Abstract: A temperature-sensing device configured to monitor a temperature is disclosed. The temperature-sensing device includes: a first capacitor comprising a first oxide layer with a first thickness; a second capacitor comprising a second oxide layer with a second thickness, wherein the second thickness of the second oxide layer is different from the first thickness of the first oxide layer; and a control logic circuit, coupled to the first and second capacitors, and configured to determine whether the monitored temperature is equal to or greater than a threshold temperature based on whether at least one of the first and second oxide layers breaks down.

Abstract: A memory circuit includes: a memory configured to store a data unit and parity bits, the parity bits including data parity bits based on the data unit and write address parity bits based on a write address associated with the stored data unit; a write address port configured to receive the write address for the stored data unit; a first decoding circuit configured to determine when a data error exists based on the stored data unit and the data parity bits; a second decoding circuit configured to generate a decoded write address from a read address and the write address parity bits; and an error detecting circuit configured to determine when an address error exists based on a comparison of the decoded write address to the read address.

Abstract: Disclosed is a physical unclonable function generator circuit and testing method. In one embodiment, a physical unclonable function (PUF) generator includes: a PUF cell array comprising a plurality of bit cells configured in a plurality of columns and at least one row, wherein each of the plurality of columns is coupled to at least two pre-discharge transistors, and each of the plurality of bit cells comprises at least one enable transistor, at least two access transistors, and at least two storage nodes, and a PUF control circuit coupled to the PUF cell array, wherein the PUF control circuit is configured to access the plurality of bit cells to pre-charge the at least two storage nodes with substantially the same voltages allowing each of the plurality of bit cell having a first metastable logical state; to determine a second logical state; and based on the determined second logical states of the plurality of bit cells, to generate a PUF signature.

Abstract: An integrated circuit includes a first set of inverters configured to receive a first set of check bits, and to generate a second set of check bits, a first memory cell array including a first portion of memory cells configured to store a first set of data, and a second portion of memory cells configured to store the second set of check bits, a second set of inverters to receive a third set of check bits, and to generate a fourth set of check bits, and an error correction code decoder configured to detect or correct an error in a second set of data or the fourth set of check bits thereby generating a set of output data and a been-attacked signal. The second set of data corresponds to the first set of data. The been-attacked signal indicates a reset attack by a user.

Abstract: A method of testing a three dimensional (3D) memory cell array includes writing data to each layer of memory cells in the 3D memory cell array, simultaneously performing a read operation of each memory cell in at least a first pillar of the 3D memory cell array, determining whether a memory cell in the 3D memory cell array has failed in response to the read operation, and replacing at least one failed memory cell in the 3D memory cell array with a spare memory cell in response to determining that the memory cell in the 3D memory cell array has failed. The first pillar includes memory cells on each corresponding layer of the 3D memory cell array.

Abstract: A physically unclonable function (PUF) cell array includes a first PUF cell in a first column in a first direction, a second PUF cell in a second column, and a first power rail. The first PUF cell includes a first set of conductive structures that include a first conductive structure extending in the second direction and a second conductive structure extending in the first direction. The second PUF cell includes a second set of conductive structures that include a third conductive structure extending in the second direction and a fourth conductive structure extending in the first direction. The first power rail overlapping a first boundary of the first and second PUF cell. At least the first and third conductive structure, or the second and the fourth conductive structure are symmetric to each other with respect to a central line of at least the first or second PUF cell.

Abstract: A semiconductor device includes a semiconductor substrate, a conductive segment, a conductive layer, a first contact element and a second contact element. The semiconductor substrate includes an active region. The conductive segment is formed on the semiconductor substrate, and extends across the active region. The conductive layer is formed over the semiconductor substrate and the conductive segment. The first contact element, formed between the conductive segment and a first conductive portion of the conductive layer, is arranged to electrically connect the conductive segment to the first conductive portion. The second contact element is formed between the conductive segment and a second conductive portion of the conductive layer. The first contact element and the second contact element are formed on the conductive segment and spaced apart from each other. The second contact element is arranged to electrically isolate the conductive segment from the second conductive portion.

Abstract: A semiconductor structure includes a memory array, a staircase unit, conductive bridge structures, a word line driver and conductive routings. The memory array is disposed in an array region of the semiconductor structure and includes word lines. The staircase unit is disposed in a staircase region and surrounded by the array region. The staircase unit includes first and second staircase steps extending from the word lines of the memory array. The first staircase steps and the second staircase steps face towards each other. The conductive bridge structures are electrically connecting the first staircase steps to the second staircase step. The word line driver is disposed below the memory array and the staircase unit, wherein a central portion of the word line driver is overlapped with a central portion of the staircase unit. The conductive routings extend from the first and the second staircase steps to the word line driver.

Abstract: A method of generating an error correction circuit for correcting an error in a codeword read from a memory includes: constructing a generation matrix (G matrix) formed of a concatenation of a parity matrix (P matrix) and an identity matrix; determining a number of rows in the P matrix for a truncated P matrix in view of a correcting strength and a number of data bits; selecting a first subset of rows and a second subset of rows in the P matrix, wherein a first sum of row weights of each row in the first subset of rows is equal to or less than a second sum of row weights of each row in the second subset of rows; and generating the truncated P matrix by keeping the first subset of rows of the P matrix so as to minimize a number of logic gate operations.

Abstract: A memory device includes a plurality of circuit layers, a plurality of first conductive through via structures and a plurality of bitlines. The circuit layers are disposed one above another, and each circuit layer includes one or more memory cell arrays. The first conductive through via structures penetrates though the circuit layers. Each of the bitlines includes a plurality of bitline segments disposed on the circuit layers respectively. The bitline segments are electrically connected through one of the first conductive through via structures. Each bitline segment is coupled to a plurality of memory cells of a memory cell array of a circuit layer where the bitline segment is disposed.

Abstract: An integrated circuit layout is provided. The integrated circuit layout includes: a first active region having a first plurality of field effect transistors (FETs); and an interconnect contacting sources and drains of the first plurality of FETs in the first active region through a first set of contact structures. At least one of the first set of contact structures is electrically non-conductive.

Abstract: Disclosed is a physical unclonable function generator circuit and testing method. In one embodiment, a physical unclonable function (PUF) generator includes: a PUF cell array comprising a plurality of bit cells configured in a plurality of columns and at least one row, wherein each of the plurality of columns is coupled to at least two pre-discharge transistors, and each of the plurality of bit cells comprises at least one enable transistor, at least two access transistors, and at least two storage nodes, and a PUF control circuit coupled to the PUF cell array, wherein the PUF control circuit is configured to access the plurality of bit cells to pre-charge the at least two storage nodes with substantially the same voltages allowing each of the plurality of bit cell having a first metastable logical state; to determine a second logical state; and based on the determined second logical states of the plurality of bit cells, to generate a PUF signature.

Abstract: A temperature-sensing device configured to monitor a temperature is disclosed. The temperature-sensing device includes: a first capacitor comprising a first oxide layer with a first thickness; a second capacitor comprising a second oxide layer with a second thickness, wherein the second thickness of the second oxide layer is different from the first thickness of the first oxide layer; and a control logic circuit, coupled to the first and second capacitors, and configured to determine whether the monitored temperature is equal to or greater than a threshold temperature based on whether at least one of the first and second oxide layers breaks down.

Abstract: Disclosed herein are related to an age detector for determining an age of a memory block, and a method of operation of the age detector. In one configuration, a memory system includes a memory block and an age detector coupled to the memory block. In one aspect, the memory block generates a first set of data in response to a first power on, and generates a second set of data in response to a second power on. In one configuration, the age detector includes a storage block to store the first set of data from the memory block, and inconsistency detector to compare the first set of data and the second set of data. In one configuration, the age detector includes a controller to determine an age of the memory block, based on the comparison.

Abstract: A semiconductor device includes a semiconductor substrate, a conductive segment, a conductive layer, a first contact element and a second contact element. The semiconductor substrate includes an active region. The conductive segment is formed on the semiconductor substrate, and extends across the active region. The conductive layer is formed over the semiconductor substrate and the conductive segment. The first contact element, formed between the conductive segment and a first conductive portion of the conductive layer, is arranged to electrically connect the conductive segment to the first conductive portion. The second contact element is formed between the conductive segment and a second conductive portion of the conductive layer. The first contact element and the second contact element are formed on the conductive segment and spaced apart from each other. The second contact element is arranged to electrically isolate the conductive segment from the second conductive portion.

Abstract: Systems and method are provided for determining a reliability of a physically unclonable function (PUF) cell of a device. One or more activation signals are provided to a PUF cell under a plurality of conditions. A PUF cell output provided by the PUF cell under each of the plurality of conditions is determined. A determination is made of a number of times the PUF cell output of the PUF cell is consistent. And a device classification value is determined based on the determined number of times for a plurality of PUF cells.

Abstract: A semiconductor structure includes a memory array, a staircase unit, conductive bridge structures, a word line driver and conductive routings. The memory array is disposed in an array region of the semiconductor structure and includes word lines. The staircase unit is disposed in a staircase region and surrounded by the array region. The staircase unit includes first and second staircase steps extending from the word lines of the memory array. The first staircase steps and the second staircase steps face towards each other. The conductive bridge structures are electrically connecting the first staircase steps to the second staircase step. The word line driver is disposed below the memory array and the staircase unit, wherein a central portion of the word line driver is overlapped with a central portion of the staircase unit. The conductive routings extend from the first and the second staircase steps to the word line driver.

Abstract: A method of generating an error correction circuit for correcting an error in a codeword read from a memory includes: constructing a generation matrix; transforming the generating matrix into a systematic form, wherein the transformed generating matrix is composed of a parity matrix and a check matrix; sorting rows of the parity matrix according to row weights; determining a number of rows in the parity matrix to be truncated; generating a truncated parity matrix by keeping the sorted rows of the P matrix that have weights less than or equal to weights of the truncated rows of the P matrix so as to minimize a number of logic gate operations; and forming an error correction circuit with the number of logic gate operations minimized according to the truncated P matrix to correct the error of the codeword.

Abstract: A method of testing a three dimensional (3D) memory cell array includes writing data to each layer of memory cells in the 3D memory cell array, simultaneously performing a read operation of each memory cell in at least a first pillar of the 3D memory cell array, determining whether a memory cell in the 3D memory cell array has failed in response to the read operation, and replacing at least one failed memory cell in the 3D memory cell array with a spare memory cell in response to determining that the memory cell in the 3D memory cell array has failed. The first pillar includes memory cells on each corresponding layer of the 3D memory cell array.

Abstract: A memory device including a memory array with a plurality of memory macros, a power supplying circuit, and a controller is provided. The power supplying circuit is coupled to the memory array. The controller is coupled to the memory array. The power supplying circuit is configured to provide power to perform write operations to a number of the memory macros at the same time. The number of the memory macros for the write operations performed at the same time is not higher than a maximum number of the memory macros. The controller obtains the maximum number of the memory macros for the write operations performed at the same time by the power supplying circuit. The controller re-arranges a schedule for a sequence of the write operations of the memory macros to generate a re-arranged schedule. The maximum number is taken as a threshold value. In the re-arranged schedule, a number of part of the memory macros for the write operations performed at the same time is equal to or less then the threshold value.