Abstract: An anti-twist structure of voice coil motor includes a base, a lens housing, an elastic sheet, a magnet, and a yoke member. The lens housing has a margin wall, and the margin wall has a first protrusion and a contact portion. The elastic sheet has a hollowed slot, and the first protrusion pass through the hollowed slot, so that the elastic sheet is disposed on a portion of the margin wall and on the contact portion. The yoke member has an upper wall and a side wall. The side wall is disposed at one side of the upper wall and the side wall extends outward in a direction not parallel to the upper wall. The yoke member surrounds the lens housing, the elastic sheet, and the magnet. The lens housing has a deflectable angle relative to a horizontal reference line.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An image processing circuit includes a receiver, at least one memory, a recognition circuit, a calculation circuit and a compensation circuit. The receiver is configured to receive a current image frame and a plurality of previous image frames. The at least one memory is configured to store the plurality of previous image frames. The recognition circuit is configured to select a first previous image frame or a second previous image frame among the plurality of previous image frames from the at least one memory. The calculation circuit is configured to calculate a compensation value for the current image frame according to at least one of the first previous image frame and the second previous image frame by referring to a lookup table (LUT). The compensation circuit is configured to modify a current image data of the current image frame by using the compensation value.

Abstract: The present disclosure provides a bolometer including a substrate, a reflecting mirror on the substrate, and a temperature sensing unit above the reflecting mirror. The temperature sensing unit includes a first insulating layer, a thermistor on the first insulating layer, a second insulating layer on the thermistor, an electrode layer in the second insulating layer and right above the thermistor, and a metal meta-surface in the second insulating layer and right above the electrode layer. The electrode layer includes a plurality of electrodes separated from each other. A projection region of the metal meta-surface on the thermistor is equal to or larger than the thermistor.

Abstract: A laser machining device includes a pulsed laser generator, an accommodation chamber, a bandwidth broadening unit and a pulse compression unit. The pulsed laser generator is configured to emit a pulsed laser. The accommodation chamber has a gas inlet. The bandwidth broadening unit is disposed in the accommodation chamber, and is configured to broaden a frequency bandwidth of the pulsed laser to obtain a broad bandwidth pulsed laser. The pulse compression unit is disposed in the accommodation chamber. The bandwidth broadening unit and the pulse compression unit are arranged in order along a laser propagation path, and the pulse compression unit is configured to compress a pulse duration of the broad bandwidth pulsed laser.

Abstract: A laser processing system includes a laser source, an optical splitting unit, a frequency conversion unit and at least one optical mixer. The optical splitting unit is provided to divide light emitted by the laser source into a first light and a second light, and the first light and the second light have the same wavelength range. The frequency conversion unit is provided to convert the second light into a working light. The working light includes a frequency converted light, and the frequency converted light and the second light have different wavelength ranges. The optical mixer is provided to mix the first light with the frequency converted light.

Abstract: A packaging structure including first, second, and third dies, an encapsulant, a circuit structure, and a filler is provided. The encapsulant covers the first die. The circuit structure is disposed on the encapsulant. The second die is disposed on the circuit structure and is electrically connected to the circuit structure. The third die is disposed on the circuit structure and is electrically connected to the circuit structure. The third die has an optical signal transmission area. The filler is disposed between the second die and the circuit structure and between the third die and the circuit structure. A groove is present on an upper surface of the circuit structure. The upper surface includes first and second areas located on opposite sides of the groove. The filler directly contacts the first area. The filler is away from the second area. A manufacturing method of a packaging structure is also provided.

Abstract: The application discloses a reverse virtual screening platform and method based on programmable quantum computing, the method includes the following steps: S1, for a given micromolecule and a target protein molecule, calculating a binding interaction graph of the given micromolecule and the target protein molecule on a computer according to different distances between pharmacophores; S2, encoding, according to an adjacency matrix of the binding interaction graph, the binding interaction graph into a quantum reverse virtual screening platform by decomposing the adjacency matrix; and S3, performing Gaussian boson sampling by the quantum reverse virtual screening platform. The reverse virtual screening platform and method based on programmable quantum computing provided by the present application are implemented by an optical quantum computer system based on a time domain.

Abstract: The present disclosure provides a base assembly of voice coil motor and a voice coil motor. The base assembly includes a base body having a first elastic piece connecting area, a lower elastic piece disposed on the first elastic piece connecting area, and a first terminal disposed in the base body. The first terminal has: a first conductive part disposed in the base body; a first terminal connecting part disposed on one side of the first conductive part and extending toward a direction away from the first conductive part, wherein a part of the first terminal connecting part protrudes from the first elastic piece connecting area and is connected with the lower elastic piece; and an engaging part disposed on one side of the first terminal connecting part and extending toward a direction away from the first terminal connecting part.

Abstract: An optical module includes a first side and a second side, and includes a movable portion, a fixed portion, a driving portion, a position-sensing portion, and a circuit board. The movable portion includes a holder for holding an optical element with an optical axis. The fixed portion includes a base and a circuit component, wherein the circuit component has an external electrical connection portion, and the movable portion is movably connected to the fixed portion. The driving portion is configured to drive the movable portion to move relative to the fixed portion. The position-sensing portion includes a position-sensing element, and the position-sensing element is configured to sense the position of the movable portion relative to the fixed portion.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a redistribution layer, a conductive pillar, an active chip, an encapsulation layer, and another redistribution layer. The conductive pillar and the active chip are side by side disposed on the redistribution layer. The encapsulation layer surrounds the active chip and the conductive pillar, in which the encapsulation layer has a first through hole disposed between the active chip and the redistribution layer and a second through hole disposed between the conductive pillar and the redistribution layer, and a depth of the first through hole is less than a depth of the second through hole. The another redistribution layer is disposed on a side of the redistribution layer away from the redistribution layer and electrically connected to the redistribution layer through the conductive pillar.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a redistribution layer, a conductive element, an active chip, an encapsulation layer, another redistribution layer, and a conductive terminal. The conductive element, the active chip, and the encapsulation layer are disposed on the redistribution layer and the encapsulation layer surrounds the conductive element and the active chip. The another redistribution layer is disposed on the conductive element, the active chip and the encapsulation layer and electrically connected to the redistribution layer through the conductive element.

Abstract: A chip structure has a chip body having a plurality of pads, a plurality of metal bumps respectively formed on the pads, and a patterned bump directly formed on the chip body. The patterned bump has at least two different upper and lower plane patterns. A top surface of each of the metal bumps is higher than a height position on which the upper plane pattern is. When the chip structure is ground to the height position, the ground tops of the metal bumps and the upper plane pattern are flush. Therefore, detecting whether the upper plane pattern is exposed determines whether all the metal bumps are exposed and flush to each other to avoid insufficient grinding depth or over-ground.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a plurality of micro-lens chips arranged at intervals and a coplanar control layer. The coplanar control layer is configured to encapsulate the plurality of micro-lens chips therein. At least one surface of each of the micro-lens chips is exposed outside the coplanar control layer, and the at least one surface of each of the micro-lens chips is coplanar.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a first package and a second package, and the second package is disposed on the first package. The first package includes a first redistribution layer, at least one chip and a second redistribution layer. The chip is disposed between the first redistribution layer and the second redistribution layer. The second package includes a third redistribution layer and at least three light-emitting elements. The third redistribution layer is electrically connected to the second redistribution layer, and the second redistribution layer is disposed between the chip and the third redistribution layer. The light-emitting elements are disposed on the third redistribution layer and electrically connected to the third redistribution layer. Each light-emitting element includes a first surface opposite to the third redistribution layer, and the first surfaces of the light-emitting elements are coplanar.

Abstract: A driving mechanism for an optical element is provided, including a support body, a movable portion, an elastic assembly, and a driving assembly. The movable portion is located in the support body. The movable portion is movable relative to the support body and is used to connect to an optical element. The elastic assembly is movably connected to the support body and the movable portion. The driving assembly is disposed on the support body and the movable portion, and is configured to drive the movable portion to move relative to the support body.

Abstract: The present disclosure provides a base assembly of voice coil motor and a voice coil motor. The base assembly includes a base body having an elastic piece connecting area with a protrusion; a lower elastic piece disposed on the elastic piece connecting area with a first connecting hole, a second connecting hole, and a first trench, the protrusion is exposed from the first connecting hole, and the first trench is disposed between the first connecting hole and the second connecting hole; a connecting piece; and a terminal having a conductive part and a terminal connecting part, wherein the conductive part is disposed in the base body, the terminal connecting part passes through the elastic piece connecting area and protrudes from the elastic piece connecting area, and a part of the terminal connecting part is exposed from the second connecting hole to be fixedly connected to the lower elastic piece.

Abstract: Automation of the comparison of the colors of small surfaces of products. In one embodiment, color differences are measured rather than an absolute color value. An apparatus is provided for capturing color images of a portion of a product or part to provide a sample product image. The sample image is compared to an image of a standard product obtained under the same conditions with the same apparatus. The color difference is measured to determine when it is in a predetermined range.

Abstract: An optical element drive mechanism is provided. The optical element drive mechanism includes an immovable part, a movable part, and a drive assembly. The movable part is movable relative to the immovable part. The movable part holds an optical element with an optical axis. The drive assembly drives the movable part to move relative to the immovable part. At least part of the drive assembly is disposed on the immovable part.

Abstract: A voice coil motor includes a base, a lens housing, a voice coil, a magnet, a first elastic sheet, a second elastic sheet and a yoke member. The lens housing has a first margin wall, and a first protrusion and a second protrusion extend from the first margin wall. The height of the second protrusion is lower than the height of the first protrusion. The yoke member has a first wall, a connection wall, a second wall, and a side wall. The first wall, the connection wall, and the second wall together form a stepped structure. The first wall is disposed on the first protrusion, and the second wall is disposed on the second protrusion. The lens housing has a deflectable angle relative to a horizontal reference line. When the lens housing deflects to a maximum value of the deflectable angle, the second protrusion abuts against the second wall.