Abstract: An antenna for multi-broadband and multi-polarization communication, may include a plurality of radiators configured to jointly function as one or more dipoles, a first feed terminal for a first signal of a first polarization, and a second feed terminal for a second signal of a second polarization different from the first polarization. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands. In an embodiment, the antenna may further include a third feed terminal for a third signal of the first polarization, and a fourth feed terminal for a fourth signal of the second polarization.

Abstract: An antenna structure is provided. The antenna structure includes a first metal layer and a second metal layer disposed over the first metal layer. The second metal layer forms a first antenna resonating element operating at a first band and has a first opening. The antenna structure also includes a third metal layer disposed over the second metal layer. The third metal layer forms a second antenna resonating element operating at a second band, which is different from the first band. The antenna structure further includes a first transmission line extending from the first metal layer to the second metal layer and a second transmission line extending from the first metal layer through the first opening to the third metal layer.

Abstract: An antenna module is provided. The antenna module includes a dielectric substrate, a radio frequency integrated circuit (RFIC) and a first number of first antennas. The radio frequency integrated circuit (RFIC) is disposed on the dielectric substrate, wherein the RFIC comprises a single first antenna port group and second antenna port groups to receive or transmit signals. The first number of first antennas is arranged in a first row on the dielectric substrate, wherein at least two of the first antennas are connected to the first antenna port group of the RFIC.

Abstract: An antenna and an electronic device including the antenna are provided. The antenna includes a pair of radiators, a pair of feeding elements, first and second feeding ports. The radiators are located beside a geometric origin and separated from each other. The geometric origin is located between the radiators. The feeding elements are located below the pair of radiators and are configured to feed signals to the radiators. The pair of feeding elements includes a first feeding element and a second feeding element that are separated from each other. The first feeding element has a first geometric configuration. The second feeding element has a second geometric configuration that is asymmetric to the first geometric configuration. The first feeding port is electrically connected to the first feeding element. The second feeding port is separated from the first feeding port and electrically connected to the second feeding element.

Abstract: An antenna is provided. The antenna includes a first radiator and a second radiator. The first radiator includes a first section and a second section. The first section includes a first grounding edge and a first bending edge. The second section is connected to the first bending edge. The first grounding edge is grounded. The first section is not parallel to the second section. A first slot is formed on the first section. The second radiator includes a third section and a fourth section. The third section includes a second grounding edge and a second bending edge. The fourth section is connected to the second bending edge. The second grounding edge is grounded. The third section is not parallel to the fourth section. The first section is parallel to the third section.

Abstract: An antenna module, comprising: a substrate; at least one first antenna array, located on the substrate, comprising at least one first antenna and having a first maximum radiation direction; and at least one second antenna array, located on the substrate, comprising at least one second antenna and having a second maximum radiation direction. A communication device using the antenna module is also disclosed.

Abstract: An antenna is provided. The antenna includes a first radiator positioned at a first level and connected to a ground plane at a second level. In a top view, the first radiator has a first edge, a second edge, a third edge, a fourth edge and a first arc edge. The second edge and the third edge are connected to opposite ends of the first edge. The fourth edge is connected to an end of the third edge opposite to the first edge. The first arc edge with a first radius has opposite ends respectively connected to the second edge and the fourth edge. The first arc edge has a first arc length corresponding to a first central angle, which is less than 90 degrees.

Abstract: A semiconductor package structure is provided. The structure includes a package substrate having a first surface and a second surface opposite to the first surface and including a ground layer embedded therein. A semiconductor die is formed on the first surface of the package substrate and an antenna pattern layer is formed on the second surface of the package substrate and electrically coupled to the semiconductor die. The structure also includes a first connector and a second connector formed on the second surface of the package substrate and arranged adjacent to the antenna pattern layer. The first connector is electrically coupled to the semiconductor die and electrically isolated to the ground layer, and the second connector is electrically coupled to the ground layer. A wireless communication device including the semiconductor package structure is also provided.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. An antenna structure includes a first antenna element formed in the RDL structure, a first insulating layer covering the RDL structure, a second insulating layer formed on the first insulating layer, and a second antenna element formed on and in direct contact with the second insulating layer.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.

Abstract: An antenna module includes a first dielectric layer, an antenna layer, a grounding layer and a conductive layer. The first dielectric layer has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface and a first dielectric lateral surface extending between the first dielectric surface and the second dielectric surface. The antenna layer is formed on the first dielectric surface. The grounding layer is formed below the second dielectric surface. The conductive layer is formed on the first dielectric lateral surface of first dielectric layer, wherein the conductive layer electrically connects to the grounding layer and extends from the grounding layer toward the antenna layer but not contacts the first dielectric surface.

Abstract: An antenna for multi-broadband and multi-polarization communication, may include a plurality of radiators configured to jointly function as one or more dipoles, a first feed terminal for a first signal of a first polarization, and a second feed terminal for a second signal of a second polarization different from the first polarization. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands. In an embodiment, the antenna may further include a third feed terminal for a third signal of the first polarization, and a fourth feed terminal for a fourth signal of the second polarization.

Abstract: An antenna module includes a first dielectric layer, an antenna layer, an electronic element and a first antenna tuning element. The first dielectric layer has an first dielectric surface and a second dielectric surface opposite to the first dielectric surface in a thickness direction. The antenna layer is formed in the first dielectric layer or formed on the first dielectric surface. The electronic element is disposed near to the second dielectric surface than to the first dielectric surface. The first antenna tuning element is formed on one of the first dielectric surface and the second dielectric surface and connected to the antenna layer. The first antenna tuning element and the electronic element are disposed in the thickness direction.

Abstract: The invention provides an antenna for multi-broadband and multi-polarization communication, which may include a plurality of radiators configured to jointly function as one or more dipoles, and a plurality of parasitic elements. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands, and may comprise an arm and a ground wall connecting the arm and a ground plane. The arm may comprise an arm plate and a folded arm. The ground wall may comprise a meandering portion causing a distance between the arm and the ground plane to be shorter than a length of a current conduction path along the ground wall between the arm and the ground plane. On a geometric reference surface, a projection of each parasitic element may extend between two gaps which clamp a projection of an associated one of the radiators.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. An antenna structure includes a first antenna element formed in the RDL structure, a first insulating layer covering the RDL structure, a second insulating layer formed on the first insulating layer, and a second antenna element formed on and in direct contact with the second insulating layer.

Abstract: An antenna device includes a substrate, a feed line and an antenna. The substrate is formed with a non-opaque material. The feed line is disposed at the substrate and has a first terminal and a second terminal. The antenna is disposed at the substrate, electrically connected to the first terminal of the feed line, and is used to access a wireless signal. The second terminal of the feed line is electrically connected to a chip disposed on the substrate.

Abstract: An antenna module includes a first dielectric layer, an antenna layer, a grounding layer and a conductive layer. The first dielectric layer has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface and a first dielectric lateral surface extending between the first dielectric surface and the second dielectric surface. The antenna layer is formed on the first dielectric surface. The grounding layer is formed below the second dielectric surface. The conductive layer is formed on the first dielectric lateral surface of first dielectric layer, wherein the conductive layer electrically connects to the grounding layer and extends from the grounding layer toward the antenna layer but not contacts the first dielectric surface.

Abstract: A radio frequency (RF) system and a communication device are provided. The RF system includes a flexible circuit board, a first antenna module and a RF module. The flexible circuit board has a first surface and a second surface, and the first surface and the second surface are located at different sides of the flexible circuit board. The first antenna module is disposed on the first surface of the flexible circuit board. The first antenna module includes a first carrier, a first antenna element disposed on or in the first carrier, and a first conductive member between the first carrier and the flexible circuit board. The RF module is disposed on the second surface of the flexible circuit board and electrically connected to the first antenna module.

Abstract: An antenna device includes a first dipole antenna, a second loop shaped antenna, a first feed line and a second feed line. The first dipole antenna operates at a first frequency band. The first dipole antenna includes a first portion and a second portion. The second loop shaped antenna operates at a second frequency band different from the first frequency band. A first terminal of the second loop shaped antennal is coupled to a second terminal of the first portion of the first dipole antenna. A second terminal of the second loop shaped antenna is coupled to a first terminal of the second portion of the first dipole antenna. The first feed line is coupled to the second terminal of the first portion of the first dipole antenna. The second feed line is coupled to the first terminal of the second portion of the first dipole antenna.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.