Abstract: An ultrasonic vibration bonding machine which can simplify a suction passage structure. A resonator has a suction passage at the maximum vibration amplitude point where a bonding working portion is provided, the positions of the pads of a circuit board mounted on a mounting unit and the positions of the pads of a semiconductor chip absorbed and adsorbed to the bonding working portion are measured to align the pads accurately, and then the pads are bonded together.

Abstract: A muffler for an internal combustion engine has a vertically elongated expansion chamber into which an exhaust gas from the exhaust port of internal combustion engine is introduced. The expansion chamber is separated level-wise into a first expansion chamber and a second expansion chamber by a partition plate. An exhaust emission purifier formed of an oxidation catalyst is attached to the partition plate, thereby allowing the exhaust gas ejected from the exhaust port to be introduced into the second expansion chamber from the first expansion chamber via the exhaust emission purifier. The exhaust emission purifier is spaced apart from the exhaust port by a predetermined distance in a direction orthogonal to an ejecting direction of the exhaust gas.

Abstract: A signal selecting circuit comprises a first switch means connected between a first input terminal and a common output terminal, a second switch means connected between a second input terminal and the common output terminal, a first microstrip line for connecting the first switch means and the common output terminal, and a second microstrip line for connecting the second switch means and the common output terminal, wherein a length of the first microstrip line is set to be approximately odd-numbered times of 1/4 wavelength of a frequency of an image signal relative to the second mode reception signal, and a length of the second microstrip line is set to be approximately odd-numbered times of 1/4 wavelength of a frequency of an image signal relative to the first mode reception signal.

Abstract: An agent for preventing scale formation and a method for preventing scale formation include a polymer which has at least 50% of N-vinyl formamide units or N-vinyl acetamide units and a phosphorus compound added to water in a cooling water system, a boiler water system, or the like. The scale preventing agent and scale preventing method of the present invention are effective in preventing the adherence of various types of scales which are generated in cooling water systems, boiler water systems, and the like. In particular, the present invention is effective in preventing the adherence of silica and calcium scale.

Abstract: In order to realize effective and economical bonding operation even on workpiece whose inside is quite deep, a bonding tool, which has a length equivalent to a whole number of multiples of half the wavelength of the resonance frequency, is secured to an ultrasonic horn by a screw member which can advance or retreat in a direction perpendicular to the vibration direction indicated by an arrow X,thereby causing a front end surface of the bonding tool vibrate in the same direction as the vibration of the ultrasonic horn.

Abstract: A disk-shaped cutter extending in a direction perpendicular to the central axis of a resonator is detachably installed on the resonator which is molded substantially cylindrical with a fastening unit.

Abstract: A shutter mechanism for an electrode pad attached card and a contact comprises a slider which can reciprocally move forwardly and backwardly in accordance with insertion and withdrawal of an electrode pad attached card. A contact guide groove is formed in the slider in such a manner as to extend in a direction of the reciprocal movement of the slider and adapted to guide a contacting projection of a contact. A release groove is formed in a bottom surface of the contact guide groove, the release groove having a smaller width than that of the guide groove and extending in the direction of the reciprocal movement of the slider. The release groove is in opposing relation with the contacting projection, a slip portion formed at an area in the vicinity of the contacting projection, the slip portion being resiliently contacted with a stepped portion formed along an opening edge of the release groove.

Abstract: In an IC socket in which IC leads of an IC package are pressed down by a presser member so as to be contacted with and retained by contacts arranged on the socket, an IC socket for an IC package comprises an IC mount which is upwardly and downwardly movably interposed between the socket and the presser member. The IC mount is formed with through-holes or through-grooves, and the contacts each having a vertical slit are inserted into the through-holes or through-grooves. The IC leads of the IC package placed on the IC mount are pressed down together with the IC mount by the presser member such that distal end portions of the contacts are relatively protruded upwardly from the through-holes of the IC mount as the IC leads are pressed down, so that the IC leads are pushed into the vertical slits.

Abstract: A magnetic resonance imaging system includes a lower body which has a flat upper surface, and contains a first magnetic pole, an upper body which has a lower surface disposed in opposed relation to the upper surface of the lower body, and contains a second magnetic pole, a bed disposed adjacent to the lower body, and a pair of support posts which are provided respectively on right and left sides of the lower body, and interconnect the lower body and the upper body. A space, formed between the lower surface of the upper body and the upper surface of the lower body, is open at least toward the bed between the pair of right and left support posts.

Abstract: According to the present invention, there is provided a satellite broadcast receiving converter which comprises a waveguide in which the broadcast wave travelling therein travels as a first TE11 mode linearly polarized wave and as a second TE mode linearly polarized wave intersecting at a right angle with each other, a first probe disposed at a predetermined position within this waveguide for detecting the first linearly polarized wave, a first reflecting conductor disposed approximately 1/4 of the wavelength separate from the first probe in the direction in which the electric wave travels for reflecting the first linearly polarized wave, a second probe disposed in the neighborhood of the first reflecting conductor for detecting the second linearly polarized wave, and a second reflecting conductor disposed approximately 1/4 of the wavelength from the second probe in the direction in which the electric wave travels for reflecting the second linearly polarized wave.

Abstract: A card-in type shield connector is to be inserted into an electronic device in order to add a memory function to the electronic device. The card-in type shield connector includes a contact element disposed within a flat and thin insulative case into which a memory card can be withdrawably inserted, and a card ejection mechanism disposed within the flat and thin insulative case and adapted to eject the memory card from inside the flat and thin insulative case. An outer surface of the flat and thin insulative case is shielded by a shield plate.

Abstract: A resonator for an ultrasonic bonding apparatus, which comprises an ultrasonic horn having a recessed portion in the exterior surface and a threaded hole, a bonding working portion having a chip base fitted in the recessed portion and a chip body provided on the chip base, and a screw member having a screw portion to fit into the threaded hole and a through-hole through which the chip body is put without contact with said screw member so that the screw member is screwed into the threaded hole, the bonding portion is fixed to the ultrasonic horn, with the chip body projecting through the through-hole for contact with a workpiece.

Abstract: A card-in type connector is to be inserted into an electronic device in order to add a memory function to the electronic device. A contact to be contacted with a memory card is disposed within a thin and flat type insulative case into which the memory card is withdrawably inserted and, a pair of spaced apart, parallel cantilever arms extend forwardly from a distal end of the thin and flat type insulative case. A wiring board is interposed between the cantilever arms and an end portion of the contact is connected to a rear end portion of the wiring board by soldering. A connecting device to be withdrawably inserted into a connecting device on the electronic device side is interposed between front end portions of the cantilever arms, and an end portion of a contact of the connecting device is connected to a front end portion of the wiring board by soldering.

Abstract: An ultrasonic vibration bonding chip mounter includes a chip carrying unit arranged above a chip supply unit, a prealignment unit and a mounting unit which are arranged in a row and having a movable table which can move back and forth in a direction parallel to a direction where these units are arranged, a pick-up unit, attached to the movable table, for transferring a chip from the chip supply unit to the prealignment unit, and an ultrasonic vibration bonding unit, attached to the movable table, for transferring the chip from the prealignment unit to a mounting unit so that the chips are transferred from the chip supply unit to the prealignment unit and further to the mounting unit by the reciprocation of the movable table one by one.

Abstract: A support portion for attaching a horn main body to a solder tank is provided on the horn main body at a nodal point f2 and ultrasonic vibration from an external transducer is transmitted to solder in the solder tank through the horn main body.