Abstract: A fabrication method for a non-volatile memory includes providing a first metal oxide semiconductor (MOS) transistor having a control gate and a second MOS transistor having a source, a drain, and a floating gate. The first MOS transistor and the second MOS transistor are formed on a well. The method further includes biasing the first MOS with a first biasing voltage to actuate the first MOS transistor, biasing the second MOS transistor with a second biasing voltage to enable the second MOS transistor to generate a gate current, and adjusting capacitances between the floating gate of the second MOS transistor and the drain, the source, the control gate, and the well according to voltage difference between the floating gate of the second MOS transistor and the source of the second MOS transistor.

Abstract: A low voltage single-poly flash memory cell includes a first ion well of a first conductivity type, a second ion well of a second conductivity type formed on the first ion well, a charge storage layer comprising a first insulating layer, a trapping layer, and a second insulating layer, located on the second ion well, a gate located on the charge storage layer, a sourceand a drain of the second conductivity type located in two sides of the charge storage layer, and an ion doped region of the first conductivity type formed in the second ion well and under and surrounding the source and at least a portion of a bottom of the first insulating layer.

Abstract: A novel structure of nonvolatile memory is disclosed. The nonvolatile memory includes two serially connected PMOS transistors. The characteristic of the devices is that bias is not necessary to apply to the floating gate during the programming mode. Thus, the control gate is omitted for the structure or layout, thereby saving the space for making the control gate. The carrier may be “automatically injected” into floating gate for programming the status of the devices.

Abstract: An erasable programmable read only memory includestwo serially connected P-type metal-oxide semiconductor (MOS) transistors,wherein a first P-type MOS transistor acts as selecttransistor, a gate of the first P-type MOS transistor is coupled to select gate voltage, a first node of the firstP-type MOS transistor connected to source linevoltage, a second node of the first P-type MOS transistor connected to a first node of a second P-type MOS transistor, wherein a second node of the second P-type MOS transistor is connected to bit line voltage, wherein a gate of the secondP-type MOS transistor serves as a floating gate, wherein the erasable programmable read only memory does not need to bias a certain voltage on a control gate for programming and thereby injecting hot carriers onto the floating gate, and wherein the erasable programmable read only memory is capped by dielectric materials which are transparent to ultraviolet (UV) light.

Abstract: A low-voltage nonvolatile memory array includes an N type semiconductor substrate having a memory region. A deep P well is formed in the semiconductor substrate. A cell N well is located within the memory region in the semiconductor substrate. The cell N well is situated above the deep ion well. A shallow P well serving as a buried bit line is doped within the cell ion well. The shallow P well is isolated by an STI layer, wherein the STI layer has a thickness greater than a well depth of the shallow ion well. At least one memory transistor with a stacked gate, a source, and a drain is formed on the shallow ion well. The source of the memory transistor is electrically coupled to the cell N well to induce a capacitor between the cell N well and the deep P well during a read operation, thereby avoiding read current bounce or potential power crash.

Abstract: A method for forming an electrically programmable read-only memory(EPROM) includes forming a first p+ doped region, a second p+ doped region, and a third p+ doped region on an N-well, forming a control gate between the first p+ doped region and the second p+ doped region, and forming a p+ floating gate between the second p+ doped region and the third p+ doped region.

Abstract: A flash memory structure and method of fabrication is introduced. The flash memory structure includes a plurality of parallel word lines positioned on a semiconductor substrate, a plurality of parallel source lines with first conductivity type positioned perpendicularly to the word lines and within the semiconductor substrate, two bit lines with first conductivity type positioned on two sides of each source line and within the semiconductor substrate, a doped region with second conductivity type positioned beneath and surrounding each bit line, a contact plug positioned in each bit line for electrically connecting to the bit line and a corresponding doped region beneath and surrounding the bit line, and a gate positioned on an overlapped region of the semiconductor substrate and each word line.

Abstract: A single-poly EEPROM is disxlosed. The single-poly EEPROM includes a first PMOS transistor that is serially connected to a second PMOS transistor. The first and second PMOS transistors are both formed on an N-well of a P-type substrate. The first PMOS transistor includes a floating gate, a first P+ doped drain region, and a first P+ doped source region. The second PMOS transistor includes a gate and second P+ doped source region. The first P+ doped source region of the first PMOS trasistor serves as a drain of the second PMOS transistor. An erase gate extending to the floating gate for erasing the single-poly EEPROM is provided in the P-type substrate.

Abstract: A method for controlling a non-volatile dynamic random access memory provides a non-volatile dynamic random access memory having a storage unit and a control unit. The storage unit has a floating gate for storing charges and a control gate for receiving an operating voltage to determine whether a channel is induced on the surface of a substrate. The channel corresponds to a number of charges stored on the floating gate. A parasitic capacitor exists between the storage unit and the control unit, and a capacitance of the parasitic capacitor increases when the channel has been induced. The method includes applying a first predetermined voltage to the control unit and measuring a voltage variance generated by the parasitic capacitor to analyze data stored by the storage unit.

Abstract: An erasable programmable read only memory comprising two serially connected P-type metal-oxide semiconductor (MOS) transistors wherein the control gate is omitted in the structure for layout as the bias is not necessary to apply to the floating gate during the programming mode.

Abstract: A single-poly EEPROM is disclosed. The single-poly EEPROM includes a first PMOS transistor that is serially connected to a second PMOS transistor. The first and second PMOS transistors are both formed on an N-well of a P-type substrate. The first PMOS transistor includes a floating gate, a first P+ doped drain region, and a first P+ doped source region. The second PMOS transistor includes a gate and second P+ doped source region. The first P+ doped drain region of the first PMOS transistor serves as a drain of the second PMOS transistor. An erase gate extending to the floating gate for erasing the single-poly EEPROM is provided in the P-type substrate.

Abstract: A low voltage single-poly flash memory cell includes a first ion well of a first conductivity type, a second ion well of a second conductivity type formed on the first ion well, a charge storage layer comprising a first insulating layer, a trapping layer, and a second insulating layer, located on the second ion well, a gate located on the charge storage layer, a sourceand a drain of the second conductivity type located in two sides of the charge storage layer, and an ion doped region of the first conductivity type formed in the second ion well and under and surrounding the source and at least a portion of a bottom of the first insulating layer.

Abstract: A non-volatile semiconductor memory cell structure and method of manufacture. The method includes the steps of forming a shallow first-type well layer, a second-type well layer and a deep first-type well layer over a substrate, forming stack gates over the shallow first-type well layer and finally forming source terminals and drain terminals. The source terminals penetrate through the shallow first-type well layer and connect with the second-type well layer. The drain terminals are close to the surface of the shallow first-type well layer. Both the source terminals and the drain terminals contain second type dopants.

Abstract: An electrically erasable programmable logic device (EEPLD) includes a P type semiconductor substrate. An N type well is formed on the P type semiconductor substrate. A first PMOS transistor is formed on the N well. The first PMOS transistor comprises a floating gate, a first P+ doped region serving as a drain of the first PMOS transistor, and a P− doped region encompassing an N+ doped region for erasing the first PMOS transistor. A second PMOS transistor is also formed on the N well and serially connected to the first PMOS transistor. The first P+ doped region functions as a source of the second PMOS transistor, and the second PMOS transistor further comprises a select gate and a second P+ doped region serving as a drain of the second PMOS transistor.

Abstract: The present invention proposes a novel structure of nonvolatile memory. The aspect of the present invention includes two serially connected PMOS transistor. The characteristic of the devices is that bias is not necessary to apply to the floating gate during the programming mode. Thus, the control gate is omitted for the structure or layout, thereby saving the space for making the control gate. The present invention may “automatically inject” carrier into floating gate for programming the status of the device.

Abstract: A nonvolatile semiconductor memory capable of random programming has a semiconductor substrate of a first conductivity type having a memory region, a deep ion well of a second conductivity type located in the semiconductor substrate within the memory region, a shallow ion well of the first conductivity type isolated by an STI layer within the deep ion well, at least one NAND cell block located on the semiconductor substrate within the shallow ion well, and a bit line located over the semiconductor substrate used to provide a first predetermined voltage for the shallow ion well during a data program mode via a conductive plug which electrically connects to the bit line and extends downward to the shallow ion well. Consequently, during a programming operation, only a selected word line is required to have an appropriate voltage applied to it. Thus, the power needed is reduced and access time is shortened.