Patents by Inventor Shih-Cheng Huang

Shih-Cheng Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210280565
    Abstract: A semiconductor device package includes a first conductive structure, a stress buffering layer and a second conductive structure. The first conductive structure includes a substrate, at least one first electronic component embedded in the substrate, and a first circuit layer disposed on the substrate and electrically connected to the first electronic component. The first circuit layer includes a conductive wiring pattern. The stress buffering layer is disposed on the substrate. The conductive wiring pattern of the first circuit layer extends through the stress buffering layer. The second conductive structure is disposed on the stress buffering layer and the first circuit layer.
    Type: Application
    Filed: May 25, 2021
    Publication date: September 9, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Mei HUANG, Shih-Yu WANG, I-Ting LIN, Wen Hung HUANG, Yuh-Shan SU, Chih-Cheng LEE, Hsing Kuo TIEN
  • Publication number: 20210271224
    Abstract: The present invention relates generally to a Cloud real-time textile intelligent production information management monitoring and prewarning integrated system, which comprises a sensing device, a communication system, a server, a central information integration system and an end device.
    Type: Application
    Filed: February 27, 2020
    Publication date: September 2, 2021
    Inventors: I-MIN LIN, YU-CHENG HUANG, MING-WANG LIN, SHIH-CHEH SUNG, YU-HSIANG SU
  • Publication number: 20210193107
    Abstract: An electronic system is provided. The electronic system includes a host and a display. The host includes an audio processing module, and a smart interpreter engine. The audio processing module is utilized for acquiring audio data corresponding to a first language from audio streams processed by an application program executed on the host. The application program executed on the host includes a specific game software. The smart interpreter engine is utilized for receiving the audio data corresponding to the first language from the audio processing module and converting the audio data corresponding to the first language into text data corresponding to a second language according to the game software executed on the host The display is utilized for receiving the text data corresponding to the second language from the smart interpreter engine and displaying the text data corresponding to the second language.
    Type: Application
    Filed: March 3, 2021
    Publication date: June 24, 2021
    Inventors: GIANNA TSENG, Szu-Ting Chou, Shang-Yao Lin, Shih-Cheng Huang
  • Patent number: 10971132
    Abstract: An electronic system is provided. The electronic system includes a host, an audio output device and a display. The host includes an audio processing module, a relay processing module, a smart interpreter engine and a driver. The audio processing module is utilized for acquiring audio data corresponding to a first language from audio streams processed by an application program executed on the host. The smart interpreter engine is utilized for converting the audio data corresponding to the first language into text data corresponding to a second language. The relay processing module is utilized for transmitting the text data corresponding to the second language to the display for displaying. The driver is utilized for converting the data corresponding to the first language into an analog audio signal corresponding to the first language and transmitting the analog audio signal corresponding to the first language to the audio output device for playback.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: April 6, 2021
    Assignee: ACER INCORPORATED
    Inventors: Gianna Tseng, Szu-Ting Chou, Shang-Yao Lin, Shih-Cheng Huang
  • Publication number: 20200286488
    Abstract: A multimedia processing circuit is provided. The multimedia processing circuit includes a smart interpreter engine and an audio engine. The smart interpreter engine includes a speech to text converter, a natural language processing module and a translator. The speech to text converter is utilized for converting speech data into text data corresponding to the first language. The natural language processing module is utilized for converting the text data corresponding to the first language into glossary text data corresponding to the first language according to an application program being executed in a host. The application program comprises a specific game software. The translator is utilized for converting the glossary text data corresponding to the first language into text data corresponding to a second language. The audio engine is utilized for converting the speech data corresponding to the first language into an analog speech signal corresponding to the first language.
    Type: Application
    Filed: May 26, 2020
    Publication date: September 10, 2020
    Inventors: GIANNA TSENG, Shih-Cheng Huang, Shang-Yao Lin, Szu-Ting Chou
  • Patent number: 10706855
    Abstract: A multimedia processing circuit is provided. The multimedia processing circuit includes a smart interpreter engine and an audio engine. The smart interpreter engine includes a noise suppression module, a vocal identification module and a speech to text converter. The noise suppression module is utilized for performing a noise suppression process on speech data corresponding to a first language. The vocal identification module is utilized for performing a vocal identification process on the noise-suppressed speech data corresponding to the first language to generate vocal identification data corresponding to the first language. The speech to text converter is utilized for converting the vocal identification data corresponding to the first language into text data corresponding to the first language.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: July 7, 2020
    Assignee: ACER INCORPORATED
    Inventors: Gianna Tseng, Shih-Cheng Huang, Shang-Yao Lin, Szu-Ting Chou
  • Publication number: 20200074980
    Abstract: An electronic system is provided. The electronic system includes a host, an audio output device and a display. The host includes an audio processing module, a relay processing module, a smart interpreter engine and a driver. The audio processing module is utilized for acquiring audio data corresponding to a first language from audio streams processed by an application program executed on the host. The smart interpreter engine is utilized for converting the audio data corresponding to the first language into text data corresponding to a second language. The relay processing module is utilized for transmitting the text data corresponding to the second language to the display for displaying. The driver is utilized for converting the data corresponding to the first language into an analog audio signal corresponding to the first language and transmitting the analog audio signal corresponding to the first language to the audio output device for playback.
    Type: Application
    Filed: June 3, 2019
    Publication date: March 5, 2020
    Inventors: GIANNA TSENG, Szu-Ting Chou, Shang-Yao Lin, Shih-Cheng Huang
  • Publication number: 20200075023
    Abstract: A multimedia processing circuit is provided. The multimedia processing circuit includes a smart interpreter engine and an audio engine. The smart interpreter engine includes a noise suppression module, a vocal identification module and a speech to text converter. The noise suppression module is utilized for performing a noise suppression process on speech data corresponding to a first language. The vocal identification module is utilized for performing a vocal identification process on the noise-suppressed speech data corresponding to the first language to generate vocal identification data corresponding to the first language. The speech to text converter is utilized for converting the vocal identification data corresponding to the first language into text data corresponding to the first language.
    Type: Application
    Filed: November 26, 2018
    Publication date: March 5, 2020
    Inventors: GIANNA TSENG, Shih-Cheng Huang, Shang-Yao Lin, Szu-Ting Chou
  • Patent number: 10164142
    Abstract: A flip chip light emitting diode includes a semiconductor layer comprising an epitaxial layer an N-semiconductor layer, a light active layer and a P-semiconductor layer arranged from top to bottom in series. A first electrode mounted on the semiconductor layer. A second electrode mounted on the semiconductor layer. A insulating layer mounted on the semiconductor layer. The N-semiconductor layer protrudes away from the epitaxial layer to form a protruding portion. The light active layer and the P-semiconductor layer mounts on the protruding portion in series. The insulating layer mounts between the first electrode and the protruding portion, the light active layer, the P-semiconductor layer and the second electrode. The flip chip light emitting diode also comprises a supporting portion, the supporting portion is mounted on a top surface of the epitaxial layer by a connecting portion. The connecting portion has same or different materials with the supporting portion.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: December 25, 2018
    Assignees: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC., Innolux Corporation
    Inventors: Po-Min Tu, Chien-Shiang Huang, Chien-Chung Peng, Tzu-Chien Hung, Shih-Cheng Huang, Chang-Ho Chen, Tsau-Hua Hsieh, Jong-Jan Lee, Paul-John Schuele
  • Patent number: 10109770
    Abstract: A light emitting diode includes a first electrode, a second electrode, and an epitaxial structure. The epitaxial structure is arranged on the first electrode, and electrically connects with the first electrode and the second electrode. The second electrode surrounds periphery of the epitaxial structure to reflect light from the epitaxial structure out from the top of the epitaxial structure. A method for manufacturing the light emitting diode is also presented. The light emitting diode and the method increase lighting efficiency of the light emitting diode.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: October 23, 2018
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC
    Inventors: Ching-Hsueh Chiu, Chia-Hung Huang, Ya-Wen Lin, Po-Min Tu, Shih-Cheng Huang
  • Patent number: 10050176
    Abstract: An LED die includes a substrate, a pre-growth layer, a first insulating layer and a light emitting structure. The pre-growth layer, the first insulating layer and the light emitting structure are formed on the structure that order. The substrate includes a first electrode, a second electrode and an insulating part. The insulating part is formed between the first electrode and the second electrode. The LED die further includes a second insulating layer and a metal layer which are formed around the pre-growth layer. The present disclosure includes a method for manufacturing the LED die.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: August 14, 2018
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Ching-Hsueh Chiu, Ya-Wen Lin, Po-Min Tu, Shih-Cheng Huang
  • Patent number: 10050188
    Abstract: A light emitting diode chip comprises a light emitting diode chip core and a coating layer. The coating layer covers side surfaces of the light emitting diode chip core. And a display composed of the light emitting diode chips is also provided.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: August 14, 2018
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC
    Inventors: Chia-Hui Shen, Tzu-Chien Hung, Chien-Chung Peng, Chien-Shiang Huang, Shih-Cheng Huang, Chih-Jung Liu
  • Publication number: 20180212105
    Abstract: A flip chip light emitting diode includes a semiconductor layer comprising an epitaxial layer an N-semiconductor layer, a light active layer and a P-semiconductor layer arranged from top to bottom in series. A first electrode mounted on the semiconductor layer. A second electrode mounted on the semiconductor layer. A insulating layer mounted on the semiconductor layer. The N-semiconductor layer protrudes away from the epitaxial layer to form a protruding portion. The light active layer and the P-semiconductor layer mounts on the protruding portion in series. The insulating layer mounts between the first electrode and the protruding portion, the light active layer, the P-semiconductor layer and the second electrode. The flip chip light emitting diode also comprises a supporting portion, the supporting portion is mounted on a top surface of the epitaxial layer by a connecting portion. The connecting portion has same or different materials with the supporting portion.
    Type: Application
    Filed: June 27, 2017
    Publication date: July 26, 2018
    Inventors: PO-MIN TU, CHIEN-SHIANG HUANG, CHIEN-CHUNG PENG, TZU-CHIEN HUNG, SHIH-CHENG HUANG, CHANG-HO CHEN, TSAU-HUA HSIEH, JONG-JAN LEE, PAUL-JOHN SCHUELE
  • Patent number: 9978728
    Abstract: A display apparatus and a fabricating method thereof are provided. The display apparatus includes a substrate, a light emitting diode, a first bump, a first insulating layer and a second insulating layer. The light emitting diode has a first surface and a second surface opposite each other, wherein the first surface faces the substrate. The light emitting diode is bonded to the substrate through the first bump. The first insulating layer is disposed on a periphery of the first bump and the light emitting diode, and contacts the first bump and the first surface. The second insulating layer is disposed on the substrate and surrounds at least a portion of the first insulating layer.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: May 22, 2018
    Assignees: Innolux Corporation, Advanced Optoelectronics Technology Inc.
    Inventors: Chun-Hsien Lin, Tsau-Hua Hsieh, Po-Min Tu, Tzu-Chien Hung, Chien-Chung Peng, Shih-Cheng Huang
  • Publication number: 20180040793
    Abstract: A light emitting diode chip comprises a light emitting diode chip core and a coating layer. The coating layer covers side surfaces of the light emitting diode chip core. And a display composed of the light emitting diode chips is also provided.
    Type: Application
    Filed: April 10, 2017
    Publication date: February 8, 2018
    Inventors: CHIA-HUI SHEN, TZU-CHIEN HUNG, CHIEN-CHUNG PENG, CHIEN-SHIANG HUANG, SHIH-CHENG HUANG, CHIH-JUNG LIU
  • Publication number: 20170373227
    Abstract: A light emitting diode includes a first electrode, a second electrode, and an epitaxial structure. The epitaxial structure is arranged on the first electrode, and electrically connects with the first electrode and the second electrode. The second electrode surrounds periphery of the epitaxial structure to reflect light from the epitaxial structure out from the top of the epitaxial structure. A method for manufacturing the light emitting diode is also presented. The light emitting diode and the method increase lighting efficiency of the light emitting diode.
    Type: Application
    Filed: August 22, 2017
    Publication date: December 28, 2017
    Inventors: CHING-HSUEH CHIU, CHIA-HUNG HUANG, YA-WEN LIN, PO-MIN TU, SHIH-CHENG HUANG
  • Publication number: 20170345801
    Abstract: A display apparatus and a fabricating method thereof are provided. The display apparatus includes a substrate, a light emitting diode, a first bump, a first insulating layer and a second insulating layer. The light emitting diode has a first surface and a second surface opposite each other, wherein the first surface faces the substrate. The light emitting diode is bonded to the substrate through the first bump. The first insulating layer is disposed on a periphery of the first bump and the light emitting diode, and contacts the first bump and the first surface. The second insulating layer is disposed on the substrate and surrounds at least a portion of the first insulating layer.
    Type: Application
    Filed: May 24, 2017
    Publication date: November 30, 2017
    Applicants: Innolux Corporation, Advanced Optoelectronic Technology Inc.
    Inventors: Chun-Hsien Lin, Tsau-Hua Hsieh, Po-Min Tu, Tzu-Chien Hung, Chien-Chung Peng, Shih-Cheng Huang
  • Patent number: 9786818
    Abstract: A light emitting diode includes a first electrode, a second electrode and an epitaxial structure. The epitaxial structure is arranged on the first electrode, and electrically connects with the first electrode and the second electrode. The second electrode surrounds periphery of the epitaxial structure to reflect light from the epitaxial structure to emit out from the top of the epitaxial structure. This disclosure also relates to a method for manufacturing the light emitting diode. The light emitting diode and the method help solve the problem of low light efficiency of the light emitting diode.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: October 10, 2017
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Ching-Hsueh Chiu, Chia-Hung Huang, Ya-Wen Lin, Po-Min Tu, Shih-Cheng Huang
  • Publication number: 20170271558
    Abstract: An LED die includes a substrate, a pre-growth layer, a first insulating layer and a light emitting structure. The pre-growth layer, the first insulating layer and the light emitting structure are formed on the structure that order. The substrate includes a first electrode, a second electrode and an insulating part. The insulating part is formed between the first electrode and the second electrode. The LED die further includes a second insulating layer and a metal layer which are formed around the pre-growth layer. The present disclosure includes a method for manufacturing the LED die.
    Type: Application
    Filed: June 6, 2017
    Publication date: September 21, 2017
    Inventors: CHING-HSUEH CHIU, YA-WEN LIN, PO-MIN TU, SHIH-CHENG HUANG
  • Patent number: 9722142
    Abstract: An LED die includes a substrate, a pre-growth layer, a first insulating layer and a light emitting structure. The pre-growth layer, the first insulating layer and the light emitting structure are formed on the structure that order. The substrate includes a first electrode, a second electrode and an insulating part. The insulating part is formed between the first electrode and the second electrode. The LED die further includes a second insulating layer and a metal layer which are formed around the pre-growth layer. The present disclosure includes a method for manufacturing the LED die.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: August 1, 2017
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Ching-Hsueh Chiu, Ya-Wen Lin, Po-Min Tu, Shih-Cheng Huang