Abstract: A device includes a semiconductor substrate, a fin structure on the semiconductor substrate, a gate structure on the fin structure, and a pair of source/drain features on both sides of the gate structure. The gate structure includes an interfacial layer on the fin structure, a gate dielectric layer on the interfacial layer, and a gate electrode layer of a conductive material on and directly contacting the gate dielectric layer. The gate dielectric layer includes nitrogen element.

Abstract: The present application is to provide a system for sensing and responding to a lateral blind spot of a mobile carrier and method thereof, which is applied for a mobile carrier during moving to a parking place. Firstly, a light scan unit and a depth image capture unit are used to scan a plurality of surrounding objects and capture a plurality of object depth images of the surrounding objects, and then a plurality of screened images are obtained according to a moving route of the mobile carrier for further obtaining correspondingly a plurality of forecasted lines to generate corresponded notice message for noting driver or ADAS. Due to the objects corresponding to the screened images and located on a blind position which is at one side of the mobile carrier, the notice message provides the driver preventing from the ignored danger by ignoring the blind position.

Abstract: A wafer stacking method includes the following steps. A first wafer is provided. A second wafer is bonded to the first wafer to form a first wafer stack structure. A first edge defect inspection is performed on the first wafer stack structure to find a first edge defect and measure a first distance in a radial direction between an edge of the first wafer stack structure and an end of the first edge defect away from the edge of the first wafer stack structure. A first trimming process with a range of a first width is performed from the edge of the first wafer stack structure to remove the first edge defect. Herein, the first width is greater than or equal to the first distance.

Abstract: A wafer processing method including following steps is provided. A release layer is formed on a first wafer. An adhesive layer is formed on a second wafer. One of the first wafer and the second wafer is a device wafer. The device wafer includes a valid die region and a trimming region. A handler is applied to place the first wafer on the second wafer, so that the release layer and the adhesive layer are bonded to each other, and the adhesive layer completely covers the valid die region. During the process of placing the first wafer on the second wafer, the handler directly moves the first wafer.

Abstract: The present disclosure provides a semiconductor processing apparatus according to one embodiment. The semiconductor processing apparatus includes a chamber; a base station located in the chamber for supporting a semiconductor substrate; a preheating assembly surrounding the base station; a first heating element fixed relative to the base station and configured to direct heat to the semiconductor substrate; and a second heating element moveable relative to the base station and operable to direct heat to a portion of the semiconductor substrate.

Abstract: A device includes a semiconductor substrate, a fin structure on the semiconductor substrate, a gate structure on the fin structure, and a pair of source/drain features on both sides of the gate structure. The gate structure includes an interfacial layer on the fin structure, a gate dielectric layer on the interfacial layer, and a gate electrode layer of a conductive material on and directly contacting the gate dielectric layer. The gate dielectric layer includes nitrogen element.

Abstract: A semiconductor device is provided, which includes a first semiconductor structure, a second semiconductor structure, and an active region. The first semiconductor structure includes a first dopant. The second semiconductor structure is located on the first semiconductor structure and includes a second dopant different from the first dopant. The active region includes a plurality of semiconductor pairs and located between the first semiconductor structure and the second semiconductor structure. Each semiconductor pair includes a barrier layer and a well layer and includes the first dopant. The active region does not include a nitrogen element. A doping concentration of the first dopant in the first semiconductor structure is higher than a doping concentration of the first dopant in the active region.

Abstract: A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.

Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit and a circuit board. The housing has an enclosing portion formed with first and second openings. The transducer is mounted to the enclosing portion at the second opening, and includes an electrically conductive surrounding wall and a piezoelectric member. The securing unit includes a securing component that secures the transducer on the enclosing portion, and a connecting pin set including two pins each having an end connected electrically to a respective one of the surrounding wall and the piezoelectric member. The circuit board is disposed at the first opening of the enclosing portion for electrical connection with the connecting pin set.

Abstract: An ultrasonic sensor device includes a housing, a circuit board disposed at the housing, and a transducer. The transducer includes an electrically conductive casing having a bottom wall and a surrounding wall. A piezoelectric member is disposed on top of the bottom wall. A first connecting pin set is disposed in the housing, and includes a first connecting pin having one end connected to the circuit board and another end connected to the piezoelectric member, and a second connecting pin having one end connected to the circuit board and another end connected to the surrounding wall. A second connecting pin set is disposed in the housing, has one end connected to the circuit board, and another end extended into a connecting portion of the housing.

Abstract: A case for disposing a piezoelectric member includes a case body having a top surface and is defined with a central cavity extending from the top surface into the case body for receiving the piezoelectric member, wherein the case body is made of an alloy containing Al, Mg, Fe, Si, Cu, Zn, Mn, and Cr.

Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit, a circuit board and a sealing cap. The housing includes an enclosing portion. The enclosing portion has a first opening and an opposite second opening. The transducer is secured to the enclosing portion at the second opening. The securing unit secures the transducer to the enclosing portion of the housing, and includes at least one securing rib that extends toward the first opening of the enclosing portion. The circuit board is disposed in the enclosing portion. The sealing cap is disposed to cover the first opening of the enclosing portion and has an inner cap surface that abuts against the securing rib of the securing unit.

Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit and a circuit board. The housing has an enclosing portion formed with first and second openings. The transducer is mounted to the enclosing portion at the second opening, and includes an electrically conductive surrounding wall and a piezoelectric member. The securing unit includes a securing component that secures the transducer on the enclosing portion, and a connecting pin set including two pins each having an end connected electrically to a respective one of the surrounding wall and the piezoelectric member. The circuit board is disposed at the first opening of the enclosing portion for electrical connection with the connecting pin set.

Abstract: An ultrasonic sensor device includes a sensing unit and a component module disposed in a casing. The sensing unit is configured to generate a sensing signal in response to receipt of an external sound wave. The component module includes a base seat, a circuit unit and a cushioning unit. The base seat has a base board and a lower seat portion under the base board. The base board is formed with a recess. The circuit unit is disposed in the recess, is coupled electrically to the sensing unit for receiving the sensing signal therefrom, and is to be coupled electrically to an external electronic circuit. The cushioning unit is disposed at the base seat, and is proximate to the sensing unit.

Abstract: An ultrasonic sensor device includes a housing, a circuit board disposed at the housing, and a transducer. The transducer includes an electrically conductive casing having a bottom wall and a surrounding wall. A piezoelectric member is disposed on top of the bottom wall. A first connecting pin set is disposed in the housing, and includes a first connecting pin having one end connected to the circuit board and another end connected to the piezoelectric member, and a second connecting pin having one end connected to the circuit board and another end connected to the surrounding wall. A second connecting pin set is disposed in the housing, has one end connected to the circuit board, and another end extended into a connecting portion of the housing.

Abstract: An ultrasonic sensor includes a casing body and a piezoelectric element. The casing body has a base wall and a surrounding wall that cooperates with the base wall to define an interior space. The base wall has a top surface and a bottom surface. The top surface has a first section, a second section that extends between the first section and the surrounding wall, and a connecting section interconnecting the first and second sections. A distance between the second section and the bottom surface is larger than that between the first section and the bottom surface such that the connecting section and the first section cooperate to define a recess. The piezoelectric element is confined in the recess.

Abstract: A pattern formation board structure is disclosed. The board structure comprises a main board having hollow stripes with a specific main pattern; a secondary board being an extension from the edge of the main board having hollow stripes with a secondary pattern corresponding to the main pattern of the main board at a different position such that the respective shape and size of the secondary pattern and the main pattern are similar; thereby the main board and the secondary board form into a pattern formation board, by spraying or coating the hollow stripes, a plurality of patterns of multiple colors can be obtained.

Abstract: A three-dimension ornamental article is disclosed. The member comprises a plasticizing layer coated onto a substrate, an electroplated layer covered the plasticizing layer and an adhesion layer, wherein the plasticizing layer is epoxy resins or plastics. The base paper is a patterned layer and the circumferential edge of the patterned layer has dotted scored lines, facilitating the peeling off of the ornamental article.

Abstract: The puffy sticker contains a base layer, and one or more pattern layers made of a puffy material coated sequentially on pre-determined areas of a top side of the base layer in a layer-by-layer manner, where these pattern layers jointly present a colorful graphic image. The graphic image is then bulged by thermally curing these pattern layers. A cutting line is provided surrounding the graphic image so that the sticker having the puffy or foamy image can be detached. The base layer is made of paper, cloth, or similar material which adhesives coated on a bottom side of the base layer.

Abstract: A sticker package includes a sticker assembly and a package case. The sticker assembly includes an elongate strip of flexible film and a continuously extended sticker attached to a surface of the flexible film. The sticker has a projection area on the surface of the flexible film that is smaller than the surface area of the surface of the flexible film. The package case includes upper and lower lids. The upper lid is bulged to form a receiving compartment. The lower lid is cut to form an opening. The sticker assembly is wound up as a roll received and retained in the receiving compartment with a leading end extending out of the case through the opening. To use, the sticker assembly is pulled off the package case through the opening and the sticker is then allowed to peel off the flexible film.