Patents by Inventor Shih-Hsien Wu
Shih-Hsien Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955417Abstract: An electronic device includes a substrate, an upper conductive layer, and a lower conductive layer. The substrate has a plurality of inner vias and has an upper surface and a lower surface. The upper conductive layer includes an upper ground trace and an upper signal pad disposed on the upper surface. The upper ground trace is electrically connected to the ground vias and has an upper hollow portion exposing a part of the upper surface. The upper signal pad is disposed on the part of the upper surface exposed by the upper hollow portion and electrically connected to the signal via. The lower conductive layer includes a lower ground trace and a lower signal pad disposed on the lower surface. The lower conductive trace is electrically connected to the ground vias and has a lower hollow portion exposing a part of the lower surface. The lower signal pad is disposed on the part of the lower surface exposed by the lower hollow portion and electrically connected to the signal via.Type: GrantFiled: December 14, 2021Date of Patent: April 9, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Tsung-Yi Hung, Shih-Hsien Wu
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Patent number: 11756865Abstract: An electronic device having a substrate includes a substrate and at least one outer layer. The substrate has a plurality of first vias. The outer layer has a plurality of second vias. The outer layer is disposed on a side of the substrate. The first vias have a larger distribution density or quantity than the second vias so that a portion of the first vias are electrically connected to the second vias, and a portion of the first vias are electrically floating.Type: GrantFiled: January 4, 2021Date of Patent: September 12, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Sheng-Che Hung, Shih-Hsien Wu, Yu-Wei Huang
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Publication number: 20230187332Abstract: An electronic device includes a substrate, an upper conductive layer, and a lower conductive layer. The substrate has a plurality of inner vias and has an upper surface and a lower surface. The upper conductive layer includes an upper ground trace and an upper signal pad disposed on the upper surface. The upper ground trace is electrically connected to the ground vias and has an upper hollow portion exposing a part of the upper surface. The upper signal pad is disposed on the part of the upper surface exposed by the upper hollow portion and electrically connected to the signal via. The lower conductive layer includes a lower ground trace and a lower signal pad disposed on the lower surface. The lower conductive trace is electrically connected to the ground vias and has a lower hollow portion exposing a part of the lower surface. The lower signal pad is disposed on the part of the lower surface exposed by the lower hollow portion and electrically connected to the signal via.Type: ApplicationFiled: December 14, 2021Publication date: June 15, 2023Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Tsung-Yi HUNG, Shih-Hsien WU
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Publication number: 20230187361Abstract: An electronic device includes a substrate, an outer layer, a conductive line layer, and a switchable circuit chip. The substrate has a plurality of having a plurality of first vias. The outer layer is disposed on a side of the substrate and has a plurality of second vias. The first vias have a larger distribution density or quantity than the second vias, so that a part of the first vias are electrically connected to the second vias, and another part of the first vias are electrically floating. The conductive line layer is disposed on the outer layer and has a plurality of conductive traces. The conductive traces are electrically connected to the second vias. The switchable circuit chip is electrically connected to the first vias. The conductive traces are electrically connected to the switchable circuit chip.Type: ApplicationFiled: December 14, 2021Publication date: June 15, 2023Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Tsung-Yi HUNG, Shih-Hsien WU
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Patent number: 11469484Abstract: A circuit structure includes a substrate integrated waveguide, a substrate disposed on the substrate integrated waveguide, a waveguide signal feeding element and a ring-shaped conductive element. The substrate integrated waveguide includes another substrate having a waveguide transmitting region, two conductive layers disposed on this substrate and covering the waveguide transmitting region, and at least one waveguide conductive element passing through this substrate and electrically connected to the two conductive layers. The at least one waveguide conductive element surrounds the waveguide transmitting region. One of the conductive layers is located between the two substrates. The waveguide signal feeding element passes through one substrate and one conductive layer between the substrates, and the waveguide signal feeding element extends to the waveguide transmitting region. The waveguide signal feeding element is electrically insulated from one conductive layer.Type: GrantFiled: March 17, 2020Date of Patent: October 11, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsiang En Ding, Shih-Hsien Wu
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Publication number: 20220201870Abstract: A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable bending radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the tolerable bending radius being smaller than the minimum surface curvature radius is ensured. The flexible electronic package device is disposed on the selected portion.Type: ApplicationFiled: December 18, 2020Publication date: June 23, 2022Applicant: Industrial Technology Research InstituteInventors: Chien-Min Hsu, Chih-Ming Shen, Shih-Hsien Wu
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Patent number: 11363724Abstract: A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable bending radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the tolerable bending radius being smaller than the minimum surface curvature radius is ensured. The flexible electronic package device is disposed on the selected portion.Type: GrantFiled: December 18, 2020Date of Patent: June 14, 2022Assignee: Industrial Technology Research InstituteInventors: Chien-Min Hsu, Chih-Ming Shen, Shih-Hsien Wu
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Patent number: 11239141Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.Type: GrantFiled: September 24, 2020Date of Patent: February 1, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ren-Shin Cheng, Shih-Hsien Wu, Yu-Wei Huang, Chih Ming Shen, Yi-Chieh Tsai
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Publication number: 20220005754Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.Type: ApplicationFiled: September 24, 2020Publication date: January 6, 2022Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ren-Shin CHENG, Shih-Hsien WU, Yu-Wei HUANG, Chih Ming SHEN, Yi-Chieh TSAI
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Publication number: 20210257279Abstract: An electronic device having a substrate includes a substrate and at least one outer layer. The substrate has a plurality of first vias. The outer layer has a plurality of second vias. The outer layer is disposed on a side of the substrate. The first vias have a larger distribution density or quantity than the second vias so that a portion of the first vias are electrically connected to the second vias, and a portion of the first vias are electrically floating.Type: ApplicationFiled: January 4, 2021Publication date: August 19, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Sheng-Che HUNG, Shih-Hsien WU, Yu-Wei HUANG
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Patent number: 11061694Abstract: A reconfigurable data bus system comprises a driver, a receiver, a data bus and a detector. The driver stores an electrical parameter data base. The electrical parameter data base includes a plurality of different signal-to-ground ratios and a plurality of signal quality parameters corresponding to the signal-to-ground ratios. The data bus includes a plurality of signal lines electrically connected between the driver and the receiver. The detector is electrically connected to the data bus and the driver. The detector is configured to detect a current signal quality parameter of the data bus and transmit the current signal quality parameter to the driver. The driver is selectively reconfigured a current signal-to-ground ratio according to a current signal quality parameter of the data bus and the electrical parameter database.Type: GrantFiled: November 7, 2019Date of Patent: July 13, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Min Hsu, Shih-Hsien Wu
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Publication number: 20210203052Abstract: A circuit structure includes a substrate integrated waveguide, a substrate disposed on the substrate integrated waveguide, a waveguide signal feeding element and a ring-shaped conductive element. The substrate integrated waveguide includes another substrate having a waveguide transmitting region, two conductive layers disposed on this substrate and covering the waveguide transmitting region, and at least one waveguide conductive element passing through this substrate and electrically connected to the two conductive layers. The at least one waveguide conductive element surrounds the waveguide transmitting region. One of the conductive layers is located between the two substrates. The waveguide signal feeding element passes through one substrate and one conductive layer between the substrates, and the waveguide signal feeding element extends to the waveguide transmitting region. The waveguide signal feeding element is electrically insulated from one conductive layer.Type: ApplicationFiled: March 17, 2020Publication date: July 1, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsiang En DING, Shih-Hsien WU
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Publication number: 20200142713Abstract: A reconfigurable data bus system comprises a driver, a receiver, a data bus and a detector. The driver stores an electrical parameter data base. The electrical parameter data base includes a plurality of different signal-to-ground ratios and a plurality of signal quality parameters corresponding to the signal-to-ground ratios. The data bus includes a plurality of signal lines electrically connected between the driver and the receiver. The detector is electrically connected to the data bus and the driver. The detector is configured to detect a current signal quality parameter of the data bus and transmit the current signal quality parameter to the driver. The driver is selectively reconfigured a current signal-to-ground ratio according to a current signal quality parameter of the data bus and the electrical parameter database.Type: ApplicationFiled: November 7, 2019Publication date: May 7, 2020Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Min HSU, Shih-Hsien WU
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Patent number: 10448501Abstract: A circuit structure includes an annular conductor, a conductive via and at least one extension conductor. The annular conductor extends along a direction. The conductive via is disposed in the annular conductor and extending along the direction. The at least one extension conductor is electrically connected to at least one end of the annular conductor and extending toward the conductive via.Type: GrantFiled: December 14, 2015Date of Patent: October 15, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventor: Shih-Hsien Wu
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Patent number: 10405418Abstract: A differential signal transmitting circuit board includes a substrate, at least two differential conductive elements, and at least one insulating element. The differential conductive elements are disposed in the substrate. The insulating element is disposed in the substrate. The insulating element is close to or contacted to the differential conductive elements. A material of the substrate has a first equivalent dielectric constant. A material of the insulating element has a second equivalent dielectric constant. The first equivalent dielectric constant is different from the second equivalent dielectric constant.Type: GrantFiled: December 21, 2016Date of Patent: September 3, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Min Hsu, Shih-Hsien Wu
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Patent number: 10276908Abstract: An electromagnetic wave transmission board comprises a substrate. The substrate comprises a first dielectric layer and a second dielectric layer, and the first dielectric layer is stacked on the second dielectric layer. The first dielectric layer and the second dielectric layer together form a wave guiding space. The wave guiding space is configured for transmitting electromagnetic wave.Type: GrantFiled: March 24, 2017Date of Patent: April 30, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Wei Huang, Shih-Hsien Wu, Wei-Chung Lo
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Publication number: 20180183127Abstract: An electromagnetic wave transmission board comprises a substrate. The substrate comprises a first dielectric layer and a second dielectric layer, and the first dielectric layer is stacked on the second dielectric layer. The first dielectric layer and the second dielectric layer together form a wave guiding space. The wave guiding space is configured for transmitting electromagnetic wave.Type: ApplicationFiled: March 24, 2017Publication date: June 28, 2018Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Wei HUANG, Shih-Hsien WU, Wei-Chung LO
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Publication number: 20180177044Abstract: A differential signal transmitting circuit board includes a substrate, at least two differential conductive elements, and at least one insulating element. The differential conductive elements are disposed in the substrate. The insulating element is disposed in the substrate. The insulating element is close to or contacted to the differential conductive elements. A material of the substrate has a first equivalent dielectric constant. A material of the insulating element has a second equivalent dielectric constant. The first equivalent dielectric constant is different from the second equivalent dielectric constant.Type: ApplicationFiled: December 21, 2016Publication date: June 21, 2018Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Min HSU, Shih-Hsien WU
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Publication number: 20180033772Abstract: A semiconductor device is provided. The semiconductor device includes at least one first die, a rib structure enclosing the at least one first die, and a molding layer covering the at least one first die. The rib structure is formed of a first material and the molding layer is formed of a second material. A Young's modulus of the first material is larger than a Young's modulus of the second material. The rib structure includes a through hole, and the through hole is filled with a conductive material.Type: ApplicationFiled: October 11, 2017Publication date: February 1, 2018Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Ming SHEN, Shih-Hsien WU, Ming-Ji DAI