and methods for post-bonding wafer edge seal
    Patent number: 8841201
    Abstract: A method for fabricating a semiconductor device is disclosed. A first substrate is arranged over a second substrate. A wafer bonding process is performed on the semiconductor device. First regions of the device are enclosed by the bonding process. Second regions of the device remain exposed. One or more processes are performed on the exposed second regions, after performing the wafer bonding process. The one or more processes include a fill process that forms a fill material within the exposed second regions. An edge seal material is applied on the first and second substrates after performing the one or more processes.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: September 23, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Chuan Teng, Jung-Huei Peng, Shang-Ying Tsai, Hsin-Ting Huang, Lin-Min Hung, Yao-Te Huang, Chin-Yi Cho
  • MEMS Device and Method of Formation Thereof
    Publication number: 20140248730
    Abstract: The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (MEMS) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate. The bonding site is recessed from the first surface. Thus, a top surface of the bond pad may lie below the plane of the top surface of the substrate. A device with recessed connective element(s) (e.g., bond pad) is also described. In further embodiments, a protective layer is formed on the recessed connective element during dicing of a substrate.
    Type: Application
    Filed: October 18, 2013
    Publication date: September 4, 2014
    Inventors: Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang, Ming-Tung Wu, Ping-Yin Liu, Xin-Hua Huang, Yuan-Chih Hsieh
  • Method and Apparatus for a Wafer Seal Ring
    Publication number: 20140220735
    Abstract: A wafer seal ring may be formed on a wafer having a pattern structure with a pattern density. The wafer seal ring pattern structure may include a plurality of lines having a width and a spacing that may be approximately equal to a width and a spacing of die bond rings on the wafer. The wafer having the wafer seal ring formed thereon may be bonded to a wafer that may not have a wafer seal ring. A pair of wafers may be formed with respective wafer seal rings formed in a corresponding manner. The pair of wafers may be bonded together with the wafer seal rings aligned and bonded together to form a seal ring structure between the bonded wafers.
    Type: Application
    Filed: February 5, 2013
    Publication date: August 7, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Chuan Teng, Jung-Huei Peng, Shang-Ying Tsai, Hsin-Ting Huang, Li-Min Hung, Yao-Te Huang, Chin-Yi Cho
  • SENSOR WITH ENERGY-HARVESTING DEVICE
    Publication number: 20140208580
    Abstract: A method of fabricating a device includes forming a moveable plate over a substrate, and forming an energy harvesting coil in the moveable plate. The method further includes forming at least one connector connecting the movable plate with the energy harvesting coil, wherein a portion of the energy harvesting coil extends along the at least one connector. The method further includes forming electrodes around the moveable plate, the electrodes adapted to sense motion of the moveable plate.
    Type: Application
    Filed: March 28, 2014
    Publication date: July 31, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tien-Kan CHUNG, Wen-Chuan TAI, Yao-Te HUANG, Hsin-Ting HUANG, Shang-Ying TSAI, Chang-Yi YANG, Chia-Ming HUNG
  • Gyroscope sensors
    Patent number: 8776600
    Abstract: A gyroscope sensor includes a gyro disk. A first light source is configured to provide a first light beam. A first light receiver is configured to receive the first light beam for sensing a vibration at a first direction of the gyro disk. A second light source is configured to provide a second light beam substantially parallel with the first light beam. A second light receiver is configured to receive the second light beam for sensing a vibration in a second direction of the gyro disk. The second direction is different from the first direction.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: July 15, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng, Shang-Ying Tsai
  • PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
    Publication number: 20140170849
    Abstract: A method of forming a package system includes providing a first substrate having a metallic pad and at least one metallic guard ring. The method further includes bonding the metallic pad of the first substrate with a semiconductor pad of a second substrate, wherein the at least one metallic guard ring is configured to at least partially interact with the semiconductor pad to form at least a first portion of an electrical bonding material between the first and second substrates.
    Type: Application
    Filed: February 5, 2014
    Publication date: June 19, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Pao SHU, Chun-wen CHENG, Kuei-Sung CHANG, Hsin-Ting HUANG, Shang-Ying TSAI, Jung-Huei PENG
  • Method to prevent metal pad damage in wafer level package
    Patent number: 8735260
    Abstract: The present disclosure provide a method of manufacturing a microelectronic device. The method includes forming a bonding pad on a first substrate; forming wiring pads on the first substrate; forming a protection material layer on the first substrate, on sidewalls and top surfaces of the wiring pads, and on sidewalls of the bonding pad, such that a top surface of the bonding pad is at least partially exposed; bonding the first substrate to a second substrate through the bonding pad; opening the second substrate to expose the wiring pads; and removing the protection material layer.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: May 27, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shang-Ying Tsai, Jung-Huei Peng, Hsin-Ting Huang, Hung-Hua Lin, Ming-Tung Wu, Ping-Yin Liu, Yao-Te Huang, Yuan-Chih Hsieh
  • Sensor with energy-harvesting device
    Patent number: 8723343
    Abstract: In some embodiments of the present disclosure, a sensor comprises a substrate, a sensor element and an energy-harvesting device. The sensor element comprises a plate, and the plate is moveable with respect to the substrate. The energy-harvesting device is formed on the plate of the sensor element.
    Type: Grant
    Filed: March 14, 2011
    Date of Patent: May 13, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tien-Kan Chung, Wen-Chuan Tai, Yao-Te Huang, Hsin-Ting Huang, Shang-Ying Tsai, Chang-Yi Yang, Chia-Ming Hung
  • Bonding layer structure and method for wafer to wafer bonding
    Patent number: 8686571
    Abstract: A structure comprises a first semiconductor substrate, a first bonding layer deposited on a bonding side the first semiconductor substrate, a second semiconductor substrate stacked on top of the first semiconductor substrate and a second bonding layer deposited on a bonding side of the second semiconductor substrate, wherein the first bonding layer is of a horizontal length greater than a horizontal length of the second semiconductor substrate, and wherein there is a gap between an edge of the second bonding layer and a corresponding edge of the second semiconductor substrate.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: April 1, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang, Yi-Chuan Teng, Chin-Yi Cho
  • Package systems having a eutectic bonding material and manufacturing methods thereof
    Patent number: 8674495
    Abstract: A package system includes a first substrate. A second substrate is electrically coupled with the first substrate. At least one electrical bonding material is disposed between the first substrate and the second substrate. The at least one electrical bonding material includes a eutectic bonding material. The eutectic bonding material includes a metallic material and a semiconductor material. The metallic material is disposed adjacent to a surface of the first substrate. The metallic material includes a first pad and at least one first guard ring around the first pad.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: March 18, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Pao Shu, Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai, Jung-Huei Peng
  • BONDING LAYER STRUCTURE AND METHOD FOR WAFER TO WAFER BONDING
    Publication number: 20140042625
    Abstract: A structure comprises a first semiconductor substrate, a first bonding layer deposited on a bonding side the first semiconductor substrate, a second semiconductor substrate stacked on top of the first semiconductor substrate and a second bonding layer deposited on a bonding side of the second semiconductor substrate, wherein the first bonding layer is of a horizontal length greater than a horizontal length of the second semiconductor substrate, and wherein there is a gap between an edge of the second bonding layer and a corresponding edge of the second semiconductor substrate.
    Type: Application
    Filed: August 9, 2012
    Publication date: February 13, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang, Yi-Chuan Teng, Chin-Yi Cho
  • Method of fabricating a semiconductor device having recessed bonding site
    Patent number: 8580594
    Abstract: The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (MEMS) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate. The bonding site is recessed from the first surface. Thus, a top surface of the bond pad may lie below the plane of the top surface of the substrate. A device with recessed connective element(s) (e.g., bond pad) is also described. In further embodiments, a protective layer is formed on the recessed connective element during dicing of a substrate.
    Type: Grant
    Filed: August 9, 2011
    Date of Patent: November 12, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang, Ming-Tung Wu, Ping-Yin Liu, Xin-Hua Huang, Yuan-Chih Hsieh
  • MEMS Devices and Methods of Forming the Same
    Publication number: 20130277770
    Abstract: A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.
    Type: Application
    Filed: April 19, 2012
    Publication date: October 24, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shang-Ying Tsai, Jung-Huei Peng, Hsin-Ting Huang, Yao-Te Huang, Lung Yuan Pan, Hung-Hua Lin
  • Laser bonding for stacking semiconductor substrates
    Patent number: 8563400
    Abstract: Methods and structures using laser bonding for stacking semiconductor substrates are described. In one embodiment, a method of forming a semiconductor device includes forming a trench in a first substrate, and a bond pad on a second substrate comprising active circuitry. A top surface of the bond pad includes a first material. The first substrate is aligned over the second substrate to align the trench over the bond pad. An electromagnetic beam is directed into the trench to form a bond between the first material on the bond pad and a second material at a bottom surface of the first substrate.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: October 22, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai, Jung-Huei Peng
  • Method for reducing chip warpage
    Patent number: 8455999
    Abstract: A method of forming an integrated circuit structure including providing a wafer comprising a front surface and a back surface, wherein the wafer comprises a chip; forming an opening extending from the back surface into the chip; filling an organic material in the opening, wherein substantially no portion of the organic material is outside of the opening and on the back surface of the wafer; and baking the organic material to cause a contraction of the organic material.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: June 4, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai, Jung-Huei Peng
  • Method and structure for wafer to wafer bonding in semiconductor packaging
    Patent number: 8377798
    Abstract: A method for wafer to wafer bonding in semiconductor packaging provides for roughening the bonding surfaces in one embodiment. Also provided is a method for passivating the bonding surfaces with a lower melting point material that becomes forced away from the bonding interface during bonding. Also provided is a method for forming an eutectic at the bonding interface to reduce the impact of any native oxide formation at the bonding interface.
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: February 19, 2013
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Jung-Huei Peng, Hsin-Ting Huang, Yao-Te Huang, Shang-Ying Tsai, Ping-Yin Liu
  • MEMS DEVICE AND METHOD OF FORMATION THEREOF
    Publication number: 20130037891
    Abstract: The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (MEMS) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate. The bonding site is recessed from the first surface. Thus, a top surface of the bond pad may lie below the plane of the top surface of the substrate. A device with recessed connective element(s) (e.g., bond pad) is also described. In further embodiments, a protective layer is formed on the recessed connective element during dicing of a substrate.
    Type: Application
    Filed: August 9, 2011
    Publication date: February 14, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd., ("TSMC")
    Inventors: Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang, Ming-Tung Wu, Ping-Yin Liu, Xin-Hua Huang, Yuan-Chih Hsieh
  • Laser bonding for stacking semiconductor substrates
    Patent number: 8367516
    Abstract: Methods and structures using laser bonding for stacking semiconductor substrates are described. In one embodiment, a method of forming a semiconductor device includes forming a trench in a first substrate, and a bond pad on a second substrate comprising active circuitry. A top surface of the bond pad includes a first material. The first substrate is aligned over the second substrate to align the trench over the bond pad. An electromagnetic beam is directed into the trench to form a bond between the first material on the bond pad and a second material at a bottom surface of the first substrate.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: February 5, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai, Jung-Huei Peng