Abstract: In some embodiments, a camera unit of a multifunction device may include an optical package and an actuator for moving the optical package. In some embodiments, the actuator may include an asymmetric magnet arrangement. The asymmetric magnet arrangement may include a lateral position control magnet situated at a first side of the optical package, and a pair of transverse position control magnets situated at respective second and third sides of the optical package opposite one another with respect to an axis between the optical package and the lateral magnet. In some embodiments, the actuator may include one or more position sensor magnets attached to the optical package, and one or more magnetic field sensors for determining a position of the position sensor magnets.

Abstract: Embodiments described herein generally relate to a sequential hydrogenation and nitridization process for reducing interfacial and bulk O atoms in a conductive structure in a semiconductor device. A hydrogenation and plasma nitridization process is performed on a metal nitride layer in a conductive structure prior to deposition of a second metal layer, thereby reducing interfacial oxygen atoms formed on a surface of the metal nitride and oxygen atoms present in the bulk metal layers of the conductive structure. As a result, adhesion of the second metal layer to the metal nitride layer is improved and the electrical resistance of the contact structure is reduced.

Abstract: In some embodiments, a camera actuator includes an actuator base, an autofocus voice coil motor, and an optical image stabilization voice coil motor. In some embodiments, the autofocus voice coil motor includes a lens carrier mounting attachment moveably mounted to the actuator base, a plurality of shared magnets mounted to the base, and an autofocus coil fixedly mounted to the lens carrier mounting attachment for producing forces for moving a lens carrier in a direction of an optical axis of one or more lenses of the lens carrier. In some embodiments, the optical image stabilization voice coil motor includes an image sensor carrier moveably mounted to the actuator base, and optical image stabilization coils moveably mounted to the image sensor carrier within the magnetic fields of the shared magnets, for producing forces for moving the image sensor carrier in a plurality of directions orthogonal to the optical axis.

Abstract: Embodiments described herein generally relate to enable the formation of a metal gate structure with a reduced effective oxide thickness over a similar structure formed via conventional methods. A plasma hydrogenation process followed by a plasma nitridization process is performed on a metal nitride layer in a film stack, thereby removing oxygen atoms disposed within layers of the film stack and, in some embodiments eliminating an oxygen-containing interfacial layer disposed within the film stack. As a result, an effective oxide thickness of the metal gate structure is reduced with little or no accompanying flatband voltage shift. Further, the metal gate structure operates with an increased leakage current that is as little as one quarter the increase in leakage current associated with a similar metal gate structure formed via conventional techniques.

Abstract: In some embodiments, a first camera unit includes a first actuator for moving a first optical package configured for a first focal length. A second camera unit of the multifunction device for simultaneously capturing a second image of a second visual field includes a second actuator for moving a second optical package configured for a second focal length, and the camera system includes a shared magnet positioned between the first camera unit and the second camera unit to generate magnetic fields usable in creating motion in both the first camera actuator and the second camera actuator.

Abstract: Embodiments of the present disclosure relate to thermal processing of substrates. More specifically, embodiments described herein relate to flash on spike annealing processes and apparatus suitable for performing such processes. In one embodiment, a thermal processing apparatus may include a lamp radiation source, a laser source, and a reflector plate disposed between the lamp radiation source and the laser source. One or more apertures may be formed in the reflector plate and the laser source may be positioned adjacent to the reflector plate such that a laser beam emitted from the laser source propagates through the one or more apertures. In one embodiment, the reflector plate may be substantially circular and the one or more apertures may approximate a sector of the reflector plate.

Abstract: Embodiments described herein generally relate to a sequential hydrogenation and nitridization process for reducing interfacial and bulk O atoms in a conductive structure in a semiconductor device. A hydrogenation and plasma nitridization process is performed on a metal nitride layer in a conductive structure prior to deposition of a second metal layer, thereby reducing interfacial oxygen atoms formed on a surface of the metal nitride and oxygen atoms present in the bulk metal layers of the conductive structure. As a result, adhesion of the second metal layer to the metal nitride layer is improved and the electrical resistance of the contact structure is reduced.

Abstract: A camera module includes a lens carrier that houses a lens, electrical components of optical path modifiers positioned on the lens carrier, an image sensor, and a controller that is to generate commands for operating the optical path modifiers. A printed circuit assembly positioned on the lens carrier is electrically coupled to suspension wires. The printed circuit assembly includes a printed circuit that has installed thereon a serial bus communications interface circuit that is to receive the commands from the controller through one of the suspension wires, and a translation circuit that is to translate the commands into control signals that are to operate or drive the optical path modifiers via the electrical components and according to the commands, respectively. Other embodiments are also described.

Abstract: Various embodiments include a camera voice coil motor (VCM) actuator configured to shift an image sensor along multiple axes. Some embodiments include a magnet and coil arrangement. Some embodiments include a position sensing arrangement. Some embodiments include a flexure arrangement. Some embodiments include a coil structure and coil carrier assembly.

Abstract: Embodiments described herein generally relate to enable the formation of a metal gate structure with a reduced effective oxide thickness over a similar structure formed via conventional methods. A plasma hydrogenation process followed by a plasma nitridization process is performed on a metal nitride layer in a film stack, thereby removing oxygen atoms disposed within layers of the film stack and, in some embodiments eliminating an oxygen-containing interfacial layer disposed within the film stack. As a result, an effective oxide thickness of the metal gate structure is reduced with little or no accompanying flatband voltage shift. Further, the metal gate structure operates with an increased leakage current that is as little as one quarter the increase in leakage current associated with a similar metal gate structure formed via conventional techniques.

Abstract: A first camera unit of a multifunction device captures a first image of a first visual field. The first camera unit includes a first optical image stabilization actuator for moving a first optical package configured for a first focal length. A second camera unit of the multifunction device simultaneously captures a second image of a second visual field. The second camera unit includes a second optical image stabilization actuator for moving a second optical package configured for a second focal length. The first focal length is different from the second focal length.

Abstract: A camera module includes a lens carrier that houses a lens, electrical components of optical path modifiers positioned on the lens carrier, an image sensor, and a controller that is to generate commands for operating the optical path modifiers. A printed circuit assembly positioned on the lens carrier is electrically coupled to suspension wires. The printed circuit assembly includes a printed circuit that has installed thereon a serial bus communications interface circuit that is to receive the commands from the controller through one of the suspension wires, and a translation circuit that is to translate the commands into control signals that are to operate or drive the optical path modifiers via the electrical components and according to the commands, respectively. Other embodiments are also described.

Abstract: 1. The invention concerns a method for the redundancy-optimized planning of the operation of a redundant mobile robot (1) comprising a mobile carrier vehicle (2), a robot arm (6) having several members (11-16) connected via joints, mounted pivotably with respect to axes of rotation (21-25), drives for moving the members (11-16) relative to each other and having an electronic control device (5) which is arranged to control the drives for the members (11-16) and the carrier vehicle (2) for the movement of the mobile robot (1).

Abstract: A camera module includes an optical package, a camera actuator for moving the optical package, a camera subassembly, and one or more resilient members arranged within the camera subassembly to prevent, reduce, or cushion contact between the optical package and other components of the camera. The resilient members may be mounted on the lens carrier of the optical package and configured to come into resistive contact with components of the camera subassembly and/or mounted on components of the camera subassembly and configured to come into resistive contact with the optical package. In either case, the resistive cushioning provided by the resilient members may reduce or prevent contact (and an associated rattling noise associated with the contact) between the optical package and the hard components of the camera subassembly. The resilient members may be configured to cushion, but also allow hard stop contact. In embodiments bumpers (e.g., elastomeric pads) may be used.

Abstract: In some embodiments, a camera unit of a multifunction device may include an optical package and an actuator for moving the optical package. In some embodiments, the actuator may include an asymmetric magnet arrangement. The asymmetric magnet arrangement may include a lateral position control magnet situated at a first side of the optical package, and a pair of transverse position control magnets situated at respective second and third sides of the optical package opposite one another with respect to an axis between the optical package and the lateral magnet. In some embodiments, the actuator may include one or more position sensor magnets attached to the optical package, and one or more magnetic field sensors for determining a position of the position sensor magnets.

Abstract: Embodiments described herein generally relate to a sequential hydrogenation and nitridization process for reducing interfacial and bulk O atoms in a conductive structure in a semiconductor device. A hydrogenation and plasma nitridization process is performed on a metal nitride layer in a conductive structure prior to deposition of a second metal layer, thereby reducing interfacial oxygen atoms formed on a surface of the metal nitride and oxygen atoms present in the bulk metal layers of the conductive structure. As a result, adhesion of the second metal layer to the metal nitride layer is improved and the electrical resistance of the contact structure is reduced.

Abstract: Embodiments described herein generally relate to enable the formation of a metal gate structure with a reduced effective oxide thickness over a similar structure formed via conventional methods. A plasma hydrogenation process followed by a plasma nitridization process is performed on a metal nitride layer in a film stack, thereby removing oxygen atoms disposed within layers of the film stack and, in some embodiments eliminating an oxygen-containing interfacial layer disposed within the film stack. As a result, an effective oxide thickness of the metal gate structure is reduced with little or no accompanying flatband voltage shift. Further, the metal gate structure operates with an increased leakage current that is as little as one quarter the increase in leakage current associated with a similar metal gate structure formed via conventional techniques.

Abstract: A first camera unit includes a first actuator for moving a first optical package configured for a first focal length. In some embodiments, a camera system of a multifunction device includes a second camera unit of the multifunction device for simultaneously capturing a second image of a second visual field. In some embodiments, the second camera unit includes a second actuator for moving a second optical package configured for a second focal length. In some embodiments, the second actuator includes a second actuator lateral magnet. In some embodiments, the first optical package and the second optical package are situated between the first actuator later magnet and the second actuator lateral magnet along an axis between the first actuator lateral magnet and the second actuator lateral magnet. In some embodiments, no actuator lateral magnets are situated between the first optical package and the second optical package along the axis.

Abstract: In some embodiments, a first camera unit of a multifunction device for capturing a first image of a first visual field includes a first actuator for moving a first optical package. A second camera unit includes a second actuator for moving a second optical package. The second camera unit includes a second central magnet array situated along the axis between the first optics package of the first camera unit and the second optics package of the second camera unit. In some embodiments, the second central magnet array includes a second central upper magnet having a first polarity and a second central lower magnet having a polarity antiparallel to the first polarity. In some embodiments, the second camera unit includes a second distal magnet array situated opposite the second central magnet array with respect to the second optics package of the second camera unit.

Abstract: A semiconductor processing method and semiconductor device are described. The processing method includes forming a p-doped germanium structure on a substrate, annealing the p-doped germanium structure using pulses of laser radiation, and forming a titanium structure in direct contact with the p-doped germanium structure.