Abstract: A package or a chip including a linear amplifier and a power amplifier is provided, wherein the linear amplifier is configured to receive an envelope tracking signal to generate an amplified envelope tracking signal, the power amplifier is supplied by an envelope tracking supply voltage comprising a DC supply voltage and the amplified envelope tracking signal, and the power amplifier is configured to receive an input signal to generate an output signal.

Abstract: An organic-inorganic hybrid material is disclosure. The organic-inorganic hybrid material contains 5˜50 wt % of inorganic compounds and has a characteristic peak at 1050±50 cm?1 in FTIR spectrum. Furthermore, the invention also provides a fabricating process of the organic-inorganic hybrid material as well as its starting material “isocyanates”. In particular, the isocyanates are prepared from carbonate containing compounds and amines.

Abstract: A compensator compensates for the distortions of a power amplifier circuit. A power amplifier neural network (PAN) is trained to model the power amplifier circuit using pre-determined input and output signal pairs that characterize the power amplifier circuit. Then a compensator is trained to pre-distort a signal received by the PAN. The compensator uses a neural network trained to optimize a loss between a compensator input and a PAN output, and the loss is calculated according to a multi-objective loss function that includes one or more time-domain loss function and one or more frequency-domain loss functions. The trained compensator performs signal compensation to thereby output a pre-distorted signal to the power amplifier circuit.

Abstract: A thermal plastic polyurethane with a stress more than 2.5 MPa, its preparing formulation and making process are disclosed. In particular, the thermal plastic polyurethane with a stress more than 2.5 MPa is prepared from a formulation comprises a polycarbonate derivative and a chain extender.

Abstract: An organic-inorganic hybrid material is disclosure. The organic inorganic hybrid material contains 5˜50 wt % of inorganic compounds and has a characteristic peak at 1050±50 cm?1 in FTIR spectrum. Furthermore, the invention also provides a fabricating process of the organic-inorganic hybrid material as well as its starting material “isocyanates”. In particular, the isocyanates are prepared from carbonate containing compounds and amines.

Abstract: A power conversion circuit and a method thereof, wherein the power conversion circuit includes a first grid interface and a second grid interface coupled to an AC power source, a power harvesting module, a sampling module and a switching module. The power harvesting module is coupled to the first grid interface, and the power harvesting module includes a first diode and a first charging capacitor coupled to the first diode. The power harvesting module receives the AC power source from the first grid interface to generate an output voltage. The switching module includes a switch component controlled by the sampling module. The sampling module is coupled to the power harvesting module and acquires a sampling voltage. The sampling module controls the switch component to be turned off during at least a period of time within positive half cycles of the AC power source.

Abstract: A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

Abstract: A method for measuring spasticity is provided and includes: obtaining sensing signals corresponding to a limb movement through at least one sensor during a period of time; transforming the sensing signals into a two-dimensional image; and inputting the two-dimensional image into a convolutional neural network to output a spasticity determination result.

Abstract: A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure includes a source line structure. The source line structure includes a composite material formed in a trench. The composite material includes an oxide portion and a metal portion.

Abstract: An elbow joint rehabilitation system and an elbow joint rehabilitation method are provided. The elbow joint rehabilitation system includes a support member, a motor, a torque sensing unit, a first electromyography sensor, a second electromyography sensor and a motor control device. In the elbow joint rehabilitation method, the support member is configured to support an arm of a patient. Thereafter, the torque sensing unit is configured to sense the torque applied on the support member to obtain a sensed arm torque signal. Then, the first electromyography sensor and the second electromyography sensor are configured to sense the muscle activities of biceps and triceps of the patient to obtain electromyography signals. Thereafter, the motor is controlled to drive the support member to perform rehabilitation in accordance with the sensed arm torque signal, the electromyography signals and a current support member position provided by the motor.

Abstract: A surgical instrument inventory system, including a memory and a processor, is provided. The memory is configured to store a global identification module and a local identification module. The processor is coupled to the memory and is configured to input a surgical instrument image to the global identification module and the local identification module. The global identification module is configured to output multiple global image features corresponding to the surgical instrument image. The local identification module is configured to output multiple local image features corresponding to an instrument end image of the surgical instrument image. The processor determines a surgical instrument type of the surgical instrument image according to the multiple global image features and the multiple local image features.

Abstract: An automatic control method of a mechanical arm and an automatic control system are provided. The automatic control method includes the following steps: obtaining a color image and depth information corresponding to the color image through a depth camera; performing image space cutting processing and image rotation processing according to the color image and the depth information to generate a plurality of depth images; inputting the depth images into an environmental image recognition module such that the environmental image recognition module outputs a displacement coordinate parameter; and outputting the displacement coordinate parameter to a mechanical arm control module such that the mechanical arm control module controls the mechanical arm to move according to the displacement coordinate parameter.

Abstract: Provided is a method for activating CD4+ T cells using a polymer-based antigen complex. The method comprises the steps of bringing the polymer-based antigen complex into contact with B cells so that B cells process and present the antigen complex, and of bringing the B cells into contact with CD4+ T cells to activate CD4+ T cells. Also provided are a method for promoting the differentiation of CD4+ T cells into Tfh cells and Thl cells using the antigen complex, and a method for treating diseases by activating CD4+ T cells and/or promoting the differentiation of CD4+ T cells.

Abstract: A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure includes a source line structure. The source line structure includes a composite material formed in a trench. The composite material includes an oxide portion and a metal portion.

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.

Abstract: A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

Abstract: A method for producing a composite glue composed of an aerogel, an inorganic fiber, and an inorganic adhesive includes the following steps of: (1) mixing step, (2) hydrolysis step, (3) condensation step, (4) aging step, (5) high-temperature solvent replacement step, (6) evaporation and drying step, and (7) composition step. The obtained product thereof is a viscous composite glue composed of the aerogel, and the total content of the aerogel and an inorganic fiber is of 25-90 wt % after dried. Additionally, the obtained product can be used at a high temperature of more than 600° C., and has no phenomena of inorganic material decomposition and carcinogen production.

Abstract: The invention provides a method for producing a heat insulating material composed of a hydrophobic aerogel, and the method includes the steps of: (1) mixing step; (2) hydrolysis step; (3) condensation step; (4) aging step; and (5) drying step. In the method, a siloxane compound, an inorganic gel, and a halogen-free surfactant are mixed and then a sol-gel process is performed to produce the aerogel heat-insulating material without water-washing. The produced heat-insulating material has preferable strength, smooth appearance, and low shrinkage and can overcome the powder-dropping problem. By the provided method, an aerogel heat-insulating board can be produced, or an aerogel cold-resisting and heat-insulating blanket can be produced by mixing with a fiber or a foam material.

Abstract: A structure and a manufacturing method of a metal-oxide-semiconductor field-effect transistor with an element of IVA group ion implantation are disclosed. The element of IVA group ion implantation layer is disposed in a body and close to an interface between a gate oxide layer and the body. The element of IVA group ion implantation layer is utilized to change a property of a channel of the structure.

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.