Patents by Inventor Shih Feng Lee

Shih Feng Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11946569
    Abstract: An actuating and sensing module is disclosed and includes a bottom plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes a pressure relief orifice, a discharging orifice and a communication orifice. The gas pressure sensor is disposed on the bottom plate and seals the communication orifice. The thin gas transportation device is disposed on the bottom plate and seals the pressure relief orifice and the discharging orifice. The cover plate is disposed on the bottom plate and covers the gas pressure sensor and the thin gas-transportation device. The cover plate includes an intake orifice. The thin gas transportation device is driven to inhale gas through the intake orifice, the gas is then discharged through the discharging orifice by the thin gas transportation device, and a pressure change of the gas is sensed by the gas pressure sensor.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: April 2, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Shih-Chang Chen, Jia-Yu Liao, Hung-Hsin Liao, Chung-Wei Kao, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee
  • Publication number: 20240079524
    Abstract: A semiconductor device comprises a first semiconductor structure, a second semiconductor structure located on the first semiconductor structure, and an active layer located between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure has a first conductivity type, and includes a plurality of first layers and a plurality of second layers alternately stacked. The second semiconductor structure has a second conductivity type opposite to the first conductivity type. The plurality of first layers and the plurality of second layers include indium and phosphorus, and the plurality of first layers and the plurality of second layers respectively have a first indium atomic percentage and a second indium atomic percentage. The second indium atomic percentage is different from the first indium atomic percentage.
    Type: Application
    Filed: September 6, 2023
    Publication date: March 7, 2024
    Inventors: Wei-Jen HSUEH, Shih-Chang LEE, Kuo-Feng HUANG, Wen-Luh LIAO, Jiong-Chaso SU, Yi-Chieh LIN, Hsuan-Le LIN
  • Patent number: 8981622
    Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit and a circuit board. The housing has an enclosing portion formed with first and second openings. The transducer is mounted to the enclosing portion at the second opening, and includes an electrically conductive surrounding wall and a piezoelectric member. The securing unit includes a securing component that secures the transducer on the enclosing portion, and a connecting pin set including two pins each having an end connected electrically to a respective one of the surrounding wall and the piezoelectric member. The circuit board is disposed at the first opening of the enclosing portion for electrical connection with the connecting pin set.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: March 17, 2015
    Assignee: Tung Thih Electronic Co., Ltd.
    Inventors: Tzu-Chin Tsai, Chiun-Hua Chang, Shih-Feng Lee
  • Patent number: 8853919
    Abstract: An ultrasonic sensor device includes a housing, a circuit board disposed at the housing, and a transducer. The transducer includes an electrically conductive casing having a bottom wall and a surrounding wall. A piezoelectric member is disposed on top of the bottom wall. A first connecting pin set is disposed in the housing, and includes a first connecting pin having one end connected to the circuit board and another end connected to the piezoelectric member, and a second connecting pin having one end connected to the circuit board and another end connected to the surrounding wall. A second connecting pin set is disposed in the housing, has one end connected to the circuit board, and another end extended into a connecting portion of the housing.
    Type: Grant
    Filed: July 23, 2012
    Date of Patent: October 7, 2014
    Assignee: Tung Thih Electronic Co., Ltd.
    Inventors: Chia-Yu Lin, Tzu-Chin Tsai, Chiun-Hua Chang, Shih-Feng Lee
  • Publication number: 20140157894
    Abstract: A case for disposing a piezoelectric member includes a case body having a top surface and is defined with a central cavity extending from the top surface into the case body for receiving the piezoelectric member, wherein the case body is made of an alloy containing Al, Mg, Fe, Si, Cu, Zn, Mn, and Cr.
    Type: Application
    Filed: March 18, 2013
    Publication date: June 12, 2014
    Applicant: TUNG THIH ELECTRONIC CO., LTD.
    Inventors: Shih-Feng Lee, Tzu-Chin Tsai
  • Publication number: 20140096609
    Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit, a circuit board and a sealing cap. The housing includes an enclosing portion. The enclosing portion has a first opening and an opposite second opening. The transducer is secured to the enclosing portion at the second opening. The securing unit secures the transducer to the enclosing portion of the housing, and includes at least one securing rib that extends toward the first opening of the enclosing portion. The circuit board is disposed in the enclosing portion. The sealing cap is disposed to cover the first opening of the enclosing portion and has an inner cap surface that abuts against the securing rib of the securing unit.
    Type: Application
    Filed: March 15, 2013
    Publication date: April 10, 2014
    Applicant: TUNG THIH ELECTRONIC CO., LTD.
    Inventors: Tzu-Chin Tsai, Shih-Feng Lee, Chiun-Hua Chang
  • Publication number: 20140062260
    Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit and a circuit board. The housing has an enclosing portion formed with first and second openings. The transducer is mounted to the enclosing portion at the second opening, and includes an electrically conductive surrounding wall and a piezoelectric member. The securing unit includes a securing component that secures the transducer on the enclosing portion, and a connecting pin set including two pins each having an end connected electrically to a respective one of the surrounding wall and the piezoelectric member. The circuit board is disposed at the first opening of the enclosing portion for electrical connection with the connecting pin set.
    Type: Application
    Filed: January 31, 2013
    Publication date: March 6, 2014
    Applicant: TUNG THIH ELECTRONIC CO., LTD.
    Inventors: Tzu-Chin Tsai, Chiun-Hua Chang, Shih-Feng Lee
  • Publication number: 20130215722
    Abstract: An ultrasonic sensor device includes a sensing unit and a component module disposed in a casing. The sensing unit is configured to generate a sensing signal in response to receipt of an external sound wave. The component module includes a base seat, a circuit unit and a cushioning unit. The base seat has a base board and a lower seat portion under the base board. The base board is formed with a recess. The circuit unit is disposed in the recess, is coupled electrically to the sensing unit for receiving the sensing signal therefrom, and is to be coupled electrically to an external electronic circuit. The cushioning unit is disposed at the base seat, and is proximate to the sensing unit.
    Type: Application
    Filed: July 20, 2012
    Publication date: August 22, 2013
    Inventors: Wen-Jong Wu, Chuin-Shan Chen, Nai-Chang Wu, Chia-Yu Lin, Tzu-Chin Tsai, Chiun-Hua Chang, Shih-Feng Lee
  • Publication number: 20130214642
    Abstract: An ultrasonic sensor device includes a housing, a circuit board disposed at the housing, and a transducer. The transducer includes an electrically conductive casing having a bottom wall and a surrounding wall. A piezoelectric member is disposed on top of the bottom wall. A first connecting pin set is disposed in the housing, and includes a first connecting pin having one end connected to the circuit board and another end connected to the piezoelectric member, and a second connecting pin having one end connected to the circuit board and another end connected to the surrounding wall. A second connecting pin set is disposed in the housing, has one end connected to the circuit board, and another end extended into a connecting portion of the housing.
    Type: Application
    Filed: July 23, 2012
    Publication date: August 22, 2013
    Inventors: Chia-Yu Lin, Tzu-Chin Tsai, Chiun-Hua Chang, Shih-Feng Lee
  • Publication number: 20120274182
    Abstract: An ultrasonic sensor includes a casing body and a piezoelectric element. The casing body has a base wall and a surrounding wall that cooperates with the base wall to define an interior space. The base wall has a top surface and a bottom surface. The top surface has a first section, a second section that extends between the first section and the surrounding wall, and a connecting section interconnecting the first and second sections. A distance between the second section and the bottom surface is larger than that between the first section and the bottom surface such that the connecting section and the first section cooperate to define a recess. The piezoelectric element is confined in the recess.
    Type: Application
    Filed: December 21, 2011
    Publication date: November 1, 2012
    Applicant: TUNG THIH ELECTRONIC CO., LTD.
    Inventors: Wen-Jong Wu, Chuin-Shan Chen, Chia-Yu Lin, Tzu-Chin Tsai, Shih-Feng Lee, Chun-Liang Kuo
  • Publication number: 20100275796
    Abstract: A pattern formation board structure is disclosed. The board structure comprises a main board having hollow stripes with a specific main pattern; a secondary board being an extension from the edge of the main board having hollow stripes with a secondary pattern corresponding to the main pattern of the main board at a different position such that the respective shape and size of the secondary pattern and the main pattern are similar; thereby the main board and the secondary board form into a pattern formation board, by spraying or coating the hollow stripes, a plurality of patterns of multiple colors can be obtained.
    Type: Application
    Filed: April 29, 2009
    Publication date: November 4, 2010
    Inventor: SHIH-FENG LEE
  • Publication number: 20100075091
    Abstract: A three-dimension ornamental article is disclosed. The member comprises a plasticizing layer coated onto a substrate, an electroplated layer covered the plasticizing layer and an adhesion layer, wherein the plasticizing layer is epoxy resins or plastics. The base paper is a patterned layer and the circumferential edge of the patterned layer has dotted scored lines, facilitating the peeling off of the ornamental article.
    Type: Application
    Filed: September 22, 2008
    Publication date: March 25, 2010
    Inventor: SHIH-FENG LEE
  • Publication number: 20100003477
    Abstract: The puffy sticker contains a base layer, and one or more pattern layers made of a puffy material coated sequentially on pre-determined areas of a top side of the base layer in a layer-by-layer manner, where these pattern layers jointly present a colorful graphic image. The graphic image is then bulged by thermally curing these pattern layers. A cutting line is provided surrounding the graphic image so that the sticker having the puffy or foamy image can be detached. The base layer is made of paper, cloth, or similar material which adhesives coated on a bottom side of the base layer.
    Type: Application
    Filed: July 3, 2008
    Publication date: January 7, 2010
    Inventor: SHIH-FENG LEE
  • Patent number: 7597197
    Abstract: A sticker package includes a sticker assembly and a package case. The sticker assembly includes an elongate strip of flexible film and a continuously extended sticker attached to a surface of the flexible film. The sticker has a projection area on the surface of the flexible film that is smaller than the surface area of the surface of the flexible film. The package case includes upper and lower lids. The upper lid is bulged to form a receiving compartment. The lower lid is cut to form an opening. The sticker assembly is wound up as a roll received and retained in the receiving compartment with a leading end extending out of the case through the opening. To use, the sticker assembly is pulled off the package case through the opening and the sticker is then allowed to peel off the flexible film.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: October 6, 2009
    Assignee: Jeng Tair Label Print Co., Ltd.
    Inventor: Shih-Feng Lee
  • Publication number: 20090194438
    Abstract: A sticker package includes a sticker assembly and a package case. The sticker assembly includes an elongate strip of flexible film and a continuously extended sticker attached to a surface of the flexible film. The sticker has a projection area on the surface of the flexible film that is smaller than the surface area of the surface of the flexible film. The package case includes upper and lower lids. The upper lid is bulged to form a receiving compartment. The lower lid is cut to form an opening. The sticker assembly is wound up as a roll received and retained in the receiving compartment with a leading end extending out of the case through the opening. To use, the sticker assembly is pulled off the package case through the opening and the sticker is then allowed to peel off the flexible film.
    Type: Application
    Filed: February 1, 2008
    Publication date: August 6, 2009
    Inventor: Shih-Feng Lee
  • Publication number: 20090197033
    Abstract: A transfer-printing sticker includes a release paper, a transparent base paper, and first and second sticking members carrying different patterns with the patterns arranged between the base paper and the release paper. The first sticking member contains a first pattern that is arranged to contain hollow portions. The second sticking member contains a second pattern that is arranged in accordance with the hollow portions of the first pattern. To use the transfer-printing sticker, the release paper is removed and the base paper is stuck to an article or a piece of paper and with slightly pressurization, the patterns are transferred. The arrangements of the first and second patterns allow for formation of different transfer printing effects. The second pattern can be set in the hollow portions of the first pattern and thus both can be formed with the same piece of sticker paper.
    Type: Application
    Filed: February 1, 2008
    Publication date: August 6, 2009
    Inventor: Shih-Feng Lee
  • Publication number: 20060075780
    Abstract: A coiled ornament comprised of the ornament adapted with a coil at the bottom; a transparent sheet adhered to the other side of the ornament; one end of the coil being sandwiched by the ornament and the transparent paper; another end of the coil being attached to a base paper glued on its back and then applied with a stripper; the coiled ornament with the stripper removed sticking to the human body, a desktop or any object at any location as desired for fun.
    Type: Application
    Filed: October 12, 2004
    Publication date: April 13, 2006
    Inventor: Shih-Feng Lee
  • Publication number: 20060076731
    Abstract: A toy of stickers comprised of strippers, pattern puzzles, pallet stickers and transfer films; the stripper is adhered on the pattern puzzle; pallet sticks are adhered to the stripper depending on the color and shape of the pattern; the pallet stickers are adhered to the transfer film, and the transfer film is attached to the surface of the pallets in various colors and patterns are stuck to any object as desired.
    Type: Application
    Filed: October 12, 2004
    Publication date: April 13, 2006
    Inventor: Shih-Feng Lee
  • Patent number: 6589624
    Abstract: A card with removable stickers includes a sticker assembly including a first layer of small stickers on which are printed different pictures and are cut to facilitate their removal, a second layer of backing paper having a back side which is colored with an opaque, reflective, copper-colored material, a third layer of adhesive, a fourth layer of double-sided release paper, a fifth layer of removable film made of transparent resin, and a sixth layer of adhesive, and a card adhered to the six layer of adhesive, whereby when in use, the backing paper is first removed, and then the double-sided release paper is removed from the transparent removable film leaving the transparent removable film on the card, thereby enabling illustration of the card to be completely seen and the stickers be adhered on the removable film, and writing can also be done on the film.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: July 8, 2003
    Assignee: Jeng Yair Label Print Co., Ltd.
    Inventor: Shih Feng Lee
  • Publication number: 20020066527
    Abstract: A process of making self-adhesive decorative stickers includes the steps of adhering double-sided adhesive papers to upper and lower layers of a non-malleable sheet of paper; using a mold to punch out main members of different shapes; punching upper-layer paper blank of the main members to form corresponding cutting lines; after tearing off corresponding upper paper blank for adhering decorative articles to the upper adhesive paper, tearing off the remaining upper-layer paper blank outside of the corresponding positions; and sprinkling tinsel powders evenly on the portion outside of the decorative articles and securing the decorative articles using a bonding glue so as to form a decorative sticker. After tearing off the lower-layer paper blank, the decorative sticker can be adhered to a user's body, a planar pattern, an object, etc., for decorative purposes.
    Type: Application
    Filed: December 1, 2000
    Publication date: June 6, 2002
    Inventor: Shih- Feng Lee