Abstract: An electronic system is provided. The electronic system includes a processor and a first power management circuit. The processor generates and outputs a first data frame. The first data frame includes at least one first guard bit and a first address. The first power management circuit includes a first register. The first power management circuit receives the first data frame and determines legitimacy of the first address according to the least one first guard bit. In response to that the first address is legal, the power management circuit transmits a first response to the processor and accesses a first region in the first register according to the first address.

Abstract: A projection apparatus includes an illumination system, a prism assembly, a first light valve, a second light valve and a projection lens. The illumination system includes a blue light emitting element, a red light emitting element, a wavelength conversion device, a dichroic assembly, a first light diffusing element and a second light diffusing element. The second light diffusing element has a diffusion area and a non-diffusion area. The diffusion area is located on a transmission path of a blue beam from the dichroic assembly, and the non-diffusion area is located on a transmission path of a green beam from the dichroic assembly. The prism assembly has a dichroic film. The dichroic film is configured to transmit a red beam to the first light valve. The dichroic film is configured to transmit the green beam and the blue beam to the second light valve.

Abstract: An electronic system is provided. The electronic system includes a processor and a first power management circuit. The processor generates and outputs a first data frame. The first data frame includes at least one first guard bit and a first address. The first power management circuit includes a first register. The first power management circuit receives the first data frame and determines legitimacy of the first address according to the least one first guard bit. In response to that the first address is legal, the power management circuit transmits a first response to the processor and accesses a first region in the first register according to the first address.

Abstract: The processor comprises multiple sub-systems. Each sub-system is configured to generate a voltage switching signal. The processor also comprises a packetizing module coupled to the sub-systems. The packetizing module packetizes multiple voltage switching signals generated by the sub-systems to a packet. The processor also comprises a PMIF (power management interface) configured to receive the packet and output the packet.

Abstract: A projection apparatus includes an illumination system, a prism assembly, a first light valve, a second light valve and a projection lens. The illumination system includes a blue light emitting element, a red light emitting element, a wavelength conversion device, a dichroic assembly, a first light diffusing element and a second light diffusing element. The second light diffusing element has a diffusion area and a non-diffusion area. The diffusion area is located on a transmission path of a blue beam from the dichroic assembly, and the non-diffusion area is located on a transmission path of a green beam from the dichroic assembly. The prism assembly has a dichroic film. The dichroic film is configured to transmit a red beam to the first light valve. The dichroic film is configured to transmit the green beam and the blue beam to the second light valve.

Abstract: An illumination system and a projection apparatus are provided. The illumination system includes a blue light-emitting element, a red light-emitting element, a wavelength conversion device, a dichroic assembly, a first light diffusion element, and a second light diffusion element. The wavelength conversion device includes a reflective region and a wavelength conversion region. The wavelength conversion region is configured to convert a blue light beam emitted by the blue light-emitting element into a green light beam. The dichroic assembly is disposed between the blue light-emitting element and the wavelength conversion device. The first light diffusion element is disposed between the red light-emitting element and the dichroic assembly. The second light diffusion element has a diffusion region and a non-diffusion region. The diffusion region is located on a transmission path of the blue light beam. The non-diffusion region is located on a transmission path of the green light beam.

Abstract: A light source assembly includes a first annular reflector, a second annular reflector and a plurality of first light source modules. The first annular reflector has a first reflective surface. The second annular reflector is coaxial with the first annular reflector. A radius of the first annular reflector is greater than that of the second annular reflector. The second annular reflector has a second reflective surface facing the first reflective surface. The first light source modules take a central axis of the first annular reflector as a center and annularly arranged around the center. The first light source modules provide first beams to the first reflective surface, which reflects the first beams to the second reflective surface. The second reflective surface reflects the first beams and makes the first beams emit along a direction parallel to a central axis of the second annular reflector. A projection device is also provided.

Abstract: An illumination system, including a first light source for providing a first beam; a second light source for providing a second beam; a wavelength conversion element having a reflection region and a conversion region, wherein the reflection region is for reflecting the first beam and the conversion region is for converting the first beam into a third beam; a first light splitting element for allowing the second beam to pass; a second light splitting element for reflecting the first beam penetrated by the first light splitting element and allowing the second beam to pass, wherein the first light splitting element is disposed between the wavelength conversion element and the second light splitting element; and a light homogenizing element for receiving the first beam, the second beam, and the third beam, and generating an illumination beam, is provided. A projection apparatus including the illumination system is also provided.

Abstract: An illumination system, including a first light source for providing a first beam; a second light source for providing a second beam; a wavelength conversion element having a reflection region and a conversion region, wherein the reflection region is for reflecting the first beam and the conversion region is for converting the first beam into a third beam; a first light splitting element for allowing the second beam to pass; a second light splitting element for reflecting the first beam penetrated by the first light splitting element and allowing the second beam to pass, wherein the first light splitting element is disposed between the wavelength conversion element and the second light splitting element; and a light homogenizing element for receiving the first beam, the second beam, and the third beam, and generating an illumination beam, is provided. A projection apparatus including the illumination system is also provided.

Abstract: A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.

Abstract: A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.

Abstract: A transfer printing apparatus includes a mold, a stamper, a pressing roller and a curing unit. The mold has a first surface with first and second concavities, the second concavity has first and second planes, the first plane is perpendicular to the first surface, and the second plane is inclined to the first surface. The stamper having a second surface is disposed in the first concavity. The first and second surfaces are coplanar, and the second surface has transfer printing microstructures. The first and second surfaces are suitable for coated an adhesive layer. The pressing roller presses a base film onto the adhesive layer, such that the adhesive layer is integrated with the base film. The curing unit cures the adhesive layer on the base film, such that a taper corresponding to the second concavity and optical microstructures corresponding to the transfer printing microstructures are formed on the adhesive layer.

Abstract: A backlight module includes a light guide plate (LGP), a light source, and at least one prism sheet. The LGP includes a light emitting surface, a bottom surface, a light incident surface, and a plurality of first microstructures on the bottom surface. Each of the first microstructure is a recessed structure and includes a first surface and a second surface. An included angle between the first surface and the bottom surface ranges from 15 degrees to 27 degrees. An included angle between the second surface and the bottom surface ranges from 50 degrees to 90 degrees. The light source provides a light beam, and an included angle between a light emitting direction of the light beam emitted from the light emitting surface of the LGP and a normal direction of the light emitting surface is greater than 30 degrees. The prism sheet is disposed above the light emitting surface.

Abstract: A transfer printing apparatus includes a mold, a stamper, a pressing roller and a curing unit. The mold has a first surface with first and second concavities, the second concavity has first and second planes, the first plane is perpendicular to the first surface, and the second plane is inclined to the first surface. The stamper having a second surface is disposed in the first concavity. The first and second surfaces are coplanar, and the second surface has transfer printing microstructures. The first and second surfaces are suitable for coated an adhesive layer. The pressing roller presses a base film onto the adhesive layer, such that the adhesive layer is integrated with the base film. The curing unit cures the adhesive layer on the base film, such that a taper corresponding to the second concavity and optical microstructures corresponding to the transfer printing microstructures are formed on the adhesive layer.

Abstract: A backlight module includes a light guide plate (LGP), a light source, and at least one prism sheet. The LGP includes a light emitting surface, a bottom surface, a light incident surface, and a plurality of first microstructures on the bottom surface. Each of the first microstructure is a recessed structure and includes a first surface and a second surface. An included angle between the first surface and the bottom surface ranges from 15 degrees to 27 degrees. An included angle between the second surface and the bottom surface ranges from 50 degrees to 90 degrees. The light source provides a light beam, and an included angle between a light emitting direction of the light beam emitted from the light emitting surface of the LGP and a normal direction of the light emitting surface is greater than 30 degrees. The prism sheet is disposed above the light emitting surface.

Abstract: A circuit board structure with an embedded semiconductor chip and a fabrication method thereof are provided, including the steps of providing a semiconductor wafer having an active surface with a plurality of electrode pads, a connection metal layer formed on the electrode pads: forming a protective layer on the connection metal layer and the semiconductor wafer, performing a cutting process to form a plurality of semiconductor dies, providing a carrier board having at least one cavity for receiving the semiconductor chip; and forming sequentially on the protective layer covering the semiconductor chip and the carrier board a dielectric layer and a circuit layer electrically connected to the connection metal layer of the semiconductor chip. The present invention is a simple, in process and low in process cost, due to the connection metal layer covered by the protective layer formed on the semiconductor chip protected from oxidation and contamination.

Abstract: A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.

Abstract: A packaging substrate structure with a semiconductor chip embedded therein is disclosed, including a carrier board having a first and an opposed second surfaces and disposed with at least a through cavity; a semiconductor chip received in the through cavity, the chip having an active surface and an inactive surface opposite to one another, wherein the active surface has a plurality of electrode pads, a passivation layer is disposed on the active surface with the electrode pads exposed from the passivation layer, and metal pads are disposed on surfaces of the electrode pads; a buffer layer disposed on the first surface of the carrier board and on surfaces of the passivation layer and the metal pads; a first dielectric layer disposed on the buffer layer; and a first circuit layer disposed on the first dielectric layer and electrically connected with the metal pads of the chip via first conductive structures disposed in the buffer layer and the first dielectric layer, wherein the CTE (Coefficient of Thermal Expa

Abstract: The present invention provides a circuit board structure with an embedded semiconductor chip and a method for fabricating the same. The circuit board structure includes a carrier board having a first surface, a second surface, and a through hole penetrating the carrier board from the first surface to the second surface; a semiconductor chip having an active surface whereon a plurality of electrode pads are formed and a non-active surface, embedded in the through hole; a photosensitive first dielectric layer formed on the first surface of the carrier board and an opening formed thereon to expose the non-active surface of the semiconductor chip; a photosensitive second dielectric layer formed on the second surface of the carrier board and the active surface of the semiconductor chip.