Abstract: A chip package structure, comprises a first chip having a plurality of first chip joints at a lower side thereof; a circuit board below the first chip; an upper side of the circuit board being arranged with a plurality of circuit board joints; in packaging, the first chip joints being combined with the circuit board joints of the circuit board so that the first chip is combined to the circuit board by a way of ACF combination or convex joint combination; and wherein in the ACF combination, ACFs are used as welding points to be combined to the pads at another end so that the chip is combined to the circuit board; and wherein in the convex pad combination, a convex pad is combined with a flat pad by chemically methods or physical methods; and these pads are arranged on the circuit board and the first chip.

Abstract: The present disclosure discloses a method, a data acquisition and image processing system and a non-transitory machine-readable medium for obtaining a super-resolved image of an object. The method comprises: obtaining a plurality of structured images of the object by structured light; determining, from the structured images, modulation information of each structured light that comprises spatial frequency, phase shift and modulation factor; initializing a sample image of the object according the structured images and initializing structured pattern of each structured light by the corresponding modulation information; and restoring the image with improved resolution by adjusting the sample image and the structured pattern iteratively.

Abstract: The present disclosure relates to a method for performing an additive manufacturing operation to form a structure by processing a photopolymer resist material. A laser beam is directed at a tunable mask. At least one emergent beam is collected from a plurality of emergent beams emerging from the tunable mask. The at least one emergent beam is collimated to create a collimated beam. Each emergent beam from the tunable mask has a plurality of beam lets of varying or identical intensity, and each beam let emerges from a unique subsection or region of the tunable mask. The collimated beam is focused into a laser beam which is projected as an image plane onto or within the photopolymer resist material, such that the same optical path length is created between the tunable mask and the focused image plane for all optical frequencies of the focused laser beam.

Abstract: An apparatus and a method for laser beam shaping and scanning. The apparatus includes a digital micromirror device (DMD) including a plurality of micromirrors, configured to receive a first laser beam, adjust an axial position of a focal point of the first laser beam along a moving direction of the first laser beam by controlling a focal length of wavefront of a binary hologram applied to the DMD, and adjust a lateral position of the focal point on a plane perpendicular to the moving direction by controlling a tilted angle of a fringe pattern and a period of fringes of the binary hologram applied to the DMD, wherein the DMD simultaneously functions as programmable binary mask and a blazed grating.

Abstract: The present disclosure discloses a method, a data acquisition and image processing system and a non-transitory machine-readable medium for obtaining a super-resolved image of an object. The method comprises: obtaining a plurality of structured images of the object by structured light; determining, from the structured images, modulation information of each structured light that comprises spatial frequency, phase shift and modulation factor; initializing a sample image of the object according the structured images and initializing structured pattern of each structured light by the corresponding modulation information; and restoring the image with improved resolution by adjusting the sample image and the structured pattern iteratively.

Abstract: A FOWBCSP CMOS chip module with a packaging structure includes a CMOS chip having plural joints and a light sensing area on an upper side thereof; two stop bars positioned on the upper side of the CMOS chip; a substrate installed on the upper side of the CMOS chip; the joints and the light sensing area being located within a through hole of the substrate; and an upper side of the substrate being formed with a plurality of joints; a plurality of conductive wires passing through the through holes of the substrate for connecting the joints of the substrate and the joints of the CMOS chip; and a glass installed on an upper side of the light sensing area. The glass exposes out and external light can radiate the CMOS chip through the glass; and the joints on the upper side of the substrate have a plurality of conductive balls.

Abstract: In some embodiments, a control system, a control method and a storage medium are provided. In the method, first motion information of a machine acquired by a first sensor is received; the first motion information is inputted into a deep learning model to obtain a model output, the deep learning model comprising a convolutional neural network (CNN) and a long short-term memory (LSTM); the deep learning model is trained using the first motion information and second motion information acquired by a second sensor; the first sensor and the second sensor having different ways of detecting information and processing the detected information. The model output is used to control the machine.

Abstract: A laser fabrication method and a laser fabrication system. The laser fabrication system includes an ultrafast laser source configured to output a laser beam; and a digital micromirror device (DMD), configured to receive, shape, and scan the laser beam, wherein more than one binary holograms are synthesized to form a scanning hologram applied to the DMD. The shaped laser beam, containing one or multiple focal points, leaving the DMD, are focused to the sample for fast laser fabrication.

Abstract: A chip package structure, comprises a first chip having a plurality of first chip joints at a lower side thereof; a circuit board below the first chip; an upper side of the circuit board being arranged with a plurality of circuit board joints; in packaging, the first chip joints being combined with the circuit board joints of the circuit board so that the first chip is combined to the circuit board by a way of ACF combination or convex joint combination; and wherein in the ACF combination, ACFs are used as welding points to be combined to the pads at another end so that the chip is combined to the circuit board; and wherein in the convex pad combination, a convex pad is combined with a flat pad by chemically methods or physical methods; and these pads are arranged on the circuit board and the first chip.

Abstract: A chip package structure, comprises a first chip having a plurality of first chip joints at a lower side thereof; a circuit board below the first chip; an upper side of the circuit board being arranged with a plurality of circuit board joints; in packaging, the first chip joints being combined with the circuit board joints of the circuit board so that the first chip is combined to the circuit board by a way of ACF combination or convex joint combination; and wherein in the ACF combination, ACFs are used as welding points to be combined to the pads at another end so that the chip is combined to the circuit board; and wherein in the convex pad combination, a convex pad is combined with a flat pad by chemically methods or physical methods; and these pads are arranged on the circuit board and the first chip.

Abstract: A FOWBCSP chip module with a packaging structure has the following steps of: a chip having joints on an upper side thereof; a first packing structure enclosing a lower side and lateral sides of the chip; a substrate at the upper side of the chip; the substrate being formed with a plurality of penetrating through holes; and an upper side of the substrate being formed with a plurality of joints; and conductive wires passing through the through holes of the substrate to connect the joints of the substrate and the joints of the chip. Each of the through holes of the substrate is formed with a respective second packaging structure by filling gluing material to seal the through hole of the substrate and each of the joints on the upper side of the substrate is formed with a conductive ball, respectively. A method for forming the module is also included.

Abstract: A FOWBCSP chip module with a packaging structure has the following steps of: a chip having joints on an upper side thereof; a first packing structure enclosing a lower side and lateral sides of the chip; a substrate at the upper side of the chip; the substrate being formed with a plurality of penetrating through holes; and an upper side of the substrate being formed with a plurality of joints; and conductive wires passing through the through holes of the substrate to connect the joints of the substrate and the joints of the chip. Each of the through holes of the substrate is formed with a respective second packaging structure by filling gluing material to seal the through hole of the substrate and each of the joints on the upper side of the substrate is formed with a conductive ball, respectively. A method for forming the module is also included.

Abstract: Systems and methods for dicing a sample by a Bessel beam matrix are disclosed. The method for dicing a sample by a Bessel beam matrix may comprise generating a Bessel beam matrix including multiple Bessel beams arranged in a matrix form, according to a predetermined dicing layout of the sample; controlling a focus position of each Bessel beam in the generated Bessel beam matrix; and focusing simultaneously the Bessel beams of the Bessel beam matrix at the respective controlled focus positions within the sample for dicing.

Abstract: The present application discloses a microtome. The microtome includes: a blade cutting a soft material in a first direction, the first direction being a feeding direction of the soft material; a blade holder holding the blade; an actuator providing a vibration in a second direction along a cutting edge of the blade; and a frequency-tunable resonator driven by the actuator into vibration and fixedly connected to the blade holder to transfer the vibration to the blade holder and the blade, the resonator having a tunable resonant frequency in the second direction.

Abstract: A laser-based manufacturing system is disclosed for fabricating non-planar three-dimensional layers. The system may have a laser for producing a laser beam with a plurality of optical wavelengths. An optically dispersive element may be used for receiving the laser beam and splitting the beam into a plurality of distinct beam components, wherein each beam component has spatially separated optical spectral components. A phase mask may be used which is configured to receive at least one of the beam components emerging from the dispersive element and to create a modified beam. One or more focusing elements may then be used to receive the modified beam emerging from the phase mask and to focus the modified beam into a non-planar light sheet for use in fabricating a part.

Abstract: An apparatus and a method for laser beam shaping and scanning. The apparatus includes a digital micromirror device (DMD) including a plurality of micromirrors, configured to receive a first laser beam, adjust an axial position of a focal point of the first laser beam along a moving direction of the first laser beam by controlling a focal length of wavefront of a binary hologram applied to the DMD, and adjust a lateral position of the focal point on a plane perpendicular to the moving direction by controlling a tilted angle of a fringe pattern and a period of fringes of the binary hologram applied to the DMD, wherein the DMD simultaneously functions as programmable binary mask and a blazed grating.

Abstract: A method, computing system, and computer-readable medium for assigning global edge IDs for evolving graphs are described herein. The method includes selecting a block size for an evolving graph and, as new vertices are added to the evolving graph, calculating block IDs for the evolving graph. Calculating the block IDs includes creating a table representing the evolving graph and, as new vertices are added to the evolving graph, calculating block IDs for cells in a new column of the table before calculating block IDs for cells in a new row of the table. The method also includes calculating global edge IDs for the evolving graph based on the source vertex ID, the target vertex ID, and the block ID for the block at which each edge is located. The method may also include calculating incremental Page Rank for the evolving graph.

Abstract: Systems and methods for dicing a sample by a Bessel beam matrix are disclosed. The method for dicing a sample by a Bessel beam matrix may comprise generating a Bessel beam matrix including multiple Bessel beams arranged in a matrix form, according to a predetermined dicing layout of the sample; controlling a focus position of each Bessel beam in the generated Bessel beam matrix; and focusing simultaneously the Bessel beams of the Bessel beam matrix at the respective controlled focus positions within the sample for dicing.

Abstract: A device and method are for shaping and scanning an ultrafast laser beam. The device includes a laser source configured to output a pulsed laser beam containing different frequency spectrum, a digital micromirror device (DMD) consisting of micromirrors, which are configured to receive the laser beam and shape the received laser beam with computer generated holograms, and a dispersion compensation unit, arranged before or after the DMD, which is configured to transfer the laser beam from the laser source to the DMD with a designated angular dispersion for neutralizing the first angular dispersion introduced by the DMD.

Abstract: A liquid encapsulation device for embedding sensor is provided. The liquid encapsulation device comprises a substrate having an upper surface with a central concave portion; at least one protection layer sealed on the upper surface of the substrate; and at least one sensor fixed on the protection layer. Wherein, the central concave portion is filled with liquid and the sensor is arranged above the central concave portion.