Abstract: An antenna device includes a substrate, a feed line and an antenna. The substrate is formed with a non-opaque material. The feed line is disposed at the substrate and has a first terminal and a second terminal. The antenna is disposed at the substrate, electrically connected to the first terminal of the feed line, and is used to access a wireless signal. The second terminal of the feed line is electrically connected to a chip disposed on the substrate.

Abstract: An antenna module includes a first dielectric layer, an antenna layer, a grounding layer and a conductive layer. The first dielectric layer has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface and a first dielectric lateral surface extending between the first dielectric surface and the second dielectric surface. The antenna layer is formed on the first dielectric surface. The grounding layer is formed below the second dielectric surface. The conductive layer is formed on the first dielectric lateral surface of first dielectric layer, wherein the conductive layer electrically connects to the grounding layer and extends from the grounding layer toward the antenna layer but not contacts the first dielectric surface.

Abstract: A radio frequency (RF) system and a communication device are provided. The RF system includes a flexible circuit board, a first antenna module and a RF module. The flexible circuit board has a first surface and a second surface, and the first surface and the second surface are located at different sides of the flexible circuit board. The first antenna module is disposed on the first surface of the flexible circuit board. The first antenna module includes a first carrier, a first antenna element disposed on or in the first carrier, and a first conductive member between the first carrier and the flexible circuit board. The RF module is disposed on the second surface of the flexible circuit board and electrically connected to the first antenna module.

Abstract: An antenna device includes a first dipole antenna, a second loop shaped antenna, a first feed line and a second feed line. The first dipole antenna operates at a first frequency band. The first dipole antenna includes a first portion and a second portion. The second loop shaped antenna operates at a second frequency band different from the first frequency band. A first terminal of the second loop shaped antennal is coupled to a second terminal of the first portion of the first dipole antenna. A second terminal of the second loop shaped antenna is coupled to a first terminal of the second portion of the first dipole antenna. The first feed line is coupled to the second terminal of the first portion of the first dipole antenna. The second feed line is coupled to the first terminal of the second portion of the first dipole antenna.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.

Abstract: A multi-band dual-polarized antenna structure is provided. The multi-band dual-polarized antenna structure includes a first antenna array, a second antenna array and a third antenna array. The first antenna array is arranged in a first row and operating at a first frequency. The second antenna array is arranged in a second row, operates at a second frequency and has a first polarized direction. The third antenna array is arranged in the second row, operates at the second frequency and has a second polarized direction different from the first polarized direction.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.

Abstract: A millimeter wave antenna device includes an antenna array, a first parasitic element and a second parasitic element. The antenna array includes m×n antennas and is disposed in an antenna area. The first parasitic element is disposed beside a first side of the antenna area. The second parasitic element is disposed beside a second side of the antenna area. None of the first parasitic element and the second parasitic element overlaps with the antenna area.

Abstract: An antenna assembly includes a first antenna element coupled to RF circuitry via a first feeder, and a second antenna element coupled to the RF circuitry via a second feeder. The first feeder and the second feeder have different shapes. The first antenna element and the second antenna element radiate in different frequency bands and in a direction parallel to a ground plane. The ground plane is disposed on at least one layer in a substrate that includes a plurality of layers parallel to one another. The first antenna element is disposed on first one or more of the layers and the second antenna element is disposed on second one or more of the layers, which are different from the first one or more of the layers. Another antenna assembly includes a first subarray of the first antenna elements and a second subarray of the second antenna elements.

Abstract: An antenna device includes a substrate, a feed line and an antenna. The substrate is formed with a non-opaque material. The feed line is disposed at the substrate and has a first terminal and a second terminal. The antenna is disposed at the substrate, electrically connected to the first terminal of the feed line, and is used to access a wireless signal. The second terminal of the feed line is electrically connected to a chip disposed on the substrate.

Abstract: The invention provides an antenna module of improved performances; the antenna module may comprise a plurality of first antennas for signaling at a first band, and a plurality of second antennas for signaling at a second band different from the first band. Each said first antenna may comprise a main radiator which resonates at a mode-one frequency and a mode-two frequency different from the mode-one frequency; and the main radiator may be configured such that the mode-one frequency may be in the first band, and the mode-two frequency may not be in the first band and the second band.

Abstract: The invention is directed to a communication device. The communication device includes a millimeter-wave antenna array and an appearance metal element. The appearance metal element has an antenna window. The millimeter-wave antenna array is configured to transmit or receive a wireless signal. The wireless signal is transferred through the antenna window of the appearance metal element.

Abstract: The invention provides an antenna for multi-broadband and multi-polarization communication, which may include a plurality of radiators configured to jointly function as one or more dipoles, and a plurality of parasitic elements. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands, and may comprise an arm and a ground wall connecting the arm and a ground plane. The arm may comprise an arm plate and a folded arm. The ground wall may comprise a meandering portion causing a distance between the arm and the ground plane to be shorter than a length of a current conduction path along the ground wall between the arm and the ground plane. On a geometric reference surface, a projection of each parasitic element may extend between two gaps which clamp a projection of an associated one of the radiators.

Abstract: The invention is directed to a communication device. The communication device includes a millimeter-wave antenna array and an appearance metal element. The appearance metal element has an antenna window. The millimeter-wave antenna array is configured to transmit or receive a wireless signal. The wireless signal is transferred through the antenna window of the appearance metal element.

Abstract: A millimeter wave antenna device includes an antenna array, a first parasitic element and a second parasitic element. The antenna array includes m×n antennas and is disposed in an antenna area. The first parasitic element is disposed beside a first side of the antenna area. The second parasitic element is disposed beside a second side of the antenna area. None of the first parasitic element and the second parasitic element overlaps with the antenna area.

Abstract: The invention provides an antenna module of improved performances; the antenna module may comprise a plurality of first antennas for signaling at a first band, and a plurality of second antennas for signaling at a second band different from the first band. Each said first antenna may comprise a main radiator which resonates at a mode-one frequency and a mode-two frequency different from the mode-one frequency; and the main radiator may be configured such that the mode-one frequency may be in the first band, and the mode-two frequency may not be in the first band and the second band.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.

Abstract: A multi-band dual-polarized antenna structure is provided. The multi-band dual-polarized antenna structure includes a first antenna array, a second antenna array and a third antenna array. The first antenna array is arranged in a first row and operating at a first frequency. The second antenna array is arranged in a second row, operates at a second frequency and has a first polarized direction. The third antenna array is arranged in the second row, operates at the second frequency and has a second polarized direction different from the first polarized direction.

Abstract: A multi-band antenna array includes a plurality of first antennas for resonating at a first band, and a plurality of second antennas for resonating at a second band. A frequency of the second band is higher than a frequency of the first band. Locations of the plurality of first antennas project to a plurality of grid-one positions on a surface; locations of the plurality of second antennas project to a plurality of grid-two positions on the surface. Among the grid-one positions, a second grid-one position is nearest to a first grid-one position by a first distance along a first direction. Among the grid-two positions, a first grid-two position and a second grid-two position are closest two to the first grid-one position. The first and second grid-two positions are separated by a second distance along a second direction; and, the first direction and the second direction are nonparallel.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. An antenna structure includes a first antenna element formed in the RDL structure, a first insulating layer covering the RDL structure, a second insulating layer formed on the first insulating layer, and a second antenna element formed on and in direct contact with the second insulating layer.