Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a movable portion, a fixed portion, a driving assembly and a guiding assembly. The movable portion is configured to connect an optical member, and is movable relative to the fixed portion. The driving assembly is configured to drive the movable portion to move relative to the fixed portion. The guiding assembly is configured to limit the mode of movement for the movable portion relative to the fixed portion. The guiding assembly includes an intermediate element, the intermediate element contacts the fixed portion and is movable relative to the fixed portion. The guiding assembly further includes a first metallic element, the first metallic element includes metal and corresponds to the intermediate element.

Abstract: An infrared sensor includes a substrate, an active pixel array, a reference pixel array, a light absorbing layer, a sidewall spacer, and a shading layer. The active pixel array is over the substrate. The reference pixel is over the substrate, adjacent to the active pixel array, and having a reference pixel. The reference pixel includes a platform, a resistor, and an infrared sensing material layer. The resistor is on the platform. The infrared sensing material layer is over the resistor. The light absorbing layer is over the reference pixel. The sidewall spacer is over the reference pixel and extends along a sidewall of the light absorbing layer. The shading layer is conformally formed over the light absorbing layer and the sidewall spacer.

Abstract: A package structure including a first die, an encapsulant, a first circuit structure, a second circuit structure, a conductive connector, a second die, and a filler is provided. The encapsulant covers the first die and has a first surface and a second surface opposite to each other. The first circuit structure is disposed on the first surface. The second circuit structure is disposed on the second surface. The conductive connector penetrates the encapsulant. The second die is disposed on the second circuit structure. The second die has an optical signal transmission area. The filler is disposed between the second die and the second circuit structure. An upper surface of the second circuit structure has a groove. The upper surface includes a first area and a second area disposed on opposite sides of the groove. The filler directly contacts the first area. The filler is disposed away from the second area.

Abstract: A display device includes a display panel and a processor. The processor is coupled to the display panel. The processor is configured to generate first output data according to first input data and a first compensation value, generate a stress reduction value and a compensation reduction value according to the first input data, calculate a final stress value according to the first output data, at least one first operating factor, and the stress reduction value, calculate a second compensation value according to the final stress value and the compensation reduction value, and output second output data according to second input data, the second compensation value, and at least one second operating factor. The display panel receives the second output data to display according to the second output data.

Abstract: A package device and a manufacturing method thereof are provided. The package device includes a substrate, a plurality of conductive pillars, at least one bridge chip, a photosensitive encapsulation layer, a redistribution layer, and at least two active chips. The conductive pillars and the bridge chip are disposed on the substrate. The photosensitive encapsulation layer surrounds the bridge chip and the conductive pillars, in which a distance between a top surface of the bridge chip and a top surface of the photosensitive encapsulation layer is less than a distance between a top surface of one of the conductive pillars and the top surface of the photosensitive encapsulation layer. The redistribution layer is disposed on the photosensitive encapsulation layer, the active chips are disposed on the redistribution layer, and the bridge chip is coupled between the active chips.

Abstract: A package device and a manufacturing method thereof are provided. The package device includes a substrate, a plurality of conductive pillars, a redistribution layer, at least one bridge chip, at least two active chips, an encapsulant, and an underfill layer. The conductive pillars are disposed on the substrate side by side, the redistribution layer is disposed on the conductive pillars, and the bridge chip is disposed between the substrate and the redistribution layer. The active chips are disposed on the redistribution layer, the bridge chip is coupled between the active chips, and the encapsulant is disposed on the redistribution layer and surrounds the active chips. The underfill layer is disposed between adjacent two of the conductive pillars and between one of the conductive pillars and the bridge chip.

Abstract: A voice coil motor includes a base, a lens housing, a voice coil, a magnet, a first elastic sheet, and a yoke member. The lens housing has a first margin wall, and a first protrusion and a second protrusion extend from the first margin wall. The height of the second protrusion is lower than the height of the first protrusion. The yoke member has a first wall, a connection wall, a second wall, and a side wall. The first wall, the connection wall, and the second wall together form a stepped structure. The first wall is disposed on the first protrusion, and the second wall is disposed on the second protrusion. The lens housing has a deflectable angle relative to a horizontal reference line. When the lens housing deflects to a maximum value of the deflectable angle, the second protrusion abuts against the second wall.

Abstract: The invention provides a color calibration device, a color calibration method and a calibration table generation method. The color calibration device includes a calibration table circuit, a ratio circuit and an image processing circuit. The calibration table circuit provides a selected calibration table including a plurality of zone calibration parameters. Each of the zone calibration parameters corresponds to a corresponding zone among a plurality of zones of a display panel. The ratio circuit calculates a subpixel calibration parameter corresponding to a current subpixel according to at least one of the zone calibration parameters in the selected calibration table. The image processing circuit calibrates original subpixel data of the current subpixel according to the subpixel calibration parameter to generate calibrated subpixel data of the current subpixel.

Abstract: Automation of the comparison of the colors of small surfaces of products. In one embodiment, color differences are measured rather than an absolute color value. An apparatus is provided for capturing color images of a portion of a product or part to provide a sample product image. The sample image is compared to an image of a standard product obtained under the same conditions with the same apparatus. The color difference is measured to determine when it is in a predetermined range.

Abstract: A camera device comprises an image sensor, a first moving module and two groups of second moving modules. The first moving module is connected to the image sensor. The first moving module is activated to move the image sensor linearly along a first axis. The second moving module is connected to the image sensor. The second moving module is activated to move the image sensor linearly along a second axis, which intersects with the first axis. The two groups of second moving modules are activated simultaneously to rotate the image sensor around a third axis, which is orthogonal to the first and second axes, respectively. The image sensor compensates for the image by linear movement in the direction of the first axis and the second axis and can also compensate for the image by rotation in the direction of the third axis to achieve three-axis image stabilization.

Abstract: A method of operating a chemical mechanical planarization (CMP) tool includes attaching a polishing pad to a first surface of a platen of the CMP tool using a glue; removing the polishing pad from the platen, wherein after removing the polishing pad, residue portions of the glue remain on the first surface of the platen; identifying locations of the residue portions of the glue on the first surface of the platen using a fluorescent material; and removing the residue portions of the glue from the first surface of the platen.

Abstract: A method of extracting parasitic parameters of a 3D IC is provided in the present invention, including steps of providing a 3D IC having multiple dies, merging respective layouts of the multiple dies into a common layout, creating a common LVS file and a common LPE file for those multiple dies based on the common layout, creating respective LVS files and respective LPE files for every die based on the respective layouts, creating a common netlist from the common LVS file and common LPE file, creating corresponding respective netlists from the respective LVS files and respective LPE files, merging the common netlist and respective netlists into a netlist, and extracting common parasitic parameters of the dies from the netlist.

Abstract: In the embodiments of the present disclosure, additive manufacturing devices and methods are provided. The additive manufacturing device includes a light source, a building device, and a light scattering member. The light source is configured to provide light to cure photocurable resins. The building device includes a resin tank configured to store the photocurable resins. The building device has a building surface on which the photocurable resins are cured. The light scattering member is arranged between the light source and the building surface. The light scattering member is configured to alter a light propagation direction of the light from the light source to cause an inner-pixel light intensity change on the building surface.

Abstract: A method of performing a chemical mechanical planarization (CMP) process includes holding a wafer by a retainer ring attached to a carrier, pressing the wafer against a first surface of a polishing pad, the polishing pad rotating at a first speed, dispensing a slurry on the first surface of the polishing pad, and generating vibrations at the polishing pad.

Abstract: A chip-middle type fan-out panel-level package (FOPLP) has a routing layer, a polyimide layer formed on the routing layer and having a plurality of pillar openings and a chip opening, a plurality of metal pillars mounted on the routing layer through the corresponding pillar openings, a chip mounted on the first routing layer through the chip opening and a molding compound formed on the polyimide layer to encapsulate the metal pillars and the chip. The polyimide layer is used to control the warpage of the FOPLP. The polyimide layer is formed inside the FOPLP and the chip is directly mounted on the first routing layer through the chip opening, so a height of the FOPLP is not increased when the first PI layer is added.

Abstract: Provided is an integrated antenna package structure including a chip, a circuit structure, a shielding body, an encapsulant, a first antenna layer, a dielectric body, and a second antenna layer. The circuit structure is electrically connected to the chip. The shielding body is disposed on the circuit structure and has an accommodating space. The chip is disposed in the accommodating space of the shielding body. The encapsulant is disposed on the circuit structure and covers the chip. The first antenna layer is disposed on the circuit structure and is electrically connected to the circuit structure. The dielectric body is disposed on the encapsulant. The second antenna layer is disposed on the dielectric body. A manufacturing method of the integrated antenna package structure is also provided.

Abstract: The present disclosure provides a camera device with optical image stabilization, comprising: a base, a first carrying member, a camera module, a first optical compensating component, a second optical compensating component, and a guiding component. The first carrying member is slidably assembled to the base. The second carrying member is movably assembled to the first carrying member. The first force interaction member and the second force interaction member are configured to be force-interacted. The second optical compensating component comprises a third force interaction member disposed on the base and a fourth force interaction member disposed on the first carrying member. The guiding component is connected with the base and the first carrying member. The third force interaction member and the fourth force interaction member are configured to be force-interacted.

Abstract: The present disclosure provides a camera device and a long tuning range camera assembly. The camera device comprises a frame body, a circuit component, a carrying component, and a magnetic conductive sheet. The frame body comprises an accommodating space. The circuit component comprises a circuit board, a magnetic sensing element, and a coil. The carrying component comprises a main body, a driving magnet, and a sensing magnet. Wherein the magnetic sensing element is configured to magnetically sense the sensing magnet to generate a specific signal, which comprises an angle between the sensing magnet and the magnetic sensing element or/and a position of the main body relative to the frame body. The long tuning range camera assembly comprises two sets of camera devices.

Abstract: A semiconductor package comprising plurality of bumps and fabricating method thereof. The package has a chip, a plurality of first and second bumps, an encapsulation, a redistribution. The chip has a plurality of pads and an active area and the active surface has a first area and a second area surrounding the first, the pads formed on a first area of the active surface, each first bump formed on the corresponding pad. The second bumps are formed on the second area, each second bump has first and second different width layers. The encapsulation encapsulates the chip and bumps and is ground to expose the bumps therefrom. During grinding, all of the first bumps are completely exposed by determining a width of an exposed surface of the second bump to electrically connect to the redistribution is increased. Therefore, a shallow-grinding or over-grinding does not occur.

Abstract: An optical element driving mechanism is provided, including a fixed portion, a movable portion, a driving assembly, and a connecting assembly. The fixed portion includes a base and a case. The movable portion is movable relative to the fixed portion and is used for connecting an optical element. The driving assembly is disposed between the fixed portion and the movable portion for moving the movable portion relative to the fixed portion. The connecting assembly is disposed between the fixed portion and the movable portion.