Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.

Abstract: A power conversion circuit and a method thereof, wherein the power conversion circuit includes a first grid interface and a second grid interface coupled to an AC power source, a power harvesting module, a sampling module and a switching module. The power harvesting module is coupled to the first grid interface, and the power harvesting module includes a first diode and a first charging capacitor coupled to the first diode. The power harvesting module receives the AC power source from the first grid interface to generate an output voltage. The switching module includes a switch component controlled by the sampling module. The sampling module is coupled to the power harvesting module and acquires a sampling voltage. The sampling module controls the switch component to be turned off during at least a period of time within positive half cycles of the AC power source.

Abstract: A high stress thermal plastic polyurethane, its preparing formulation and making process are disclosed. In particular, the high stress thermal plastic polyurethane is prepared from a formulation comprises a polycarbonate derivative and has a stress more than 2.5 MPa.

Abstract: An organic-inorganic hybrid material is disclosure. The organic inorganic hybrid material contains 5˜50 wt % of inorganic compounds and has a characteristic peak at 1050±50 cm?1 in FTIR spectrum. Furthermore, the invention also provides a fabricating process of the organic-inorganic hybrid material as well as its starting material “isocyanates”. In particular, the isocyanates are prepared from carbonate containing compounds and amines.

Abstract: A medical image modeling system and a medical image modeling method are provided. The medical image modeling system includes an input device, a processing device, and a storage device. The input device obtains medical image data. The processing device is coupled to the input device. The processing device converts the medical image data into a bone model in response to a first operational command. The storage device is coupled to the processing device. The storage device stores a model database. The processing device reads the model database in response to a second operational command to obtain a bone reconstruction block corresponding to a defect block of the bone model. The processing device integrates a bone reconstruction model depicted corresponding to the bone reconstruction block into the defect block of the bone model to generate an integrated bone model.

Abstract: An elbow joint rehabilitation system and an elbow joint rehabilitation method are provided. The elbow joint rehabilitation system includes a support member, a motor, a torque sensing unit, a first electromyography sensor, a second electromyography sensor and a motor control device. In the elbow joint rehabilitation method, the support member is configured to support an arm of a patient. Thereafter, the torque sensing unit is configured to sense the torque applied on the support member to obtain a sensed arm torque signal. Then, the first electromyography sensor and the second electromyography sensor are configured to sense the muscle activities of biceps and triceps of the patient to obtain electromyography signals. Thereafter, the motor is controlled to drive the support member to perform rehabilitation in accordance with the sensed arm torque signal, the electromyography signals and a current support member position provided by the motor.

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.

Abstract: An image analyzing method is provided and includes: extracting a first feature vector according to global information of a digital image; dividing the digital image into multiple regions, and inputting each region into a convolutional neural network to obtain a second feature vector; merging the first feature vector with the second feature vectors to obtain a third feature vector; and performing an image analyzing process according to the third feature vector.

Abstract: An image analyzing method is provided and includes: extracting a first feature vector according to global information of a digital image; dividing the digital image into multiple regions, and inputting each region into a convolutional neural network to obtain a second feature vector; merging the first feature vector with the second feature vectors to obtain a third feature vector; and performing an image analyzing process according to the third feature vector.

Abstract: A method for measuring spasticity is provided and includes: obtaining sensing signals corresponding to a limb movement through at least one sensor during a period of time; transforming the sensing signals into a two-dimensional image; and inputting the two-dimensional image into a convolutional neural network to output a spasticity determination result.

Abstract: An image recognition method is provided and includes: decoding a digital image file to obtain a digital image; providing, by a front end application, a user interface so that a user interacts with the user interface through a browser, in which the user interface renders the digital image; receiving an image editing operation corresponding to the digital image through the user interface; obtaining characteristic information corresponding to a sample region of the digital image from the digital image file according to the image editing operation; transmitting, by the front end application, the characteristic information to a server to perform an image recognition procedure.

Abstract: A medical image modeling system and a medical image modeling method are provided. The medical image modeling system includes an input device, a processing device, and a storage device. The input device obtains medical image data. The processing device is coupled to the input device. The processing device converts the medical image data into a bone model in response to a first operational command. The storage device is coupled to the processing device. The storage device stores a model database. The processing device reads the model database in response to a second operational command to obtain a bone reconstruction block corresponding to a defect block of the bone model. The processing device integrates a bone reconstruction model depicted corresponding to the bone reconstruction block into the defect block of the bone model to generate an integrated bone model.

Abstract: A method of producing a five-carbon ring derivative-containing polyurethane involves introducing a DCPD-derived 5-carbon cyclic compound into a polyurethane material and effectuating polymerization in the presence of a solvent of a low boiling point and low toxicity to produce a five-carbon ring derivative-containing polyurethane of a high molecular weight.

Abstract: A structure and a manufacturing method of a metal-oxide-semiconductor field-effect transistor with an element of IVA group ion implantation are disclosed. The element of IVA group ion implantation layer is disposed in a body and close to an interface between a gate oxide layer and the body. The element of IVA group ion implantation layer is utilized to change a property of a channel of the structure.

Abstract: A circuit module includes a power amplifier, a switch, and a bypass capacitor. The power amplifier has a signal input node coupled to an input signal, a signal output node to generate an output signal, and a power input node coupled to a supply output signal of a supply modulator. The switch is coupled between the power input node of the power amplifier and the bypass capacitor. The bypass capacitor is an equivalently removable bypass capacitor coupled between the switch and a ground level.

Abstract: A package or a chip including a linear amplifier and a power amplifier is provided, wherein the linear amplifier is configured to receive an envelope tracking signal to generate an amplified envelope tracking signal, the power amplifier is supplied by an envelope tracking supply voltage comprising a DC supply voltage and the amplified envelope tracking signal, and the power amplifier is configured to receive an input signal to generate an output signal.

Abstract: A semiconductor structure includes a substrate including a dummy area and an array area adjacent to the dummy area, sub-dummy structures, sub-array structures, a three-dimensional array of memory cells, first conductive structures and second conductive structures. The sub-dummy structures are disposed on the dummy area, and separated from each other by first trenches extending along a first direction. The sub-array structures are disposed on the array area, and separated from each other by second trenches extending along a second direction. The memory cells include cell groups disposed in the sub-array structures, respectively. The first conductive structures and the second conductive structures are disposed in the first trenches and the second trenches respectively. Each of the first conductive structures extends along the first direction, each of the second conductive structure extends along the second direction, and the first direction is different from the second direction.

Abstract: A tungsten carbide-cubic boron nitride composite material and preparation method thereof mainly includes WC and cBN, wherein the WC powder is coated with Co nano-layer and the cBN powder is coated with SiO2 nano-layer, and hardness and toughness of the composition material can be improved by coating. The method for preparing a tungsten carbide-cubic boron nitride composite material adopts chemical vapor deposition method and high temperature sintering method. First nano-layers were coated on the surface of WC and cBN, and then the bulk materials can be obtained via high-temperature sintering.

Abstract: A circuit module includes a power amplifier, a switch, and a bypass capacitor. The power amplifier has a signal input node coupled to an input signal, a signal output node to generate an output signal, and a power input node coupled to a supply output signal of a supply modulator. The switch is coupled between the power input node of the power amplifier and the bypass capacitor. The bypass capacitor is an equivalently removable bypass capacitor coupled between the switch and a ground level.

Abstract: A method of producing a five-carbon ring derivative-containing polyurethane involves introducing a DCPD-derived 5-carbon cyclic compound into a polyurethane material and effectuating polymerization in the presence of a solvent of a low boiling point and low toxicity to produce a five-carbon ring derivative-containing polyurethane of a high molecular weight.