Patents by Inventor Shih Feng Lee
Shih Feng Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250029949Abstract: A wafer stacking process is provided in the present invention, including steps of forming a silicon oxide layer on a sacrificial carrier, bonding the silicon oxide layer with a dielectric layer on a front side of a silicon substrate, performing a thinning process on the back side of the silicon substrate to expose TSVs therewithin, bonding the back side of the silicon substrate with another silicon substrate, repeating the thinning process and the process of bonding another silicon substrate above so as to form a wafer stacking structure, and performing a removing process to completely remove the sacrificial carrier.Type: ApplicationFiled: November 1, 2023Publication date: January 23, 2025Applicant: Powerchip Semiconductor Manufacturing CorporationInventors: Chih-Feng Sung, Chih-Hao Chuang, Chun-Lin Lu, Shih-Ping Lee, Li-Han Chiu, Yi-Kai Wu
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Patent number: 8981622Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit and a circuit board. The housing has an enclosing portion formed with first and second openings. The transducer is mounted to the enclosing portion at the second opening, and includes an electrically conductive surrounding wall and a piezoelectric member. The securing unit includes a securing component that secures the transducer on the enclosing portion, and a connecting pin set including two pins each having an end connected electrically to a respective one of the surrounding wall and the piezoelectric member. The circuit board is disposed at the first opening of the enclosing portion for electrical connection with the connecting pin set.Type: GrantFiled: January 31, 2013Date of Patent: March 17, 2015Assignee: Tung Thih Electronic Co., Ltd.Inventors: Tzu-Chin Tsai, Chiun-Hua Chang, Shih-Feng Lee
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Patent number: 8853919Abstract: An ultrasonic sensor device includes a housing, a circuit board disposed at the housing, and a transducer. The transducer includes an electrically conductive casing having a bottom wall and a surrounding wall. A piezoelectric member is disposed on top of the bottom wall. A first connecting pin set is disposed in the housing, and includes a first connecting pin having one end connected to the circuit board and another end connected to the piezoelectric member, and a second connecting pin having one end connected to the circuit board and another end connected to the surrounding wall. A second connecting pin set is disposed in the housing, has one end connected to the circuit board, and another end extended into a connecting portion of the housing.Type: GrantFiled: July 23, 2012Date of Patent: October 7, 2014Assignee: Tung Thih Electronic Co., Ltd.Inventors: Chia-Yu Lin, Tzu-Chin Tsai, Chiun-Hua Chang, Shih-Feng Lee
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Publication number: 20140157894Abstract: A case for disposing a piezoelectric member includes a case body having a top surface and is defined with a central cavity extending from the top surface into the case body for receiving the piezoelectric member, wherein the case body is made of an alloy containing Al, Mg, Fe, Si, Cu, Zn, Mn, and Cr.Type: ApplicationFiled: March 18, 2013Publication date: June 12, 2014Applicant: TUNG THIH ELECTRONIC CO., LTD.Inventors: Shih-Feng Lee, Tzu-Chin Tsai
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Publication number: 20140096609Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit, a circuit board and a sealing cap. The housing includes an enclosing portion. The enclosing portion has a first opening and an opposite second opening. The transducer is secured to the enclosing portion at the second opening. The securing unit secures the transducer to the enclosing portion of the housing, and includes at least one securing rib that extends toward the first opening of the enclosing portion. The circuit board is disposed in the enclosing portion. The sealing cap is disposed to cover the first opening of the enclosing portion and has an inner cap surface that abuts against the securing rib of the securing unit.Type: ApplicationFiled: March 15, 2013Publication date: April 10, 2014Applicant: TUNG THIH ELECTRONIC CO., LTD.Inventors: Tzu-Chin Tsai, Shih-Feng Lee, Chiun-Hua Chang
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Publication number: 20140062260Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit and a circuit board. The housing has an enclosing portion formed with first and second openings. The transducer is mounted to the enclosing portion at the second opening, and includes an electrically conductive surrounding wall and a piezoelectric member. The securing unit includes a securing component that secures the transducer on the enclosing portion, and a connecting pin set including two pins each having an end connected electrically to a respective one of the surrounding wall and the piezoelectric member. The circuit board is disposed at the first opening of the enclosing portion for electrical connection with the connecting pin set.Type: ApplicationFiled: January 31, 2013Publication date: March 6, 2014Applicant: TUNG THIH ELECTRONIC CO., LTD.Inventors: Tzu-Chin Tsai, Chiun-Hua Chang, Shih-Feng Lee
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Publication number: 20130215722Abstract: An ultrasonic sensor device includes a sensing unit and a component module disposed in a casing. The sensing unit is configured to generate a sensing signal in response to receipt of an external sound wave. The component module includes a base seat, a circuit unit and a cushioning unit. The base seat has a base board and a lower seat portion under the base board. The base board is formed with a recess. The circuit unit is disposed in the recess, is coupled electrically to the sensing unit for receiving the sensing signal therefrom, and is to be coupled electrically to an external electronic circuit. The cushioning unit is disposed at the base seat, and is proximate to the sensing unit.Type: ApplicationFiled: July 20, 2012Publication date: August 22, 2013Inventors: Wen-Jong Wu, Chuin-Shan Chen, Nai-Chang Wu, Chia-Yu Lin, Tzu-Chin Tsai, Chiun-Hua Chang, Shih-Feng Lee
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Publication number: 20130214642Abstract: An ultrasonic sensor device includes a housing, a circuit board disposed at the housing, and a transducer. The transducer includes an electrically conductive casing having a bottom wall and a surrounding wall. A piezoelectric member is disposed on top of the bottom wall. A first connecting pin set is disposed in the housing, and includes a first connecting pin having one end connected to the circuit board and another end connected to the piezoelectric member, and a second connecting pin having one end connected to the circuit board and another end connected to the surrounding wall. A second connecting pin set is disposed in the housing, has one end connected to the circuit board, and another end extended into a connecting portion of the housing.Type: ApplicationFiled: July 23, 2012Publication date: August 22, 2013Inventors: Chia-Yu Lin, Tzu-Chin Tsai, Chiun-Hua Chang, Shih-Feng Lee
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Publication number: 20120274182Abstract: An ultrasonic sensor includes a casing body and a piezoelectric element. The casing body has a base wall and a surrounding wall that cooperates with the base wall to define an interior space. The base wall has a top surface and a bottom surface. The top surface has a first section, a second section that extends between the first section and the surrounding wall, and a connecting section interconnecting the first and second sections. A distance between the second section and the bottom surface is larger than that between the first section and the bottom surface such that the connecting section and the first section cooperate to define a recess. The piezoelectric element is confined in the recess.Type: ApplicationFiled: December 21, 2011Publication date: November 1, 2012Applicant: TUNG THIH ELECTRONIC CO., LTD.Inventors: Wen-Jong Wu, Chuin-Shan Chen, Chia-Yu Lin, Tzu-Chin Tsai, Shih-Feng Lee, Chun-Liang Kuo
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Publication number: 20100275796Abstract: A pattern formation board structure is disclosed. The board structure comprises a main board having hollow stripes with a specific main pattern; a secondary board being an extension from the edge of the main board having hollow stripes with a secondary pattern corresponding to the main pattern of the main board at a different position such that the respective shape and size of the secondary pattern and the main pattern are similar; thereby the main board and the secondary board form into a pattern formation board, by spraying or coating the hollow stripes, a plurality of patterns of multiple colors can be obtained.Type: ApplicationFiled: April 29, 2009Publication date: November 4, 2010Inventor: SHIH-FENG LEE
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Publication number: 20100075091Abstract: A three-dimension ornamental article is disclosed. The member comprises a plasticizing layer coated onto a substrate, an electroplated layer covered the plasticizing layer and an adhesion layer, wherein the plasticizing layer is epoxy resins or plastics. The base paper is a patterned layer and the circumferential edge of the patterned layer has dotted scored lines, facilitating the peeling off of the ornamental article.Type: ApplicationFiled: September 22, 2008Publication date: March 25, 2010Inventor: SHIH-FENG LEE
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Publication number: 20100003477Abstract: The puffy sticker contains a base layer, and one or more pattern layers made of a puffy material coated sequentially on pre-determined areas of a top side of the base layer in a layer-by-layer manner, where these pattern layers jointly present a colorful graphic image. The graphic image is then bulged by thermally curing these pattern layers. A cutting line is provided surrounding the graphic image so that the sticker having the puffy or foamy image can be detached. The base layer is made of paper, cloth, or similar material which adhesives coated on a bottom side of the base layer.Type: ApplicationFiled: July 3, 2008Publication date: January 7, 2010Inventor: SHIH-FENG LEE
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Patent number: 7597197Abstract: A sticker package includes a sticker assembly and a package case. The sticker assembly includes an elongate strip of flexible film and a continuously extended sticker attached to a surface of the flexible film. The sticker has a projection area on the surface of the flexible film that is smaller than the surface area of the surface of the flexible film. The package case includes upper and lower lids. The upper lid is bulged to form a receiving compartment. The lower lid is cut to form an opening. The sticker assembly is wound up as a roll received and retained in the receiving compartment with a leading end extending out of the case through the opening. To use, the sticker assembly is pulled off the package case through the opening and the sticker is then allowed to peel off the flexible film.Type: GrantFiled: February 1, 2008Date of Patent: October 6, 2009Assignee: Jeng Tair Label Print Co., Ltd.Inventor: Shih-Feng Lee
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Publication number: 20090194438Abstract: A sticker package includes a sticker assembly and a package case. The sticker assembly includes an elongate strip of flexible film and a continuously extended sticker attached to a surface of the flexible film. The sticker has a projection area on the surface of the flexible film that is smaller than the surface area of the surface of the flexible film. The package case includes upper and lower lids. The upper lid is bulged to form a receiving compartment. The lower lid is cut to form an opening. The sticker assembly is wound up as a roll received and retained in the receiving compartment with a leading end extending out of the case through the opening. To use, the sticker assembly is pulled off the package case through the opening and the sticker is then allowed to peel off the flexible film.Type: ApplicationFiled: February 1, 2008Publication date: August 6, 2009Inventor: Shih-Feng Lee
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Publication number: 20090197033Abstract: A transfer-printing sticker includes a release paper, a transparent base paper, and first and second sticking members carrying different patterns with the patterns arranged between the base paper and the release paper. The first sticking member contains a first pattern that is arranged to contain hollow portions. The second sticking member contains a second pattern that is arranged in accordance with the hollow portions of the first pattern. To use the transfer-printing sticker, the release paper is removed and the base paper is stuck to an article or a piece of paper and with slightly pressurization, the patterns are transferred. The arrangements of the first and second patterns allow for formation of different transfer printing effects. The second pattern can be set in the hollow portions of the first pattern and thus both can be formed with the same piece of sticker paper.Type: ApplicationFiled: February 1, 2008Publication date: August 6, 2009Inventor: Shih-Feng Lee
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Publication number: 20060075780Abstract: A coiled ornament comprised of the ornament adapted with a coil at the bottom; a transparent sheet adhered to the other side of the ornament; one end of the coil being sandwiched by the ornament and the transparent paper; another end of the coil being attached to a base paper glued on its back and then applied with a stripper; the coiled ornament with the stripper removed sticking to the human body, a desktop or any object at any location as desired for fun.Type: ApplicationFiled: October 12, 2004Publication date: April 13, 2006Inventor: Shih-Feng Lee
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Publication number: 20060076731Abstract: A toy of stickers comprised of strippers, pattern puzzles, pallet stickers and transfer films; the stripper is adhered on the pattern puzzle; pallet sticks are adhered to the stripper depending on the color and shape of the pattern; the pallet stickers are adhered to the transfer film, and the transfer film is attached to the surface of the pallets in various colors and patterns are stuck to any object as desired.Type: ApplicationFiled: October 12, 2004Publication date: April 13, 2006Inventor: Shih-Feng Lee
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Patent number: 6589624Abstract: A card with removable stickers includes a sticker assembly including a first layer of small stickers on which are printed different pictures and are cut to facilitate their removal, a second layer of backing paper having a back side which is colored with an opaque, reflective, copper-colored material, a third layer of adhesive, a fourth layer of double-sided release paper, a fifth layer of removable film made of transparent resin, and a sixth layer of adhesive, and a card adhered to the six layer of adhesive, whereby when in use, the backing paper is first removed, and then the double-sided release paper is removed from the transparent removable film leaving the transparent removable film on the card, thereby enabling illustration of the card to be completely seen and the stickers be adhered on the removable film, and writing can also be done on the film.Type: GrantFiled: January 25, 2002Date of Patent: July 8, 2003Assignee: Jeng Yair Label Print Co., Ltd.Inventor: Shih Feng Lee
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Publication number: 20020066527Abstract: A process of making self-adhesive decorative stickers includes the steps of adhering double-sided adhesive papers to upper and lower layers of a non-malleable sheet of paper; using a mold to punch out main members of different shapes; punching upper-layer paper blank of the main members to form corresponding cutting lines; after tearing off corresponding upper paper blank for adhering decorative articles to the upper adhesive paper, tearing off the remaining upper-layer paper blank outside of the corresponding positions; and sprinkling tinsel powders evenly on the portion outside of the decorative articles and securing the decorative articles using a bonding glue so as to form a decorative sticker. After tearing off the lower-layer paper blank, the decorative sticker can be adhered to a user's body, a planar pattern, an object, etc., for decorative purposes.Type: ApplicationFiled: December 1, 2000Publication date: June 6, 2002Inventor: Shih- Feng Lee