Abstract: An embedded capacitor core includes a first set of capacitors, a second set of capacitors, and an inter-layer dielectric film between the first set of capacitors and the second set of capacitors. The first set of capacitors includes: a first conductive pattern comprising at least two conductive electrodes; a second conductive pattern comprising at least two conductive electrodes corresponding to the two conductive electrodes of the first conductive pattern; and a first dielectric film between the first conductive pattern and the second conductive pattern. The second set of capacitors includes: a third conductive pattern comprising at least two conductive electrodes; a fourth conductive pattern comprising at least two conductive electrodes corresponding to the two conductive electrodes of the fourth conductive pattern; and a second dielectric film between the third conductive pattern and the fourth conductive pattern.

Abstract: This invention discloses a composite distributed dielectric structure. It comprises one or more conductor layers, one or more dielectric layers distributed on the conductor layers, and one or more conductor traces distributed on the dielectric layers. One or more dielectric plates can be further around the conductor traces. The dielectric layers or plates may or may not have plural dielectric materials therein, respectively described in two embodiments. Each conductor trace lies on a dielectric material without crossing two different dielectric materials. Two or more dielectric layers may be stacked on the conductor layers The invention provides a low cost and practical dielectric structure for interconnect systems to reduce dielectric loss, cross talk, and signal propagation delay and to well control the impedance matching while maintaining proper heat dissipation and noise reduction at high frequency transmission.

Abstract: A compositive laminate substrate applicable for integrated and minimized electronic circuits is composed of at least an inorganic substrate and an organic substrate. The inorganic substrate is embedded with resistors, capacitors and inductors. Through the organic substrate (printed circuit boards), outer I/O ports are connected with the passive components of the inorganic substrate.