Abstract: Polymers having the formula R(LE)x wherein R is a polymeric core having a number average molecular weight of from 5000 to 7,000,000 daltons and having x endgroups, E is an endgroup covalently linked to polymeric core R by linkage L, L is a divalent oligomeric chain, having at least 5 identical repeat units, capable of self-assembly with L chains on adjacent molecules of the polymer, and the moieties (LE)x in the polymer may be the same as or different from one another. Design of monomers, oligomers, or other reactive structures otherwise analogous to known Self Assembled Monolayers but with at least one reactive chemical group capable of binding them to the terminus of a polymer, so that the thiol-free SAM analogue becomes the self-assembling surface modifying endgroup of that polymer. Use of the polymer to fabricate a configured article from the surface-modified polymer or a coating or topical treatment on an article made from another material.

Abstract: The present invention relates to a process for the purification of silicone containing compounds via supercritical fluid extraction. Specifically, the present invention relates to a process comprising the steps of contacting at least one silicone containing compound with a supercritical fluid having a density of between about 0.2 and about 0.8 g/ml, decreasing said density so that two phases are formed a first phase comprising said at least one silicone containing compound and a second phase comprising at least one impurity and separating said second phase from said first phase.

Abstract: The present invention relates to a process comprising the steps of reacting in the presence of a hydrosilylation catalyst, a first reaction mixture comprising a free radical reactive compound and a silicon containing compound to form a silicon substituted glyceryl (meth)acrylate.

Abstract: New polymer electrolytes were prepared by in situ cross-linking of allyl functional polymers based on hydrosilation reaction using a multifunctional silane cross-linker and an organoplatinum catalyst. The new cross-linked electrolytes are insoluble in organic solvent and show much better mechanical strength. In addition, the processability of the polymer electrolyte is maintained since the casting is finished well before the gel formation.

Abstract: The present invention relates to a process comprising the steps of reacting in the presence of a hydrosilylation catalyst, a first reaction mixture comprising a free radical reactive compound and a silicon containing compound to form a silicon substituted glyceryl (meth)acrylate.

Abstract: Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.

Abstract: Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.

Abstract: The present invention relates to a process for the purification of silicone containing compounds via supercritical fluid extraction. Specifically, the present invention relates to a process comprising the steps of contacting at least one silicone containing compound with a supercritical fluid having a density of between about 0.2 and about 0.8 g/ml, decreasing said density so that two phases are formed a first phase comprising said at least one silicone containing compound and a second phase comprising at least one impurity and separating said second phase from said first phase.

Abstract: An integrated void-free process has been developed for attaching a solder bumped chip to a substrate. The chip is first dipped in a tacky thermosettable flux, and the chip is mounted on the substrate. An underfill is dispensed along the edge of the chip The device is then sent into the reflow furnace to complete the underfilling (which optionally can be completed before reflow), solder reflowing and underfill curing. The flux also acts as a physical barrier minimizing, if not eliminating, the interference of filler on solder wetting and resulting metallurgical joints formed between the solder and the bond pads. The process allows for the integration of a void free conventional capillary flow underfilling process and a pre-deposited fluxing underfilling process by using a tacky thermosettable flux, avoiding the problems associated with each of the individual processes and requiring less time for the overall process.

Abstract: An integrated void-free process has been developed for attaching a solder bumped chip to a substrate. The chip is first dipped in a tacky thermosettable flux, and the chip is mounted on the substrate. An underfill is dispensed along the edge of the chip The device is then sent into the reflow furnace to complete the underfilling (which optionally can be completed before reflow), solder reflowing and underfill curing. The flux also acts as a physical barrier minimizing, if not eliminating, the interference of filler on solder wetting and resulting metallurgical joints formed between the solder and the bond pads. The process allows for the integration of a void free conventional capillary flow underfilling process and a pre-deposited fluxing underfilling process by using a tacky thermosettable flux, avoiding the problems associated with each of the individual processes and requiring less time for the overall process.

Abstract: New polymer electrolytes were prepared by in situ cross-linking of allyl functional polymers based on hydrosilation reaction using a multifunctional silane cross-linker and an organoplatinum catalyst. The new cross-linked electrolytes are insoluble in organic solvent and show much better mechanical strength. In addition, the processability of the polymer electrolyte is maintained since the casting is finished well before the gel formation.

Abstract: Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.