Patents by Inventor Shigeru Hirata

Shigeru Hirata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11494896
    Abstract: A collation device includes a processor configured to: acquire plural captured images obtained by capturing an inspection image to be collated, while changing an irradiation direction of light to be emitted; and provide a notification of a collation result between the inspection image included in each of the captured images, and a collation image of which pattern changes depending on the irradiation direction of the light, according to a similarity between plural registered images obtained by capturing in advance the collation image while changing the irradiation direction of the light to be emitted to the collation image, and the inspection image, after adjusting a positional relationship between a camera, a light source, and an image to be identical to a positional relationship between a camera that captures the inspection image at a time of capturing the inspection image, a light source that irradiates the inspection image with light, and the inspection image.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: November 8, 2022
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Shigeru Yamamoto, Kazuhiro Hirata, Nobuhiro Kitagawa
  • Publication number: 20220303997
    Abstract: The present technology relates to a communication apparatus and an information processing method that make it possible to appropriately reduce inter-link interference. The communication apparatus according to the present technology acquires, in a case of simultaneously performing transmission and reception of a data signal with another communication apparatus using a plurality of Links, first interference information concerning interference between Links occurring in the other communication apparatus from the other communication apparatus, and decides a transmission parameter to be used by the other communication apparatus for transmission of a data signal on a basis of the first interference information and second interference information concerning interference between the Links occurring in the communication apparatus. The present technology is applicable to a wireless communication system.
    Type: Application
    Filed: October 26, 2020
    Publication date: September 22, 2022
    Applicant: Sony Group Corporation
    Inventors: Kosuke AIO, Ryuichi HIRATA, Shigeru SUGAYA
  • Publication number: 20220272963
    Abstract: A cell cryopreservation method including adding a 1 volume % of a composition comprising 0.01 wt % to 20 wt % of a sophorose lipid to cells in a cell culture medium just before or up to 6 hours before cryopreserving the cells; and cryopreserving the cell culture medium, wherein the composition improves cell viability after cryopreservation compared to cells that are cryopreserved with a similar composition that does not contain the sophorose lipid.
    Type: Application
    Filed: May 19, 2022
    Publication date: September 1, 2022
    Inventors: Asuka Nogami, Motoki Tatsumi, Nanase Ishii, Mizuyuki Ryu, Yoshihiko Hirata, Yoshiki Sawa, Shigeru Miyagawa, Atsuhiro Saito, Hirotatsu Ohkawara
  • Publication number: 20220273444
    Abstract: An artificial joint is characterized by: having a first member including a caput part on which a prescribed curved surface is formed, and a second member including a fossa part having a surface which abuts the prescribed curved surface of the caput part; the second member being rotatable in a flexing direction of a joint with a prescribed point on the caput part being the center of rotation; and the prescribed curved surface of the caput part being defined by a curve which depicts a convex arc toward the side abutting the fossa part when the caput part is viewed from the axial direction of the rotation, and in which, when two arbitrary points are taken on the curve, the radius of curvature of the point positioned further toward the flexing side of the joint on the curve is smaller than the radius of curvature of the other point.
    Type: Application
    Filed: August 21, 2020
    Publication date: September 1, 2022
    Applicant: NIPRO CORPORATION
    Inventors: Hitoshi HIRATA, Shigeru KURIMOTO, Shunsuke NOTAZAWA, Yuto OTANI
  • Patent number: 11395178
    Abstract: Provided are a communication apparatus and a communication method for transmitting and receiving wireless packets. A communication apparatus includes: a communication unit configured to transmit and receive a packet in a predetermined occupied band; and a partial band processing unit configured to provide a control signal area including predetermined control information in a part of the occupied band of the packet transmitted from the communication unit. The control information includes a plurality of synchronization signals at defined time intervals, and includes information for a third station that is not a destination of the packet, such as information regarding a NAV, a network identifier for identifying a network to which the communication apparatus belongs, transmission power information of the packet, allowable interference amount information, and remaining time information of the packet.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: July 19, 2022
    Assignee: SONY CORPORATION
    Inventors: Yuichi Morioka, Shigeru Sugaya, Kosuke Aio, Ryuichi Hirata
  • Patent number: 11227822
    Abstract: A semiconductor device includes a first lead having a base extending in a first direction, and an IC on the base. The semiconductor device also includes a second lead, a third lead and fourth leads. The second lead includes a first belt-like section on one side of the base in the first direction, extending in a second direction, and paired second belt-like sections extending in the first direction from the first belt-like section. The third lead is on one side in the first direction. The fourth leads are on one side of the third lead in the first direction. First switching elements are bonded to the third lead. Second switching elements are respectively bonded to the fourth leads. The base overlaps with the first belt-like section 121 when viewed in the first direction. At least a part of the base is between the second belt-like sections.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: January 18, 2022
    Assignee: ROHM CO., LTD.
    Inventor: Shigeru Hirata
  • Publication number: 20210317555
    Abstract: Alloy compositions, structures, and production methods for an appropriate slit cut surface shape improve productivity by increasing welding speed and stabilizing quality during high speed welding in Ti-containing Fe—Ni—Cr alloy production. The Ti-containing Fe—Ni—Cr alloy contains, hereinafter in weight %, C: 0.001 to 0.03%, Si: 0.05 to 1.25%, Mn: 0.10 to 2.00%, P: 0.001 to 0.030%, S: 0.0001 to 0.0030%, Ni: 15 to 50%, Cr: 17 to 25%, Al: 0.10 to 0.80%, Ti: 0.10 to 1.5%, N: 0.003 to 0.025%, 0: 0.0002 to 0.007%, Fe as a remainder, and inevitable impurities, and when the number and size of titanium nitrides contained in material are evaluated in a freely selected field of view of 5 mm2, the titanium nitrides having sizes of not more than 15 ?m are not less than 99.3% of total of the titanium nitrides.
    Type: Application
    Filed: September 17, 2019
    Publication date: October 14, 2021
    Applicant: Nippon Yakin Kogyo Co., Ltd.
    Inventors: Toshio MIURA, Kazuhito TAKIMOTO, Fumiaki KIRIHARA, Shigeru HIRATA
  • Publication number: 20210151366
    Abstract: A semiconductor device includes a first lead having a base extending in a first direction, and an IC on the base. The semiconductor device also includes a second lead, a third lead and fourth leads. The second lead includes a first belt-like section on one side of the base in the first direction, extending in a second direction, and paired second belt-like sections extending in the first direction from the first belt-like section. The third lead is on one side in the first direction. The fourth leads are on one side of the third lead in the first direction. First switching elements are bonded to the third lead. Second switching elements are respectively bonded to the fourth leads. The base overlaps with the first belt-like section 121 when viewed in the first direction. At least a part of the base is between the second belt-like sections.
    Type: Application
    Filed: April 12, 2019
    Publication date: May 20, 2021
    Inventor: Shigeru HIRATA
  • Patent number: 10927438
    Abstract: Provided is an Fe—Ni—Cr alloy that has excellent surface characteristics and enables formation of a blackened coating having excellent blackening characteristics and peeling resistance. The Fe—Ni—Cr alloy has a chemical composition containing, by mass %, C, Si, Mn, P, S, Cr, Ni, Mo, Co, Cu, N, Ti, Al, O, and H, the balance being Fe and inevitable impurities, and satisfying formulae (1) to (4): (1) T1=11×[% N]+0.1; (2) T2=?39×[% N]?1.0; (3) A1=7.5×[% N]+0.1; (4) A2=?42.5×[% N]+1.0, where [% M] represents content (mass %) of element M in the alloy, and T1, T2, A1, and A2 satisfy relationships T1<[% Ti]<T2 and A1<[% A1]<A2.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: February 23, 2021
    Assignee: Nippon Yakin Kogyo Co., Ltd.
    Inventors: Kazuhiro Yamakawa, Shigeru Hirata, Kun Wang, Hidekazu Todoroki
  • Patent number: 10832996
    Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: November 10, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Yasumasa Kasuya, Hiroaki Matsubara, Hiroshi Kumano, Toshio Nakajima, Shigeru Hirata, Yuji Ishimatsu
  • Publication number: 20200251410
    Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.
    Type: Application
    Filed: April 20, 2020
    Publication date: August 6, 2020
    Inventors: Yasumasa KASUYA, Hiroaki MATSUBARA, Hiroshi KUMANO, Toshio NAKAJIMA, Shigeru HIRATA, Yuji ISHIMATSU
  • Patent number: 10679928
    Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: June 9, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Yasumasa Kasuya, Hiroaki Matsubara, Hiroshi Kumano, Toshio Nakajima, Shigeru Hirata, Yuji Ishimatsu
  • Publication number: 20190360079
    Abstract: Provided is an Fe—Ni—Cr alloy that has excellent surface characteristics and enables formation of a blackened coating having excellent blackening characteristics and peeling resistance. The Fe—Ni—Cr alloy has a chemical composition containing, by mass %, C, Si, Mn, P, S, Cr, Ni, Mo, Co, Cu, N, Ti, Al, O, and H, the balance being Fe and inevitable impurities, and satisfying formulae (1) to (4): (1) T1=11×[% N]+0.1; (2) T2=?39×[% N]?1.0; (3) A1=7.5×[% N]+0.1; (4) A2=?42.5×[% N]+1.0, where [% M] represents content (mass %) of element M in the alloy, and T1, T2, A1, and A2 satisfy relationships T1<[% Ti]<T2 and A1<[% A1]<A2.
    Type: Application
    Filed: March 14, 2017
    Publication date: November 28, 2019
    Applicant: Nippon Yakin Kogyo Co., Ltd.
    Inventors: Kazuhiro YAMAKAWA, Shigeru HIRATA, Kun WANG, Hidekazu TODOROKI
  • Publication number: 20180040540
    Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.
    Type: Application
    Filed: August 1, 2017
    Publication date: February 8, 2018
    Inventors: Yasumasa KASUYA, Hiroaki MATSUBARA, Hiroshi KUMANO, Toshio NAKAJIMA, Shigeru HIRATA, Yuji ISHIMATSU
  • Patent number: 9812408
    Abstract: A semiconductor device has a supply pad to which a supply voltage is fed, a supply conductor that is electrically connected to the supply pad, an input/output pad via which a signal is fed in from outside or fed out to outside, an electrostatic protection device that is electrically connected to the input/output pad and that is electrically connected via the supply conductor to the supply pad, and an internal circuit that is electrically connected via a signal conductor to the input/output pad. The electrostatic protection device, the input/output pad, and the internal circuit are arranged in this order from edge to center of the semiconductor device.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: November 7, 2017
    Assignee: Rohm Co., Ltd.
    Inventor: Shigeru Hirata
  • Patent number: 9777356
    Abstract: An austenitic Fe—Ni—Cr alloy comprises C: 0.005˜0.03 mass %, Si: 0.17˜1.0 mass %, Mn: not more than 2.0 mass %, P: not more than 0.030 mass %, S: not more than 0.0015 mass %, Cr: 18˜28 mass %, Ni: 21.5˜32 mass %, Mo: 0.10˜2.8 mass %, Co: 0.05˜2.0 mass %, Cu: less than 0.25 mass %, N: not more than 0.018 mass %, Al: 0.10˜1.0 mass %, Ti: 0.10˜1.0 mass %, Zr: 0.01˜0.5 mass %, and the balance being Fe and inevitable impurities; wherein Cr, Mo, N and Cu satisfy PRE=Cr+3.3×Mo+16×N?20.0 and PREH=411-13.2×Cr-5.8×Mo+0.1×Mo2+1.2×Cu?145.0 and wherein Al, Ti, and Zr satisfy 0.5?Al+Ti+1.5×Zr?1.5, and has an excellent corrosion resistance in air or under a wet environment even at a surface state having an oxide film formed by an intermediate heat treatment.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: October 3, 2017
    Assignee: NIPPON YAKIN KOGYO CO., LTD.
    Inventors: Kazuhiro Yamakawa, Shigeru Hirata, Kun Wang
  • Patent number: 9528173
    Abstract: High-Mn austenitic stainless steels having a chemical composition comprising C: 0.02-0.12 mass %, Si: 0.05-1.5 mass %, Mn: 10.0-22.0 mass %, S: not more than 0.0028 mass %, Ni: 4.0-12.0 mass %, Cr: 14.0-25.0 mass % and N: 0.07-0.17 mass % with the balance being Fe and inevitable impurities, provided that these components are contained so that ? cal represented by the following equation is not more than 5.5%: ? cal (mass %)=(Cr+0.48Si)?(Ni+0.11Mn?0.0101Mn2+26.4C+20.1N)?4.7, wherein each element symbol in the equation is a content of the respective element (mass %), and having a magnetic permeability of not more than 1.003 under a magnetic field of 200 kA/m.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: December 27, 2016
    Assignee: NIPPON YAKIN KOGYO CO., LTD.
    Inventors: Shigeru Hirata, Yuji Ikegami, Kazuhiro Yamakawa
  • Patent number: 9391549
    Abstract: A motor driving device includes a clock oscillator configured to generate a clock signal; and a logic unit configured to receive the clock signal, control conduction of a 3-phase brushless direct current (DC) motor, and generate a revolutions per minute (RPM) detection signal. The clock oscillator is configured to switch an oscillation frequency of the clock signal depending on an RPM command signal input to set a target RPM of the 3-phase brushless DC motor.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: July 12, 2016
    Assignee: Rohm Co., Ltd.
    Inventor: Shigeru Hirata
  • Patent number: D824866
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: August 7, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Hiroaki Matsubara, Yasumasa Kasuya, Shigeru Hirata
  • Patent number: D902877
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: November 24, 2020
    Assignee: ROHM CO., LTD.
    Inventor: Shigeru Hirata