Abstract: A camera device with image compensation and autofocus function, comprising a first carrying member, a second carrying member, a camera module, a first optical compensation component, a third carrying member, and an autofocus component. The second carrying member is movably assembled to the first carrying member. The first optical compensation component comprises a first force interaction member disposed at the first carrying member and a second force interaction member disposed at the second carrying member, which generate force interaction, allowing the second carrying member to move in the direction of a first axis or/and a second axis intersecting with an optical axis of the optical lens for optical compensation for the optical lens. The third carrying member bears the optical lens and is movably disposed on the second carrying member. The third carrying member could move along an optical axis of the optical lens.

Abstract: In the embodiments of the present disclosure, additive manufacturing devices and methods are provided. The additive manufacturing device includes a light source, a building device, and a light scattering member. The light source is configured to provide light to cure photocurable resins. The building device includes a resin tank configured to store the photocurable resins. The building device has a building surface on which the photocurable resins are cured. The light scattering member is arranged between the light source and the building surface. The light scattering member is configured to alter a light propagation direction of the light from the light source to cause an inner-pixel light intensity change on the building surface.

Abstract: A planarization tool is configured to monitor one or more operational parameters of the planarization tool. The planarization tool may include a superconductor-based monitoring system that is configured to monitor a thickness of a layer on a semiconductor wafer that is processed by the planarization tool. The superconductor-based monitoring system may include a superconductor-based sensor that is configured to generate a signal that is based on an induced magnetic field through the layer on the semiconductor wafer. The signal may be provided to a controller of the planarization tool. The controller may determine a thickness of the layer based on the signal. The controller may provide one or more control signals to the polishing head to control one or more operational parameters such as a down force of the semiconductor wafer against the polishing pad and/or a rotational speed of the semiconductor wafer against the polishing pad, among other examples.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a redistributed circuit structure, a plurality of chips, a second encapsulant, a plurality of supporting members, a first encapsulant, and a plurality of connection terminals is provided. The redistributed circuit structure has a first surface and a second surface opposite to each other. The chips are disposed on the second surface of the redistributed circuit structure. The second encapsulant is disposed on the second surface of the redistributed circuit structure and covers the chips. The supporting members are disposed on the first surface of the redistributed circuit structure. The first encapsulant is disposed on the first surface of the redistributed circuit structure and covers the supporting members. The connection terminals are connected to the supporting members.

Abstract: A package structure including a redistributed circuit structure, a plurality of chips, a second encapsulant, a plurality of supporting members, a first encapsulant, and a plurality of connection terminals are provided. The redistributed circuit structure has a first surface and a second surface opposite thereto. The chips are disposed on the second surface of the redistributed circuit structure. The second encapsulant is disposed on the second surface of the redistributed circuit structure and covers the chips. The supporting members are disposed on the first surface of the redistributed circuit structure. The first encapsulant is disposed on the first surface of the redistributed circuit structure and covers the supporting members. The connection terminals are connected to the supporting members.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a first package including a first redistribution layer, at least one chip and a second redistribution layer, and at least one second package disposed on the first package and including a substrate, an adhesive layer, at least two optical chips, an encapsulant layer, and a third redistribution layer. The optical chips are attached to a surface of the substrate close to the first package through the adhesive layer, and each optical chip has an optical surface close to the substrate. The encapsulant layer is disposed on the surface and surrounds the optical chips. The third redistribution layer is disposed between the encapsulant layer and the second redistribution layer, in which the second redistribution layer is electrically connected to the optical chips through the third redistribution layer.

Abstract: A voice coil motor assembly including a base, a frame, an elastic sheet, a housing, and a plurality of shock-absorbing components is provided. The frame is disposed on the base. The frame includes a bottom surface, a top surface, a plurality of side walls and a support frame. One side of the elastic sheet is disposed on the top surface of the frame and the other is disposed on the support frame. The housing is disposed above the base to receive the frame and the elastic sheet. The housing includes a housing top wall and a plurality of housing side walls surrounding the housing top wall. The shock-absorbing components are disposed on the frame and are sandwiched between the frame and the housing side walls of the housing, and/or between the support frame and the housing top wall of the housing.

Abstract: A package structure including a first redistribution circuit structure, a chip, a second redistribution circuit structure, a plurality of packages, and a plurality of limiting connectors is provided. The chip is disposed on the first redistribution circuit structure. The second redistribution circuit structure is disposed on the chip. The plurality of packages are disposed on the second redistribution circuit structure. Each of the packages includes an encapsulant. The plurality of limiting connectors are disposed between each of the packages and the second redistribution circuit structure.

Abstract: A chip-middle type fan-out panel-level package (FOPLP) has a routing layer, a polyimide layer formed on the routing layer and having a plurality of pillar openings and a chip opening, a plurality of metal pillars mounted on the routing layer through the corresponding pillar openings, a chip mounted on the first routing layer through the chip opening and a molding compound formed on the polyimide layer to encapsulate the metal pillars and the chip. The polyimide layer is used to control the warpage of the FOPLP. The polyimide layer is formed inside the FOPLP and the chip is directly mounted on the first routing layer through the chip opening, so a height of the FOPLP is not increased when the first PI layer is added.

Abstract: A damper device and an electronic apparatus are provided. The damper device includes a first holder, a first damper component and a first gel. The first damper component includes a first protrusion part and a first bar part. The first protrusion part includes a first surface. The first bar part includes a first free end and a first fixed end. The first protrusion part is fixed on the first free end, the first fixed end is fixed on the first holder and the first surface protrudes outward from the first free end. The first free end and the first protrusion part are inserted into the first gel, and the first gel moves along the radial direction of the first bar part relative to the first bar part.

Abstract: A camera assembly comprises a casing, a light sensing component, and a flexible circuit board. The casing comprises a lens accommodating groove, an housing, and a base on which the housing is disposed. The lens accommodating groove is disposed between the housing and the base. An opening of the lens accommodating groove is disposed at the housing. The light sensing component comprises a light sensing member and a baseplate on which the light sensing member is disposed. The light sensing member is correspondingly disposed at the bottom of the lens accommodating groove. The light sensing component is disposed on the base. The flexible circuit board comprises a first end part, a second end part, and a body part disposed between the first end part and the second end part.

Abstract: A package structure includes a chip and a dielectric. The chip includes a chip connector disposed on an active surface of the chip. The dielectric is at least disposed on the active surface of the chip. The chip connector has a top surface and a side surface connected to the top surface. The dielectric does not directly cover part of the side surface close to the top surface.

Abstract: A floating bridge structure includes a substrate, a floating bridge layer, and at least one support. The floating bridge layer is on the substrate and substantially parallel to an upper surface of the substrate. The support extends on a vertical surface from the substrate to the floating bridge layer, in which the vertical surface is substantially perpendicular to the upper surface of the substrate.

Abstract: A camera device with image compensation and autofocus function, comprising a first carrying member, a second carrying member, a camera module, a first optical compensation component, a third carrying member, and an autofocus component. The second carrying member is movably assembled to the first carrying member. The first optical compensation component comprises a first force interaction member disposed at the first carrying member and a second force interaction member disposed at the second carrying member, which generate force interaction, allowing the second carrying member to move in the direction of a first axis or/and a second axis intersecting with an optical axis of the optical lens for optical compensation for the optical lens. The third carrying member bears the optical lens and is movably disposed on the second carrying member. The third carrying member could move along an optical axis of the optical lens.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A display system and a lens assembly for eliminating color dispersion thereof is disclosed. The lens assembly includes a first concave lens, a circular polarizer, and a magnifying convex lens assembly. The first concave lens has a light-receiving surface and a concave surface opposite to each other. The light-receiving surface is a plane or a convex surface. The circular polarizer may be arranged on the concave surface of the first concave lens to have a curved shape corresponding to the concave surface. The magnifying convex lens assembly is arranged on the circular polarizer through an optical adhesive. The first concave lens, the circular polarizer, and the magnifying convex lens assembly are sequentially arranged along an optical axis. When the light-receiving surface is a convex surface, the circular polarizer is arranged on the light-receiving surface to have a curved surface corresponding to the convex surface.

Abstract: A display system and a lens assembly for eliminating color dispersion thereof is disclosed. The lens assembly includes a first concave lens, a circular polarizer, and a magnifying convex lens assembly. The first concave lens has a light-receiving surface and a concave surface opposite to each other. The light-receiving surface is a plane or a convex surface. The circular polarizer may be arranged on the concave surface of the first concave lens to have a curved shape corresponding to the concave surface. The magnifying convex lens assembly is arranged on the circular polarizer through an optical adhesive. The first concave lens, the circular polarizer, and the magnifying convex lens assembly are sequentially arranged along an optical axis. When the light-receiving surface is a convex surface, the circular polarizer is arranged on the light-receiving surface to have a curved surface corresponding to the convex surface.

Abstract: A method of performing a chemical mechanical planarization (CMP) process includes holding a wafer by a retainer ring attached to a carrier, pressing the wafer against a first surface of a polishing pad, the polishing pad rotating at a first speed, dispensing a slurry on the first surface of the polishing pad, and generating vibrations at the polishing pad.

Abstract: A method of operating a chemical mechanical planarization (CMP) tool includes attaching a polishing pad to a first surface of a platen of the CMP tool using a glue; removing the polishing pad from the platen, wherein after removing the polishing pad, residue portions of the glue remain on the first surface of the platen; identifying locations of the residue portions of the glue on the first surface of the platen using a fluorescent material; and removing the residue portions of the glue from the first surface of the platen.

Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.