Patents by Inventor Sheng Wang
Sheng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12265759Abstract: An image construction method and system for a heating area is provided. The method includes: obtaining an initial image according to a heating structure diagram and a building structure diagram of the heating area; segmenting the initial image according to heating attribute of the heating area to obtain a plurality of segmentation sub-graphs; performing first collection on a surface temperature of a heating pipeline according to pre-deployed surface devices corresponding to the segmentation sub-graphs, and setting first heating labels corresponding to the segmentation sub-graphs, and meanwhile, performing second collection on a regional temperature of a sub-area of the heating pipeline being located according to a pre-deployed monitoring device corresponding to the segmentation sub-graphs, and setting second heating labels; performing position and temperature analysis on a label setting result of each of the segmentation sub-graphs to obtain a heating image of the heating area.Type: GrantFiled: June 27, 2024Date of Patent: April 1, 2025Assignee: HUANENG (TIANJIN) ENERGY SALES CO., LTD.Inventors: Xuliang Li, Zexuan Yu, Xueqiang Han, Guojun Wang, Di Wu, Shunyong Shi, Zhenxing Yuan, Hongjian Zuo, Liangge Yu, Sheng Ding, Yi Zheng, Ziyu Gong, Rui Wang, Weizheng Yang
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Patent number: 12265067Abstract: The disclosure describes embodiments of an apparatus including a first gas chromatograph including a fluid inlet, a fluid outlet, and a first temperature control. A controller is coupled to the first temperature control and includes logic to apply a first temperature profile to the first temperature control to heat, cool, or both heat and cool the first gas chromatograph. Other embodiments are disclosed and claimed.Type: GrantFiled: October 16, 2023Date of Patent: April 1, 2025Assignee: Tricorntech CorporationInventors: Tsung-Kuan A. Chou, Shih-Chi Chu, Chia-Sheng Cheng, Li-Peng Wang, Chien-Lin Huang
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Patent number: 12264582Abstract: An in-situ stress measurement device for ultra-deep non-vertical drilling adopts a technical route of single channel and bidirectional rolling of in-hole equipment, and its related functions are mainly realized by a bidirectional rolling device and a split-type axial-force-free circuit switching valve. The bidirectional rolling device can drive the in-hole equipment to move freely in a circumferential direction and back and forth, which changes sliding friction between the in-hole equipment and a hole wall into rolling friction during an in-situ stress measurement of non-vertical drilling. The split-type axial-force-free circuit switching valve provides a technical solution for a single-pipe test in the non-vertical drilling.Type: GrantFiled: June 5, 2024Date of Patent: April 1, 2025Assignee: Changjing River Scientific Research InstituteInventors: Xiaoyu Han, Zhihong Dong, Xiuli Ding, Ping Fu, Liming Zhou, Xinhui Zhang, Bin Wang, Yuankun Liu, Sheng Luo, Chunhua Zhou, Kai Ai, Heng Zhang
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Publication number: 20250106743Abstract: An out-of-service recovery search method includes establishing a frequency list including at least one searchable frequency, searching a suitable cell of a network according to the frequency list when the user terminal is in an out-of-service state, determining at least one first skip condition of the user terminal, performing a full-band power scan mechanism for scanning received signal strength indication (RSSIs) of user terminal supported frequency bands when the at least one first skip condition of the user terminal is absent and no suitable cell of the network is searched within the searchable frequency of the frequency list, skipping the full-band power scan mechanism when the at least one first skip condition of the user terminal is present and no suitable cell of the network is searched within the searchable frequency, and performing an RSSI sniffer for scanning a signal power of each frequency of the searchable frequency.Type: ApplicationFiled: September 24, 2024Publication date: March 27, 2025Applicant: MEDIATEK INC.Inventors: Jia-Hao Wu, Tzyuan Shiu, Da-Wei Wang, Lu-Chi Lin, Mu-Chi Fang, Wen-Yang Chou, Tsung-Sheng Tang, Chung-Pi Lee
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Publication number: 20250102894Abstract: An illumination system includes a first light source, a second light source, a light combining module, and a wavelength conversion element. The first light source is configured to provide a first beam. The second light source is configured to provide a second beam. The light combining module is disposed on a transmission path of the first beam from the first light source and the second beam from the second light source. The wavelength conversion element includes a rotary disk, a wavelength conversion material layer, and a light splitting layer. The light splitting layer is disposed on the rotary disk. The wavelength conversion material layer is disposed between the rotary disk and the light splitting layer, and is configured to convert the first beam into an excited beam. The light splitting layer is configured to reflect the second beam and allow the first beam and the excited beam to pass through.Type: ApplicationFiled: September 25, 2024Publication date: March 27, 2025Applicant: Coretronic CorporationInventors: Chang-Hsuan Chen, Hou-Sheng Wang, Shao-Hui Liu
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Publication number: 20250105401Abstract: A method for manufacturing an enclosure includes designing a two dimensional (2D) blank corresponding to a three dimensional (3D) enclosure body; laying out N of the 2D blanks on a metal sheet, where N is an integer greater than one; separating the N 2D blanks from the metal sheet; at least one of bending, folding and/or flanging the N 2D blanks into the 3D enclosure body; and joining a plurality of sides of the 3D enclosure body.Type: ApplicationFiled: September 22, 2023Publication date: March 27, 2025Inventors: Lu HUANG, Ziqiang Sheng, Wei Wu, Hui-ping Wang, Liang Xi, Wai Ping Gloria Tam
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Publication number: 20250100228Abstract: Methods and systems for processing a graphic for light-cured printing, an electronic apparatus, and/or a storage medium are disclosed. In some embodiments, the method includes following steps: obtaining 3D model data of an object to be printed; slicing the 3D model data to obtain sliced data; converting the sliced data to a projected picture; and chunking the projected picture to obtain a plurality of exposed pictures. The plurality of exposed pictures are superimposed and intersected to have an exposed result of the projected picture. In other embodiments, the method includes following steps: placing a photosensitive resin in a material tray, placing a molding platform in the material tray, and placing a molding end surface of the molding platform in contact with the photosensitive resin; sending the plurality of exposed pictures to a bottom surface of the material tray; and curing a corresponding layer of photosensitive resin.Type: ApplicationFiled: September 11, 2024Publication date: March 27, 2025Applicant: Shanghai Fusion Tech Co., Ltd.Inventors: Wei Mai, Sheng Zhu, Chong Wang, Jingjing Qian, Hua Feng, Jianzhe Li, Jinjing Zhang
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Patent number: 12261012Abstract: Disclosed is a plasma treatment apparatus, a lower electrode assembly and a forming method thereof, wherein the lower electrode assembly includes: a base for carrying a substrate to be treated; a focus ring encircling a periphery of the base; a coupling loop disposed below the focus ring; a conductive layer disposed in the coupling loop; and a wire for electrically connecting the conductive layer and the base so that the base and the conducting layer are equipotential. The lower electrode assembly is less prone to cause arc discharge.Type: GrantFiled: February 24, 2022Date of Patent: March 25, 2025Assignee: ADVANCED MICRO-FABRICATION EQUIPMENT INC.Inventors: Tuqiang Ni, Sheng Guo, Xiang Sun, Guangwei Fan, Kuan Yang, Hongqing Wang, Xingjian Chen, Ruoxin Du
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Patent number: 12261196Abstract: In some embodiments, the present application provides an integrated chip (IC). The IC includes a metal-insulator-metal (MIM) device disposed over a substrate. The MIM device includes a plurality of conductive plates that are spaced from one another. The MIM device further includes a first conductive plug structure that is electrically coupled to a first conductive plate and to a third conductive plate of the plurality of conductive plates. A first plurality of insulative segments electrically isolate a second conductive plate and a fourth conductive plate from the first conductive plug structure. The MIM device further includes a second conductive plug structure that is electrically coupled to the second conductive plate and to the fourth conductive plate of the plurality of conductive plates. A second plurality of insulative segments electrically isolate the first conductive plate and the third conductive plate from the second conductive plug structure.Type: GrantFiled: March 24, 2022Date of Patent: March 25, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Lu-Sheng Chou, Hsuan-Han Tseng, Chun-Yuan Chen, Hsiao-Hui Tseng, Ching-Chun Wang
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Publication number: 20250093515Abstract: A three-dimensional point cloud generation method for generating a three-dimensional point cloud including one or more three-dimensional points includes: obtaining (i) a two-dimensional image obtained by imaging a three-dimensional object using a camera and (ii) a first three-dimensional point cloud obtained by sensing the three-dimensional object using a distance sensor; detecting, from the two-dimensional image, one or more attribute values of the two-dimensional image that are associated with a position in the two-dimensional image; and generating a second three-dimensional point cloud including one or more second three-dimensional points each having an attribute value, by performing, for each of the one or more attribute values detected, (i) identifying, from a plurality of three-dimensional points forming the first three-dimensional point cloud, one or more first three-dimensional points to which the position of the attribute value corresponds, and (ii) appending the attribute value to the one or more fiType: ApplicationFiled: December 5, 2024Publication date: March 20, 2025Inventors: Pongsak LASANG, Chi WANG, Zheng WU, Sheng Mei SHEN, Toshiyasu SUGIO, Tatsuya KOYAMA
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Publication number: 20250096145Abstract: An electronic packaging structure including a first circuit structure and a second circuit structure is provided. An electronic component is disposed between the first circuit structure and the second circuit structure. At least one of the first circuit structure and the second circuit structure (for example, the second circuit structure) has a cavity. The electronic component is embedded in the cavity, and may be encapsulated between the first circuit structure and the second circuit structure.Type: ApplicationFiled: December 2, 2024Publication date: March 20, 2025Applicant: Unimicron Technology Corp.Inventors: Chin-Sheng Wang, Ra-Min Tain, Chih-Kai Chan, Chun-Hsien Chien
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Publication number: 20250094887Abstract: The present disclosure provides a method for optimizing parameters of a ladder-type carbon trading mechanism based on an improved particle swarm optimization (IPSO) algorithm. The method first obtains information and operating data of a park-level integrated energy system, establishes equipment models and constraints of the park-level integrated energy system, and establishes a ladder-type carbon trading model; then encapsulates a process of optimized low-carbon dispatching of the park-level integrated energy system as a fitness function whose input is parameters of a carbon trading mechanism and output is a carbon emission of the system; and finally, introduces an IPSO algorithm to optimize the fitness function, and outputs optimization result information of the algorithm. The present disclosure verifies effectiveness and rationality of the model and the method that give full play to a role of the ladder-type carbon trading mechanism in the park-level integrated energy system through example analysis.Type: ApplicationFiled: October 20, 2022Publication date: March 20, 2025Inventors: Quan Chen, Xuanjun Zong, Sheng Zou, Hongwei Zhou, Tao Peng, Weiliang Wang, Wenjia Zhang, Chen Wu, Qun Zhang, Yuan Shen, Wei Feng, Gaofeng Shen, Min Zhang, Kai Yang, Xinyue Kong
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Publication number: 20250098270Abstract: A method includes forming a semiconductor fin over a substrate; forming a gate structure over the semiconductor fin, the gate structure comprising: a first metallic layer; a second metallic layer over the first metallic layer, wherein the first metallic layer is a metal compound of a first element and a second element and the second metallic layer is a single-element metal of the second element; and an oxide layer between the first metallic layer and the second metallic layer.Type: ApplicationFiled: December 4, 2024Publication date: March 20, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsin-Che CHIANG, Ju-Yuan TZENG, Chun-Sheng LIANG, Chih-Yang YEH, Shu-Hui WANG, Jeng-Ya David YEH
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Patent number: 12255111Abstract: Provided are a multiple-level interconnect structure having a scatterometry test layer and a manufacturing method thereof. The multiple level interconnect structure includes a patterned reflective layer, a bulk reflective layer and a patterned test layer. The patterned reflective layer is disposed on a substrate and includes a first reflective pattern and a second reflective pattern separated from each other. The bulk reflective layer is disposed on the patterned reflective layer. The patterned test layer is disposed on the bulk reflective layer.Type: GrantFiled: August 4, 2021Date of Patent: March 18, 2025Assignee: United Microelectronics Corp.Inventors: Jia Fang Wu, Hsiang-Chieh Yen, Hsu-Sheng Huang, Zhi Jian Wang
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Patent number: 12253995Abstract: Increasing index search efficiency and availability in a database is provided. An index space matrix corresponding to a plurality of mini-indices of the database is built using ordered boundary values that correspond to key value ranges of each respective mini-index to increase index search efficiency by removing redundant mini-index accesses. Mini-indices of the plurality of mini-indices are consolidated asynchronously without suspending access to the mini-indices using a particular consolidation policy of a plurality of consolidation policies that corresponds to an amount of key value overlap identified between the mini-indices. Data operations corresponding to transactions are performed using the index space matrix during consolidation of the mini-indices without suspending access to the mini-indices.Type: GrantFiled: June 21, 2021Date of Patent: March 18, 2025Assignee: International Business Machines CorporationInventors: Sheng Yan Sun, Shuo Li, Xiaobo Wang, Xin Peng Liu
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Patent number: 12255118Abstract: A package structure includes a circuit substrate, a semiconductor package, a thermal interface material, a lid structure and a heat dissipation structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The thermal interface material is disposed on the semiconductor package. The lid structure is disposed on the circuit substrate and surrounding the semiconductor package, wherein the lid structure comprises a supporting part that is partially covering and in physical contact with the thermal interface material. The heat dissipation structure is disposed on the lid structure and in physical contact with the supporting part of the lid structure.Type: GrantFiled: July 18, 2023Date of Patent: March 18, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng
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Patent number: 12255119Abstract: A package assembly includes an interposer module on a package substrate, a liquid alloy thermal interface material (TIM) on the interposer module, a seal ring surrounding the liquid alloy TIM, and a package lid on the liquid alloy TIM and seal ring, wherein the seal ring, interposer module and package lid seal the liquid alloy TIM.Type: GrantFiled: September 28, 2021Date of Patent: March 18, 2025Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Ming-Chih Yew, Shin-Puu Jeng
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Publication number: 20250088079Abstract: A motor control unit, an electric drive assembly and a vehicle. The motor control unit includes a cooling assembly, a power assembly and a filtration assembly, where the cooling assembly includes a box, the box including a cooling portion, a first mounting portion and a second mounting portion, the first mounting portion being on a side of the cooling portion in a first direction, and the second mounting portion being on the other side of the cooling portion opposite the first mounting portion in the first direction. The power assembly is mounted at the first mounting portion, and the filtration assembly is mounted at the second mounting portion, such that the cooling portion simultaneously cools the power assembly and the filtration assembly.Type: ApplicationFiled: April 30, 2024Publication date: March 13, 2025Applicant: Xiaomi EV Technology Co., Ltd.Inventors: Yongming JIN, Chunfu Shi, Jiuhui Wang, Sheng Ye, Weixing Liu
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Publication number: 20250086350Abstract: This invention discloses a method for comprehensively apportioning the source contribution to fine particular matter (PM2.5) based on the receptor model and the chemical transport model, which comprises the receptor model calculation steps, chemical transport model calculation steps and comprehensive source apportionment steps; the said comprehensive source apportionment step comprises the following sub-steps: according to the principle of inverse proportionality between uncertainty and weight coefficient, the first (receptor model) uncertainty and the second (chemical transport model) uncertainty are normalized to obtain their respective weight coefficients; the comprehensive source apportionment results are calculated based on the apportionment results of the receptor model and the chemical transport model, and their respective weight coefficient.Type: ApplicationFiled: June 26, 2024Publication date: March 13, 2025Inventors: Zhenliang LI, Yunqing CAO, Yuhong QIAO, Chao PENG, Weikai FANG, Xiaochen WANG, Linfeng DUAN, Mulan CHEN, Min DU, Sheng ZHANG
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Publication number: 20250088486Abstract: A method for data sharing between cloud deployments is disclosed. A provider in a virtual private cloud (VPC) deployment generates a listing of data for sharing with a consumer in a public multi-tenant deployment. After creating a public account and transmitting a link associated with the listing to the consumer, the method responds to the consumer's selection of the link by automatically creating a secure shared area in the VPC deployment. The method includes replicating both a database and share object associated with the listing into the secure shared area as respective replicas. The replicated objects are then shared with the consumer account as data share objects, enabling the consumer to launch them in a consumer mounted database. The method concludes by enabling the consumer to perform database operations on the provider's data within the VPC deployment, ensuring secure and efficient data sharing between the cloud environments.Type: ApplicationFiled: November 25, 2024Publication date: March 13, 2025Inventors: Khondokar Sami Iqram, Laxman Mamidi, Sanjay Srivastava, Chieh-Sheng Wang, Di Wu