Abstract: A fully-automatic aluminum thermal-spraying corrosion prevention production line based on robots and visual recognition is provided. The production line comprises an automatic feeding system comprising feeding carrying and conveying mechanisms; a laser derusting system comprising a derusting robot, a laser cleaning nozzle and derusting conveying mechanisms; an aluminum thermal-spraying system comprising an aluminum spraying robot and an aluminum thermal-spraying gun; an automatic rolling system comprising a rolling pedestal, a first rolling wheel, a second rolling wheel and a rolling drive mechanism; a laser cutting system; and a discharging and stacking system.

Abstract: An integrated circuit for controlling a sensor chip capable of sensing various materials includes a plurality of amplifier clusters, a plurality of analog multiplexers, and at least one analog-to-digital converter coupled the analog multiplexers and configured to generate digital code values representative of electrical signals. Each of the amplifier clusters include four amplifiers, each amplifier has a first input coupled to a sensor of the sensor chip, and a second input coupled to a programmable voltage reference. Each one of the analog multiplexers is coupled to one of the amplifier clusters and configured to selectively pass through an electrical signal to the at least one analog-to-digital converter.

Abstract: Provided is a multi-chip interconnection system based on Peripheral Component Interconnect Express (PCIE) buses. The system includes: N accelerators, M processors, and M PCIE buses, N and M being positive integers, and M being greater than N. Each accelerator includes at least two endpoints. Each processor includes one root complex. One endpoint and one root complex are connected by means of one PCIE bus, so that the at least two endpoints of each accelerator are connected to at least two processors by means of different PCIE buses.

Abstract: A method for forming sequencing flow cells can include providing a semiconductor wafer covered with a dielectric layer and forming a patterned layer on the dielectric layer. The patterned layer has a differential surface that includes alternating first surface regions and second surface regions. The method can also include attaching a cover wafer to the semiconductor wafer to form a composite wafer structure including a plurality of flow cells. The composite wafer structure can then be singulated to form a plurality of dies. Each die forms a sequencing flow cell. The sequencing flow cell can include a flow channel between a portion of the patterned layer and a portion of the cover wafer, an inlet, and an outlet. Further, the method can include functionalizing the sequencing flow cell to create differential surfaces.

Abstract: A method for forming sequencing flow cells can include providing a semiconductor wafer covered with a dielectric layer, and forming a patterned layer on the dielectric layer. The patterned layer has a differential surface that includes alternating first surface regions and second surface regions. The method can also include attaching a cover wafer to the semiconductor wafer to form a composite wafer structure including a plurality of flow cells. The composite wafer structure can then be singulated to form a plurality of dies. Each die forms a sequencing flow cell. The sequencing flow cell can include a flow channel between a portion of the patterned layer and a portion of the cover wafer, an inlet, and an outlet. Further, the method can include functionalizing the sequencing flow cell to create differential surfaces.

Abstract: Embodiments of the invention provide an improved biosensor for biological or chemical analysis. According to embodiments of the invention, backside illumination (BSI) complementary metal-oxide-semiconductor (CMOS) image sensors can be used to effectively analyze and measure fluorescence or chemiluminescence of a sample. This measured value can be used to help identify a sample. Embodiments of the invention also provide methods of manufacturing an improved biosensor for biological or chemical analysis and systems and methods of DNA sequencing.

Abstract: An apparatus (100) including multiple biological chips (110,120) includes a substrate (101), a first adhesive layer (134) disposed on the substrate (101), a first biological chip (110) and a second biological chip (120) disposed on the first adhesive layer (134) and attached to the substrate (101) by the adhesive layer (134). The apparatus (100) further includes a filler (130) disposed between the first biological chip (110) and the second biological chip (120). The filler (130) includes a second adhesive layer (135) extending between a side surface (114) of the first biological chip (110) and a side surface (124) of the second biological chip (120), the second adhesive layer (135) attaching the first biological chip (110) to the second biological chip (120). The filler (130) also includes a surface layer (132) disposed over the second adhesive layer (135).

Abstract: Embodiments of the invention provide an improved biosensor for biological or chemical analysis. According to embodiments of the invention, backside illumination (BSI) complementary metal-oxide-semiconductor (CMOS) image sensors can be used to effectively analyze and measure fluorescence or chemiluminescence of a sample. This measured value can be used to help identify a sample. Embodiments of the invention also provide methods of manufacturing an improved biosensor for biological or chemical analysis and systems and methods of DNA sequencing.

Abstract: A microfluidic apparatus (100) can include a PCB (110), a biological chip (120) overlying the PCB (110), and a microfluidic housing (130) overlying the biological chip (120) and the PCB (110). The microfluidic apparatus (100) also has a first adhesive layer (141) attaching the microfluidic housing (130) to the biological chip (120) and a second adhesive layer (142) attaching the microfluidic housing (130) to the PCB (110). The second adhesive layer (142) is thicker than the first adhesive layer (141). The first adhesive layer (141) comprises a first adhesive material, and the second adhesive layer (142) comprises a second adhesive material.

Abstract: A photodiode (112,200,400,500) includes a semiconductor substrate (210) having a first surface (211) and a second surface (212,412,512), and a light sensing junction (220) located adjacent to the first surface (211). The second surface (212,412, 512) is located opposite the first surface (211), and the second surface (212,412,512) includes a concave surface covering a recessed region (415,515) in the semiconductor substrate (210).

Abstract: Provided are a chip matrix, a sequencing chip, and a manufacturing method thereof. The chip matrix includes: a wafer layer (111), the wafer layer (111) having cutting lines that are evenly distributed thereon; a first silicon oxide layer (112), the first silicon oxide layer (112) being made of silicon oxide and formed on an upper surface of the wafer layer (111); a transition metal oxide layer (113), the transition metal oxide layer (113) being made of transition metal oxide and formed on an upper surface of the first silicon oxide layer (112). The chip matrix has characteristics such as resistances against high temperature, high humidity and other harsh environments. Meanwhile, by changing pH, surfactant and other components of a solution containing sequences to be sequenced, a surface functional region of the chip matrix can specifically adsorb a sequence to be sequenced.

Abstract: An apparatus for forming a plurality of microdroplets (26a, 26?, 56) from a droplet (16, 26, 263) includes a substrate (12, 22, 22b, 22c, 1101), a dielectric layer (13, 23, 23b, 23c, 43a, 43b, 43) on the substrate (12, 22, 22b, 22c, 1101) and having a plurality of hydrophilic surface regions (48a, 491, 49) spaced apart from each other by a hydrophobic surface (44, 46), and a plurality of electrodes (14, 14a, 14b, 24, 24a, 24b, 24c, 34a, 34b, 34c) in the dielectric layer (13, 23, 23b, 23c, 43a, 43b, 43).

Abstract: A method for forming sequencing flow cells can include providing a semiconductor wafer covered with a dielectric layer, and forming a patterned layer on the dielectric layer. The patterned layer has a differential surface that includes alternating first surface regions and second surface regions. The method can also include attaching a cover wafer to the semiconductor wafer to form a composite wafer structure including a plurality of flow cells. The composite wafer structure can then be singulated to form a plurality of dies. Each die forms a sequencing flow cell. The sequencing flow cell can include a flow channel between a portion of the patterned layer and a portion of the cover wafer, an inlet, and an outlet. Further, the method can include functionalizing the sequencing flow cell to create differential surfaces.

Abstract: A method for forming sequencing flow cells can include providing a semiconductor wafer covered with a dielectric layer, and forming a patterned layer on the dielectric layer. The patterned layer has a differential surface that includes alternating first surface regions and second surface regions. The method can also include attaching a cover wafer to the semiconductor wafer to form a composite wafer structure including a plurality of flow cells. The composite wafer structure can then be singulated to form a plurality of dies. Each die forms a sequencing flow cell. The sequencing flow cell can include a flow channel between a portion of the patterned layer and a portion of the cover wafer, an inlet, and an outlet. Further, the method can include functionalizing the sequencing flow cell to create differential surfaces.

Abstract: The described embodiments may provide a method of fabricating a chemical detection device. The method may comprise forming a microwell above a CMOS device. The microwell may comprise a bottom surface and sidewalls. The method may further comprise applying a first chemical to be selectively attached to the bottom surface of the microwell, forming a metal oxide layer on the sidewalls of the microwell, and applying a second chemical to be selectively attached to the sidewalls of the microwell. The second chemical may lack an affinity to the first chemical.

Abstract: Embodiments of the invention provide an improved biosensor for biological or chemical analysis. According to embodiments of the invention, backside illumination (BSI) complementary metal-oxide-semiconductor (CMOS) image sensors can be used to effectively analyze and measure fluorescence or chemiluminescence of a sample. This measured value can be used to help identify a sample. Embodiments of the invention also provide methods of manufacturing an improved biosensor for biological or chemical analysis and systems and methods of DNA sequencing.

Abstract: In one implementation, a chemical device is described. The sensor includes a chemically-sensitive field effect transistor including a floating gate structure having a plurality of floating gate conductors electrically coupled to one another. A conductive element overlies and is in communication with an uppermost floating gate conductor in the plurality of floating gate conductors. The conductive element is wider and thinner than the uppermost floating gate conductor. A dielectric material defines an opening extending to an upper surface of the conductive element.

Abstract: In one implementation, a method for manufacturing a chemical detection device is described. The method includes forming a chemical sensor having a sensing surface. A dielectric material is deposited on the sensing surface. A first etch process is performed to partially etch the dielectric material to define an opening over the sensing surface and leave remaining dielectric material on the sensing surface. An etch protect material is formed on a sidewall of the opening. A second etch process is then performed to selectively etch the remaining dielectric material using the etch protect material as an etch mask, thereby exposing the sensing surface.

Abstract: A chemical sensor is described. The chemical sensor includes a chemically-sensitive field effect transistor including a floating gate conductor having an upper surface. A material defines an opening extending to the upper surface of the floating gate conductor, the material comprising a first dielectric underlying a second dielectric. A conductive element contacts the upper surface of the floating gate conductor and extending a distance along a sidewall of the opening.

Abstract: A left-handed material extended interaction klystron includes: an input cavity, a middle cavity, an output cavity, first-section drift tube and a second-section drift tube; wherein the input cavity, the middle cavity and the output cavity are all cylindrical resonant cavities having arrays of Complementary electric Split-Ring Resonator (CeSRR) unit cells provided therein; wherein a first side of the input cavity is an input channel of an electron beam, a second side connects the middle cavity via the first-section drift tube; a first T-shaped coaxial input structure is provided in the input cavity; a first side of the output cavity is for connecting a collector, a second side of the output cavity connects the middle cavity via the second-section drift tube, a second T-shaped coaxial output structure is provided in the output cavity.