Patents by Inventor Shih Wang

Shih Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10867844
    Abstract: In one exemplary aspect, a method comprises providing a semiconductor structure having a substrate, one or more first dielectric layers over the substrate, a first metal plug in the one or more first dielectric layers, and one or more second dielectric layers over the one or more first dielectric layers and the first metal plug. The method further comprises etching a via hole into the one or more second dielectric layers to expose the first metal plug, etching a top surface of the first metal plug to create a recess thereon, and applying a metal corrosion protectant comprising a metal corrosion inhibitor to the top surface of the first metal plug.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu Shih Wang, Shian Wei Mao, Ming-Hsi Yeh, Kuo-Bin Huang
  • Publication number: 20200335924
    Abstract: An expansion device includes a supporting base and a hub. The supporting base includes a bottom portion, a supporting portion, and an electrical connection port. The supporting portion is connected to the bottom portion and has an insert slot. The electrical connection port is disposed at the bottom portion. The hub is slidably disposed within the supporting portion and is located between the bottom portion and the insert slot. The hub includes a first electrical connection element and a second electrical connection element facing away from the first electrical connection element. The first electrical connection element is electrically connected to the electrical connection port, and the second electrical connection element extends into the insert slot. Another expansion device is also provided.
    Type: Application
    Filed: October 29, 2019
    Publication date: October 22, 2020
    Applicant: Acer Incorporated
    Inventors: Ting-Wen Pai, Wen-Chieh Tai, Han-Tsung Shen, Yu-Shih Wang
  • Patent number: 10770356
    Abstract: An apparatus includes a first source and a common drain and on opposite sides of a first gate surrounded by a first gate spacer, a second source and the common drain on opposite sides of a second gate surrounded by a second gate spacer, a first protection layer formed along a sidewall of the first gate spacer, wherein a top surface of the first protection layer has a first slope, a second protection layer formed along a sidewall of the second gate spacer, wherein a top surface of the second protection layer has a second slope, a lower drain contact between the first gate and the second gate and an upper drain contact over the lower drain contact and between the first gate and the second gate, wherein at least a portion of the upper drain contact is in contact with the first slope and the second slope.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: September 8, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wan Hsuan Hsu, I-Hsiu Wang, Yean-Zhaw Chen, Cheng-Wei Chang, Yu Shih Wang, Hsin-Yan Lu, Yi-Wei Chiu
  • Publication number: 20200274305
    Abstract: A plug connector includes a conductive body, an insulative body, and a ring shape conductive terminal. The conductive body has an assembling hole. The insulative body is sleeved on the conductive body, wherein the insulative body has an opening hole and the assembling hole is aligned with the opening hole. The ring shape conductive terminal is assembled in the assembling hole, wherein the ring shape conductive terminal includes a conductive inner ring and the conductive inner ring includes a plurality of conductive portions. The conductive portions are arranged circularly and each conductive portion has at least two conductive contacts.
    Type: Application
    Filed: August 2, 2019
    Publication date: August 27, 2020
    Applicant: Acer Incorporated
    Inventors: Yu-Shih Wang, Chih-Chun Liu, Wen-Chieh Tai
  • Patent number: 10717048
    Abstract: An environmental water system may include an ultrafiltration membrane, a reserves osmosis (RO) system, a waste water tank, a mixer, a total dissolved solids (TDS) controller valve, a connector, and a water tap. The environmental water system can provide pure water which is filtered through the ultrafiltration membrane and RO system. Also, a user can operate the TDS controller valve depending on the actual use requirement so as to have different TDS values of water from the water tap.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: July 21, 2020
    Inventor: Hsiang-Shih Wang
  • Patent number: 10717047
    Abstract: A reverse osmosis system may include a water supply, a filter, and a mixing member. The water supply is connected to a first water tube and a second water tube. The first water tube is connected to the filter, and the filter is connected to a drain pipe which is connected to a wastewater tank. The wastewater generated from the filter under reverse osmosis process can be discharged into the wastewater tank. The mixing member has a water inlet end, a water outlet end, and a wastewater inlet tube, which are communicated with each other, and the water inlet end of the mixing member is connected to the second water tube. When water flows through the mixing member, the negative pressure is generated to pump wastewater in the wastewater tank through the wastewater inlet tube into the mixing member, thereby achieving the effect of water saving.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: July 21, 2020
    Inventor: Hsiang-Shih Wang
  • Publication number: 20200191157
    Abstract: A heat dissipation fan suited for being assembled in an electronic device is provided. The heat dissipation fan includes a hub and a plurality of fan blades disposed at and surrounding the hub. The fan blade has ductility and flexibility, and any two fan blades next to each other are in different thickness.
    Type: Application
    Filed: December 17, 2019
    Publication date: June 18, 2020
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Hung-Chi Chen, Yu-Shih Wang, Ming-Fei Tsai
  • Patent number: 10683650
    Abstract: A toilet plunger structure is disclosed. It comprises a shell having a handle, a trigger pivotally connected to the handle and having a push part, an accommodating slot corresponding to the push part for accommodating a gas container and a positioning slot; a smasher having a positioning seat accommodated in the positioning slot of the shell and having a positioning hole and a firing pin disposed in the positioning hole; a gas pipe provided with a connecting pipe having a connecting seat connected to the positioning seat for fixation, a protecting pipe sleeved on the connecting pipe and a connecting member connected to the protecting pipe; and a dredge connector having a connecting part for correspondingly connecting the connecting member, a plugging part disposed at a bottom of the connecting part and a though hole passing through the connecting part to the plugging part for receiving the connecting pipe.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: June 16, 2020
    Assignee: CHINTUO INDUSTRIAL CO., LTD.
    Inventor: Jung-Shih Wang
  • Publication number: 20200176761
    Abstract: A composite particle for electrode includes a carbon matrix, a plurality of active nanoparticles and a plurality of graphite particles. The active nanoparticles are randomly dispersed in the carbon matrix. Each of the active nanoparticles includes an active material and a protective layer. The protective layer covers the active material, and the protective layer is an oxide, a carbide or a nitride of the active material. The graphite particles are randomly dispersed in the carbon matrix. A volume fraction of the protective layer in each of the active nanoparticles is smaller than 23.0%.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 4, 2020
    Applicant: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Chuan Pu LIU, Yin Wei CHENG, Shih An WANG, Bo Liang PENG, Chun Hung CHEN
  • Publication number: 20200051858
    Abstract: The present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In some embodiments, a structure includes a first dielectric layer over a substrate, a first conductive feature through the first dielectric layer, the first conductive feature comprising a first metal, a second dielectric layer over the first dielectric layer, and a second conductive feature through the second dielectric layer having a lower convex surface extending into the first conductive feature, wherein the lower convex surface of the second conductive feature has a tip end extending laterally under a bottom boundary of the second dielectric layer.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 13, 2020
    Inventors: Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai, Wei-Jung Lin, Yu Shih Shih Wang, Ya-Yi Cheng, I-Li Chen
  • Patent number: 10534201
    Abstract: The present invention is to provide a full-frame adhesive anti-fog film structure, comprising: an anti-fog film, which has a front side and a back side opposing the front side; and an adhesive, which is disposed at an edge of the back side and arranged along the edge so as to be frame-shaped. The anti-fog film of the present invention is attachable to a planar, cylindrical or spherical lens through the full frame-shaped adhesive so that not only can the anti-fog film be fully attached to the lens but the full attachment of film also prevents bubbles from forming between the two attached surfaces. Also, an airtight space is formed between the full-frame adhesive anti-fog film structure and the lens to stop heat transfer and prevent fog from being formed, so as to not only provide good vision to users but also reduce the chance that the user will fall prey to an accident if the user's view is blocked.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: January 14, 2020
    Assignee: U-Gin Advanced Material Co., Ltd.
    Inventor: Cheng-Shih Wang
  • Patent number: 10475702
    Abstract: The present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In some embodiments, a structure includes a first dielectric layer over a substrate, a first conductive feature through the first dielectric layer, the first conductive feature comprising a first metal, a second dielectric layer over the first dielectric layer, and a second conductive feature through the second dielectric layer having a lower convex surface extending into the first conductive feature, wherein the lower convex surface of the second conductive feature has a tip end extending laterally under a bottom boundary of the second dielectric layer.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: November 12, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai, Wei-Jung Lin, Yu Shih Wang, Ya-Yi Cheng, I-Li Chen
  • Patent number: 10455957
    Abstract: A health pillow includes a supine portion and two side-lying portions symmetrically arranged on the two opposite sides of the supine portion. Each of the side-lying portions has a front surface. The supine portion has a supporting protrusion extending beyond the two front surfaces, and the supporting protrusion has a flat surface extending outwardly and away from the two front surfaces. Whereby, the health pillow can help people to get better sleep quality.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: October 29, 2019
    Inventors: Wei-Hsuan Wang, Wei-Chien Wang, Wei-Chun Wang, Po-Shih Wang
  • Publication number: 20190316705
    Abstract: A faucet may comprise a main body, a control valve, and two press buttons. The main body is hollow to form a valve chamber therein, and the control valve is configured to be positioned in the valve chamber. A top end of the main body is connected to a water outlet tube, and a lower end thereof is configured to axially insert into the valve chamber. After the control valve is positioned in the valve chamber, a locking ring is engaged with and secured at a lower end of the valve chamber, and a water inlet tube is configured to axially penetrate through the locking ring to connect to the control valve. Each of two lateral sides of the main body has an installing hole, and two installing holes located at two corresponding positions are configured to receive and couple with the two press buttons respectively.
    Type: Application
    Filed: April 15, 2018
    Publication date: October 17, 2019
    Applicant: GEANN INDUSTRIAL CO.,LTD.
    Inventor: Hsiang-Shih Wang
  • Patent number: 10443757
    Abstract: A faucet may comprise a main body, a control valve, and two press buttons. The main body is hollow to form a valve chamber therein, and the control valve is configured to be positioned in the valve chamber. A top end of the main body is connected to a water outlet tube, and a lower end thereof is configured to axially insert into the valve chamber. After the control valve is positioned in the valve chamber, a locking ring is engaged with and secured at a lower end of the valve chamber, and a water inlet tube is configured to axially penetrate through the locking ring to connect to the control valve. Each of two lateral sides of the main body has an installing hole, and two installing holes located at two corresponding positions are configured to receive and couple with the two press buttons respectively.
    Type: Grant
    Filed: April 15, 2018
    Date of Patent: October 15, 2019
    Assignee: GEANN INDUSTRIAL CO. LTD.
    Inventor: Hsiang-Shih Wang
  • Publication number: 20190304834
    Abstract: In one exemplary aspect, a method comprises providing a semiconductor structure having a substrate, one or more first dielectric layers over the substrate, a first metal plug in the one or more first dielectric layers, and one or more second dielectric layers over the one or more first dielectric layers and the first metal plug. The method further comprises etching a via hole into the one or more second dielectric layers to expose the first metal plug, etching a top surface of the first metal plug to create a recess thereon, and applying a metal corrosion protectant comprising a metal corrosion inhibitor to the top surface of the first metal plug.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 3, 2019
    Inventors: Yu Shih Wang, Shian Wei Mao, Ming-Hsi Yeh, Kuo-Bin Huang
  • Patent number: 10431937
    Abstract: An electric connector suited for an electronic device is provided. The electric connector includes a body, a plurality of terminals, and an electrical connecting member. The body is suited to be disposed in the electronic device and has at least one receiving area located on at least one of a top portion and a bottom portion of an exterior of the body. The terminals are disposed in the body, and an external electric connector is suited to be butted to the body along a first axis to be electrically connected to the terminals. One end of the electrical connecting member is located at the receiving area to be electrically connected to the terminals, and another end of the electrical connecting member extends out of the receiving area along a second axis to be electrically connected to the electronic device. The first axis is different from the second axis.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: October 1, 2019
    Assignee: Acer Incorporated
    Inventors: Yu-Shih Wang, Pao-Min Huang, Yan-Fong Cheng, Yi-Ta Huang, Wu-Chen Lee, Cheng-Nan Ling, Wen-Neng Liao
  • Publication number: 20190287851
    Abstract: The present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In some embodiments, a structure includes a first dielectric layer over a substrate, a first conductive feature through the first dielectric layer, the first conductive feature comprising a first metal, a second dielectric layer over the first dielectric layer, and a second conductive feature through the second dielectric layer having a lower convex surface extending into the first conductive feature, wherein the lower convex surface of the second conductive feature has a tip end extending laterally under a bottom boundary of the second dielectric layer.
    Type: Application
    Filed: March 14, 2018
    Publication date: September 19, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Pin-Wen CHEN, Chia-Han LAI, Chih-Wei CHANG, Mei-Hui FU, Ming-Hsing TSAI, Wei-Jung LIN, Yu Shih WANG, Ya-Yi CHENG, I-Li CHEN
  • Patent number: 10361120
    Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back. After etching back the portion of the barrier layer, an upper portion of the barrier layer along the sidewall is smoothed. A conductive material is formed along the barrier layer and over the smoothed upper portion of the barrier layer.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: July 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin
  • Patent number: D871545
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: December 31, 2019
    Assignee: GEANN INDUSTRIAL CO., LTD.
    Inventor: Hsiang-Shih Wang