Abstract: The present application discloses a chip socket, a testing fixture and a chip testing method thereof. The chip socket includes a pedestal, a plurality of conductive traces, a plurality of clamp structures, and a plurality of electrical contacts. The plurality of conductive traces are formed in the pedestal. The plurality of clamp structures are conductive and disposed on the first surface of the pedestal, and at least one of the plurality of clamp structures is coupled to a corresponding conductive trace and configured to clamp a solder ball of a chip to be tested. The plurality of electrical contacts are disposed on the second surface of the pedestal, and at least one of the plurality of electrical contacts is coupled to a corresponding clamp structure through a corresponding conductive trace.

Abstract: An online system presents a sponsored content page to a user in conjunction with a model serving system. The online system accesses a content page for a food item and identifies one or more sponsorship opportunities at the content page. The online system identifies one or more candidate sponsors for each sponsorship opportunity. The online system selects a bidding sponsor for the sponsorship opportunity from the one or more candidate sponsors and a candidate item associated with the bidding sponsor as a sponsored item. The online system provides a content page, a description of the sponsored item, and a request to generate a sponsored content page for the sponsorship opportunity to a model serving system. The online system receives a sponsored content page generated by a machine-learning language model at the model serving system and presents the sponsored content page to a user.

Abstract: An online concierge system receives unstructured data describing items offered for purchase by various warehouses. To generate attributes for products from the unstructured data, the online concierge system extracts candidate values for attributes from the unstructured data through natural language processing. One or more users associate a subset candidate values with corresponding attributes, and the online concierge system clusters the remaining candidate values with the candidate values of the subset associated with attributes. One or more users provide input on the accuracy of the generated clusters. The candidate values are applied as labels to items by the online concierge system, which uses the labeled items as training data for an attribute extraction model to predict values for one or more attributes from unstructured data about an item.

Abstract: An online system obtains a target food from an order for a user and alcohol preferences from an order purchase history. The online system generates a prompt for a machine learning model to request alcohol candidates based on the target food category. The prompt includes the alcohol preferences, and requests for each alcohol candidate, a pairing score indicating how well the target food category pairs with the alcohol candidate and a user preference score indicating how well the alcohol candidate aligns with the alcohol preferences. The online system receives as output the candidate alcohol items. Each alcohol candidate has the pairing score, the user preference score, and a textual reason for scores. The online system matches at least one alcohol item from a catalog with each alcohol candidate. A subset of alcohol items is presented to the user as a carousel.

Abstract: Embodiments relate to utilizing a language model to automatically generate a novel recipe with refined content, which can be offered to a user of an online system. The online system generates a first prompt for input into a large language model (LLM), the first prompt including a plurality of task requests for generating initial content of a recipe. The online system requests the LLM to generate, based on the first prompt input into the LLM, the initial content of the recipe. The online system generates a second prompt for input into the LLM, the second prompt including the initial content of the recipe and contextual information about the recipe. The online system requests the LLM to generate, based on the second prompt input into the LLM, refined content of the recipe. The online system stores the recipe with the refined content in a database of the online system.

Abstract: An online concierge system trains a fine-tuned generative image model for distinct categories of items based on a generative image model that takes a textual query as input and outputs and an associated image. Training of the fine-tuned generative image model is additionally based on a small set of representative images associated with the various categories, as well as textual tokens associated with the categories. Once trained, the fine-tuned generative image model can be used to generate realistic representative images for items in a database of the online concierge system that are lacking associated images. The fine-tuned model permits the generation of different variants of an item, such as different quantities or amounts, different packaging or packing density, and the like.

Abstract: An online system performs a task in conjunction with the model serving system or the interface system. The system generates a first prompt for input to a machine-learned language model, which specifies contextual information and a first request to generate a theme. The system provides the first prompt to a model serving system for execution by the machine-learned language model, receives a first response, and generates a second prompt. The second prompt specifies the theme and a second request to generate a third prompt for input to an image generation model that includes a third request to generate one or more images of one or more items associated with the theme. The system receives the third prompt by executing the model on the second prompt, provides the third prompt to the image generation model, and receives one or more images for presentation.

Abstract: An online concierge system receives unstructured data describing items offered for purchase by various warehouses. To generate attributes for products from the unstructured data, the online concierge system extracts candidate values for attributes from the unstructured data through natural language processing. One or more users associate a subset candidate values with corresponding attributes, and the online concierge system clusters the remaining candidate values with the candidate values of the subset associated with attributes. One or more users provide input on the accuracy of the generated clusters. The candidate values are applied as labels to items by the online concierge system, which uses the labeled items as training data for an attribute extraction model to predict values for one or more attributes from unstructured data about an item.

Abstract: A computer system uses clustering and a large language model (LLM) to normalize attribute tuples for items stored in a database of an online system. The online system collects attribute tuples, each attribute tuple comprising an attribute type and an attribute value for an item. The online system initially clusters the attribute tuples into a first plurality of clusters. The online system generates prompts for input into the LLM, each prompt including a subset of attribute tuples grouped into a respective cluster of the first plurality. Based on the prompts, the LLM generates a second plurality of clusters, each cluster including one or more attribute tuples that have a common attribute type and a common attribute value. The online system maps each attribute tuple to a respective normalized attribute tuple associated with each cluster. The online system rewrites each attribute tuple in the database to a corresponding normalized attribute tuple.

Abstract: A signal receiving circuit and a noise filtering method thereof are provided. The signal receiving circuit includes an operational amplifier circuit and a voltage offset adjustment circuit. A first input terminal and a second input terminal of the operational amplifier circuit receive a differential signal, a third input terminal receives a reference voltage, and the operational amplifier circuit compares the differential signal with the reference voltage to generate an output signal. The voltage offset adjustment circuit is coupled to the third input terminal of the operational amplifier circuit, and provides an offset voltage to adjust the reference voltage.

Abstract: Package structure and method of manufacturing the same are provided. The package structure includes a first die, a second die, a first encapsulant, a third die, and a second encapsulant. The first die and the second die laterally aside the first die. The first encapsulant laterally encapsulates the first die and the second die. The third die is electrically connected to the first die and the second die. The second encapsulant is over the first die, the second die and the first encapsulant, laterally encapsulating the third die. The first encapsulant includes a plurality of first fillers, the second encapsulant includes a plurality of second fillers, and a content of the second fillers in the second encapsulant is less than a content of the first fillers in the first encapsulant.

Abstract: A system may obtain an item description associated with an item in an item catalog. The system may generate a prompt for input to a machine-learned language model, the prompt specifying at least the item description and a request to identify one or more attributes of the item. The system may provide the prompt to a model serving system for execution by the machine-learned language model. The system may receive from the machine-learned language model, an output including a list of attributes and respective values associated with the item based on the item description. The system may standardize the formatting of the list of attributes and may store the list of attributes and the respective values for the list of attributes in association with the item in the item catalog.

Abstract: A method includes attaching semiconductor devices to an interposer structure, attaching the interposer structure to a first carrier substrate, attaching integrated passive devices to the first carrier substrate, forming an encapsulant over the semiconductor devices and the integrated passive devices, debonding the first carrier substrate, attaching the encapsulant and the semiconductor devices to a second carrier substrate, forming a first redistribution structure on the encapsulant, the interposer structure, and the integrated passive devices, wherein the first redistribution structure contacts the interposer structure and the integrated passive devices, and forming external connectors on the first redistribution structure.

Abstract: In an embodiment, a device includes: an interposer; a first integrated circuit device bonded to the interposer with dielectric-to-dielectric bonds and with metal-to-metal bonds; a second integrated circuit device bonded to the interposer with dielectric-to-dielectric bonds and with metal-to-metal bonds; a buffer layer around the first integrated circuit device and the second integrated circuit device, the buffer layer including a stress reduction material having a first Young's modulus; and an encapsulant around the buffer layer, the first integrated circuit device, and the second integrated circuit device, the encapsulant including a molding material having a second Young's modulus, the first Young's modulus less than the second Young's modulus.

Abstract: A package structure includes a redistribution circuit structure, a wiring substrate, an insulating encapsulation, and a reinforcement structure. The redistribution circuit structure has dielectric layers. The wiring substrate is disposed on the redistribution circuit structure. The insulating encapsulation laterally encapsulates the wiring substrate. The reinforcement structure includes reinforcement pattern layers and reinforcement vias. The reinforcement pattern layers and the dielectric layers are stacked alternately. The reinforcement vias penetrate through the dielectric layers to connect the reinforcement pattern layers. At least one of the reinforcement pattern layers is embedded in the insulating encapsulation. The reinforcement structure is electrically floating.

Abstract: A package structure includes a plurality of semiconductor dies, an insulating encapsulant, a redistribution layer and a plurality of connecting elements. The insulating encapsulant is encapsulating the plurality of semiconductor dies. The redistribution layer is disposed on the insulating encapsulant in a build-up direction and electrically connected to the plurality of semiconductor dies, wherein the redistribution layer includes a plurality of conductive lines, a plurality of conductive vias and a plurality of dielectric layers alternately stacked, and a lateral dimension of the plurality of conductive vias increases along the build-up direction. The connecting elements are disposed in between the redistribution layer and the semiconductor dies, wherein the connecting elements includes a body portion joined with the semiconductor dies and a via portion joined with the redistribution layer, wherein a lateral dimension of the via portion decreases along the build-up direction.

Abstract: A method of fabricating a semiconductor device is provided. The method includes providing a die stacking unit that includes a plurality of dies stacked on each other, and a plurality of conductive joints connected between each two adjacent dies. The method includes providing a plurality of dummy micro bumps and dummy pads between the two adjacent dies and between the conductive joints. The dummy micro bumps and the dummy pads are connected to one of the two adjacent dies but not to the other, and the dummy micro bumps are formed on some of the dummy pads but not on all of the dummy pads. The method includes dispensing an underfill material into gaps between the plurality of dies, the conductive joints, the dummy micro bumps, and the dummy pads.

Abstract: A package structure includes a plurality of semiconductor dies, an insulating encapsulant, a redistribution layer and a plurality of connecting elements. The insulating encapsulant is encapsulating the plurality of semiconductor dies. The redistribution layer is disposed on the insulating encapsulant in a build-up direction and electrically connected to the plurality of semiconductor dies, wherein the redistribution layer includes a plurality of conductive lines, a plurality of conductive vias and a plurality of dielectric layers alternately stacked, and a lateral dimension of the plurality of conductive vias increases along the build-up direction. The connecting elements are disposed in between the redistribution layer and the semiconductor dies, wherein the connecting elements includes a body portion joined with the semiconductor dies and a via portion joined with the redistribution layer, wherein a lateral dimension of the via portion decreases along the build-up direction.

Abstract: A signal receiving circuit and a noise filtering method thereof are provided. The signal receiving circuit includes an operational amplifier circuit and a voltage offset adjustment circuit. A first input terminal and a second input terminal of the operational amplifier circuit receive a differential signal, a third input terminal receives a reference voltage, and the operational amplifier circuit compares the differential signal with the reference voltage to generate an output signal. The voltage offset adjustment circuit is coupled to the third input terminal of the operational amplifier circuit, and provides an offset voltage to adjust the reference voltage.

Abstract: A method of fabricating a semiconductor device is provided, including providing a base substrate and a die stacking unit mounted on the base substrate. Conductive joints are connected between two adjacent dies of the die stacking unit. The method further includes providing dummy micro bumps and dummy pads between the two adjacent dies and between the conductive joints. The dummy micro bumps and the dummy pads are connected to one of the two adjacent dies but not to the other, and the dummy micro bumps are formed on some of the dummy pads but not on all of the dummy pads. In addition, the method includes filling the gaps between the base substrate, all dies of the die stacking unit, the conductive joints, the dummy micro bumps, and the dummy pads with an underfill material by capillary attraction.