Patents by Inventor Shanger Wang

Shanger Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060041075
    Abstract: Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.
    Type: Application
    Filed: September 19, 2005
    Publication date: February 23, 2006
    Inventors: John Kerr, Shanger Wang, Jun Hou, Steven Sloop, Yong Han, Gao Liu
  • Patent number: 6956083
    Abstract: Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: October 18, 2005
    Assignee: The Regents of the University of California
    Inventors: John Borland Kerr, Shanger Wang, Yong Bong Han, Gao Liu, Jun Hou, Steven Edward Sloop
  • Publication number: 20050092680
    Abstract: The present invention relates to a process for the purification of silicone containing compounds via supercritical fluid extraction. Specifically, the present invention relates to a process comprising the steps of contacting at least one silicone containing compound with a supercritical fluid having a density of between about 0.2 and about 0.8 g/ml, decreasing said density so that two phases are formed a first phase comprising said at least one silicone containing compound and a second phase comprising at least one impurity and separating said second phase from said first phase.
    Type: Application
    Filed: October 31, 2003
    Publication date: May 5, 2005
    Inventors: Shivkumar Mahadevan, Frank Molock, Robert Ward, Yuan Tian, Shanger Wang, James Serpilio
  • Patent number: 6610559
    Abstract: An integrated void-free process has been developed for attaching a solder bumped chip to a substrate. The chip is first dipped in a tacky thermosettable flux, and the chip is mounted on the substrate. An underfill is dispensed along the edge of the chip The device is then sent into the reflow furnace to complete the underfilling (which optionally can be completed before reflow), solder reflowing and underfill curing. The flux also acts as a physical barrier minimizing, if not eliminating, the interference of filler on solder wetting and resulting metallurgical joints formed between the solder and the bond pads. The process allows for the integration of a void free conventional capillary flow underfilling process and a pre-deposited fluxing underfilling process by using a tacky thermosettable flux, avoiding the problems associated with each of the individual processes and requiring less time for the overall process.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: August 26, 2003
    Assignee: Indium Corporation of America
    Inventors: Shanger Wang, Wushing Yin, Ning-Cheng Lee
  • Publication number: 20030096453
    Abstract: An integrated void-free process has been developed for attaching a solder bumped chip to a substrate. The chip is first dipped in a tacky thermosettable flux, and the chip is mounted on the substrate. An underfill is dispensed along the edge of the chip The device is then sent into the reflow furnace to complete the underfilling (which optionally can be completed before reflow), solder reflowing and underfill curing. The flux also acts as a physical barrier minimizing, if not eliminating, the interference of filler on solder wetting and resulting metallurgical joints formed between the solder and the bond pads. The process allows for the integration of a void free conventional capillary flow underfilling process and a pre-deposited fluxing underfilling process by using a tacky thermosettable flux, avoiding the problems associated with each of the individual processes and requiring less time for the overall process.
    Type: Application
    Filed: November 16, 2001
    Publication date: May 22, 2003
    Inventors: Shanger Wang, Wushing Yin, Ning-Cheng Lee
  • Publication number: 20030059682
    Abstract: New polymer electrolytes were prepared by in situ cross-linking of allyl functional polymers based on hydrosilation reaction using a multifunctional silane cross-linker and an organoplatinum catalyst. The new cross-linked electrolytes are insoluble in organic solvent and show much better mechanical strength. In addition, the processability of the polymer electrolyte is maintained since the casting is finished well before the gel formation.
    Type: Application
    Filed: May 31, 2002
    Publication date: March 27, 2003
    Inventors: John Borland Kerr, Shanger Wang, Jun Hou, Steven Edward Sloop, Yong Bong Han, Gao Liu
  • Publication number: 20030023001
    Abstract: Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.
    Type: Application
    Filed: May 31, 2002
    Publication date: January 30, 2003
    Inventors: John Borland Kerr, Shanger Wang, Yong Bong Han, Gao Liu, Jun Hou, Steven Edward Sloop