Packaged semiconductor module
Latest ROHM CO., LTD. Patents:
Description
Claims
The ornamental design for a packaged semiconductor module, as shown and described.
Referenced Cited
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Patent History
Patent number: D902877
Type: Grant
Filed: Dec 3, 2018
Date of Patent: Nov 24, 2020
Assignee: ROHM CO., LTD. (Kyoto)
Inventor: Shigeru Hirata (Kyoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/672,087
Type: Grant
Filed: Dec 3, 2018
Date of Patent: Nov 24, 2020
Assignee: ROHM CO., LTD. (Kyoto)
Inventor: Shigeru Hirata (Kyoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/672,087
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)