Patents by Inventor Shih Wang

Shih Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11873912
    Abstract: A vacuum breaker valve may include a valve body, a non-return member, a waterstop, and an abutting member. The valve body has a water inlet end and a water outlet end, and the valve body is connected to a pipe so as the water flows from the water inlet end to the water outlet end. The valve body has a shoulder portion and a stepped portion on the inner wall thereof, and the top surface of the shoulder portion comprises at least a first through hole downwardly penetrating the outer wall of the valve body. The shoulder portion is located below the stepped portion, and the stepped portion is formed in two steps shape, which has a vertical first abutting edge, a horizontal second abutting edge, and a vertical third abutting edge in sequence.
    Type: Grant
    Filed: October 3, 2022
    Date of Patent: January 16, 2024
    Inventor: Hsiang-Shih Wang
  • Publication number: 20230420538
    Abstract: A semiconductor device includes a plurality of fin structures disposed over a substrate and a work function alloy layer disposed over each fin structure of the plurality of fin structures. The plurality of fin structures includes a first fin structure and a second fin structure. A content of a first element in a first portion of the work function alloy layer, which portion is disposed over the first fin structure, is different from a content of the first element in a second portion of the work function alloy layer, which portion is disposed over the second fin structure.
    Type: Application
    Filed: June 24, 2022
    Publication date: December 28, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chi PAN, Kuan-Wei Lin, Chun-Neng Lin, Yu-Shih Wang, Ming-Hsi Yeh, Kuo-Bin Huang
  • Publication number: 20230369109
    Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back. After etching back the portion of the barrier layer, an upper portion of the barrier layer along the sidewall is smoothed. A conductive material is formed along the barrier layer and over the smoothed upper portion of the barrier layer.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 16, 2023
    Inventors: Yu Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin
  • Publication number: 20230367339
    Abstract: Methods for preparing a void-free protective coating are disclosed herein. The void-free protective coating is used on a dielectric window having a central hole, which is used in a plasma treatment tool. A first protective coating layer is applied to the window, leaving an uncoated annular retreat area around the central hole. The first protective coating layer is polished to produce a flat surface and fill in any voids on the window. A second protective coating layer is then applied upon the flat surface of the first protective coating layer to obtain the void-free coating. This increases process uptime and service lifetime of the dielectric window and the plasma treatment tool.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 16, 2023
    Inventors: Shih-Tsung Chen, Yeh-Chieh Wang, Yen-Shih Wang, Chien-Yu Wang, Jiun-Rng Pai, Tsung-Cheng Ho
  • Patent number: 11817330
    Abstract: A method for processing a substrate is provided. The method includes the following operations: placing a substrate over a first injector in a substrate processing apparatus, the substrate having a front surface and a back surface opposite to the front surface, and the front surface having a plurality of concentric regions; adjusting a temperature of each of the plurality of concentric regions by controlling at least one of a flow rate and a temperature associated with a fluid dispensing from the first injector; and rotating the substrate by a spin base disposed below the substrate, the substrate is rotated with respect to a center axis perpendicular to the front surface thereof when adjusting the temperature. The spin base includes a ring opening for rotating relative to the first injector, and the first injector is displaced from a projection of a center of the substrate from a top view perspective.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: November 14, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Po-Yuan Wang, Tzu Ang Chiang, Jian-Jou Lian, Yu Shih Wang, Chun-Neng Lin, Ming-Hsi Yeh
  • Publication number: 20230352890
    Abstract: An electrical connector including an insulating body, a metal shielding member disposed in the insulating body, a plurality of terminals disposed in the insulating body, and an outer shell sheathed on the insulating body is provided. The metal shielding member has a leading edge, a pair of side edges bordered at two opposite sides of the leading edge, a protrusion located at the leading edge, and a plurality of openings. The leading and the side edges are protruded out of the insulating body. The openings are located between the leading and the side edges, and are concentrated at positions near the leading edge. Portions of the insulating body penetrate the openings.
    Type: Application
    Filed: December 26, 2022
    Publication date: November 2, 2023
    Applicant: Acer Incorporated
    Inventors: Yu-Shih Wang, Chih-Chun Liu, Cheng-Nan Ling, Wen-Chieh Tai
  • Patent number: 11798843
    Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back. After etching back the portion of the barrier layer, an upper portion of the barrier layer along the sidewall is smoothed. A conductive material is formed along the barrier layer and over the smoothed upper portion of the barrier layer.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: October 24, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin
  • Publication number: 20230327002
    Abstract: A method of forming a semiconductor device includes: forming a semiconductor structure having source/drain regions, a fin disposed between the source/drain regions, and a dummy gate disposed on the fin and surrounded by a spacer; removing the dummy gate to form a gate trench which is defined by a trench-defining wall; forming a gate dielectric layer on the trench-defining wall; forming a work function structure on the gate dielectric layer; forming a resist layer to fill the gate trench; removing a top portion of the resist layer; removing the work function structure exposed from the resist layer using a wet chemical etchant; removing the resist layer; and forming a conductive gate in the gate trench.
    Type: Application
    Filed: April 6, 2022
    Publication date: October 12, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chieh-Wei CHEN, Jian-Jou LIAN, Tzu-Ang CHIANG, Po-Yuan WANG, Yu-Shih WANG, Chun-Neng LIN, Ming-Hsi YEH
  • Publication number: 20230297142
    Abstract: A portable electronic device including a main display having a locking recess at a side edge and at least one external display detachable relative to the side edge of the main display is provided. The external display includes a body, and at least one latch pivoted to the body. The latch is pivoted to the body to be swiveled out of or into the body. An opening of the locking recess faces obliquely upward and faces away from a direction of gravity when the main display is standing, the at least one latch swiveled out of the body faces obliquely downward and faces forward the direction of gravity to be inserted into the locking recess, and the at least one external display is hung on at the side edge of the main display by a weight of the at least one external display.
    Type: Application
    Filed: May 23, 2023
    Publication date: September 21, 2023
    Applicant: Acer Incorporated
    Inventors: Yu-Shih Wang, Yi-Ta Huang, Chih-Chun Liu, Cheng-Nan Ling, Wen-Chieh Tai
  • Patent number: 11764057
    Abstract: A method of forming a structure having a coating layer includes the following steps: providing a substrate; coating a fluid on the surface of the substrate, where the fluid includes a carrier and a plurality of silicon-containing nanoparticles; and performing a heating process to remove the carrier and convert the silicon-containing nanoparticles into a silicon-containing layer, a silicide layer, or a stack layer including the silicide layer and the silicon-containing layer.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: September 19, 2023
    Assignee: CHE Inc.
    Inventors: Chuan-Pu Liu, Yin-Wei Cheng, Shih-An Wang, Bo-Liang Peng, Chun-Hung Chen, Jun-Han Huang, Yi-Chang Li
  • Publication number: 20230284530
    Abstract: A thermoelectric cooling module including multiple P-type thermoelectric units, multiple N-type thermoelectric units, multiple electrical connecting members, and a filler is provided. Each of the electrical connecting members is electrically connected between the P-type thermoelectric unit and the N-type thermoelectric unit that are adjacent. The filler is disposed between the P-type thermoelectric unit and the N-type thermoelectric unit that are adjacent, and is also disposed at a surrounding of the P-type thermoelectric units and the N-type thermoelectric units.
    Type: Application
    Filed: September 21, 2022
    Publication date: September 7, 2023
    Applicant: Acer Incorporated
    Inventors: Yu-Shih Wang, Yi-Ta Huang, Hung-Jen Su, Chih-Chun Liu, Cheng-Nan Ling, Wen-Chieh Tai
  • Publication number: 20230229202
    Abstract: A portable electronic device including a first body, a second body, and a hinge mechanism is provided. The second body is connected to the first body through the hinge mechanism, and the hinge mechanism has a rotating shaft fixed to the second body. When the second body rotates relative to the first body, the rotating shaft slides along an arc-shaped path to increase or decrease a distance between a lower edge of the second body and a back side of the first body.
    Type: Application
    Filed: June 8, 2022
    Publication date: July 20, 2023
    Applicant: Acer Incorporated
    Inventors: Yi-Ta Huang, Yu-Shih Wang, Cheng-Nan Ling, Chih-Chun Liu
  • Patent number: 11703914
    Abstract: A portable electronic device including a main display and at least one external display detachable relative to one side of the main display is provided. The external display includes a body, a slider slidably disposed in the body, at least one latch pivoted to the body, and at least one elastic member connected between the slider and the body. The latch has a driving column and a tenon portion opposite to each other, and the driving column is movably connected to the slider, such that when the slider slides relative to the body, the latch is driven to pivot relative to the body, and the tenon portion is rotated out of the body or hidden in body. The tenon portion that is rotated out of the body is inserted into the main display, so that the external display is combined to the main display.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: July 18, 2023
    Assignee: Acer Incorporated
    Inventors: Yu-Shih Wang, Yi-Ta Huang, Chih-Chun Liu, Cheng-Nan Ling, Wen-Chieh Tai
  • Publication number: 20230197617
    Abstract: A connecting structure includes a substrate, a first conductive feature, a second conductive feature, a third conductive feature over the first conductive feature, and a fourth conductive feature over the second conductive feature. The substrate includes a first region and a second region. The first conductive feature is disposed in the first region and has a first width. The second conductive feature is disposed in the second region and has a second width greater than the first width of the first conductive feature. The third conductive feature includes a first anchor portion surrounded by the first conductive feature. The fourth conductive feature includes a second anchor portion surrounded by the second conductive feature. A depth difference ratio between a depth of the first anchor portion and a depth of the second anchor portion is less than approximately 10%.
    Type: Application
    Filed: February 15, 2023
    Publication date: June 22, 2023
    Inventors: U-TING CHIU, YU-SHIH WANG, CHUN-CHENG CHOU, YU-FANG HUANG, CHUN-NENG LIN, MING-HSI YEH
  • Patent number: 11681329
    Abstract: An electronic device assembly is provided, including an electronic device body and a detachable lens module. The electronic device body has a housing and a first joining unit, wherein the first joining unit is disposed on the housing. The detachable lens module is detachably assembled onto the housing and has a second joining unit, wherein the first joining unit is joined to the second joining unit to electrically connect the detachable lens module to the electronic device body.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: June 20, 2023
    Assignee: Acer Incorporated
    Inventors: Yu-Shih Wang, Yi-Ta Huang, Chih-Chun Liu, Cheng-Nan Ling, Wen-Chieh Tai, Chi-Hung Lai, Wu-Chen Lee, Pin-Chueh Lin, Chih-Wei Liao, Ting-Wen Pai, Wen-Chieh Chen
  • Patent number: 11656696
    Abstract: A touch pad structure includes a touch module, a first bracket, a second bracket, and a plurality of linkage rods. The touch module is disposed on the first bracket. The second bracket is surrounding the first bracket and the touch module. A plurality of outer edges of the first bracket faces to a plurality of inner edges of the second bracket respectively. Each of the linkage rods is pivotally connected the outer edge and the inner edge facing to each other, so that the touch module is moved together with the first bracket and relative to the second bracket when the touch module is pressed or released, and the linkage rods have synchronized seesaw motion.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: May 23, 2023
    Assignee: Acer Incorporated
    Inventors: Yu-Shih Wang, Wen-Chieh Tai, Cheng-Nan Ling, Chih-Chun Liu
  • Publication number: 20230129418
    Abstract: A hinge mechanism is provided, including a connecting unit, a hinge unit, and a locking element. The connecting unit has a connecting member and a tubular member. The tubular member is disposed on the connecting member. The hinge unit has a first member, a second member, a shaft, and a rod. The shaft pivotally connects the first member to the second member. The rod is affixed to the second member. The rod extends into the tubular member and has a slot. The locking element is fastened through the tubular member and joined in the slot.
    Type: Application
    Filed: June 3, 2022
    Publication date: April 27, 2023
    Inventors: Ting-Wen PAI, Yu-Shih WANG, Yi-Ta HUANG, Chih-Chun LIU, Cheng-Nan LING, Wen-Chieh TAI
  • Patent number: 11631951
    Abstract: A plug electrical connector including a body and a plurality of cable terminals is provided. The body includes a top surface, two side surfaces opposite to each other, at least one locking slot, and a pair of locking protrusions. The top surface is bordered between the two side surfaces, the locking slot is located on the top surface, and the locking protrusions are located on the side surfaces. The cable terminals penetrate through the body and are arranged between the side surfaces in an axial direction. The plug electrical connector is adapted to be butted to a receptacle electrical connector and is engaged with the receptacle electrical connector with the locking slot and the locking protrusions. A receptacle electrical connector is also provided.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: April 18, 2023
    Assignee: Acer Incorporated
    Inventors: Yu-Shih Wang, Hung-Jen Su, Chih-Chun Liu, Cheng-Nan Ling, Wen-Chieh Tai
  • Patent number: 11617951
    Abstract: A game summary may be produced using an event log of in-game events and corresponding game content based on game data associated with a gameplay session(s). The event log may include metadata that indicates times of in-game events and associations between in-game events and game content items that capture the in-game events. A user may interact with in-game events with temporal context, allowing for more informed selections and a better understanding of the gameplay session. Using the event log, a game summary may provide such features as a timeline to convey relative timing of in-game events, a list of in-game events, a map of a virtual environment of the game that is temporally annotated based on in-game events, game status information, and statistical and performance information. A game summary may show trends over time and/or game sessions and convey information for selected sets of players, such as teams.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: April 4, 2023
    Assignee: NVIDIA Corporation
    Inventors: James Lewis van Welzen, Glenn R. Cochran, Jean Wang, Po-Shih Wang, Jeffrey David Weintraub, Toshant Sharma, Shyam Raikar
  • Patent number: 11587875
    Abstract: A connecting structure includes a substrate, a first conductive feature, a second conductive feature, a third conductive feature over the first conductive feature and a fourth conductive feature over the second conductive feature. The substrate includes a first region and a second region. The first conductive feature is disposed in the first region and has a first width. The second conductive feature is disposed in the second region and has a second width greater than the first width of the first conductive feature. The third conductive feature includes a first anchor portion surrounded by the first conductive feature. The fourth conductive feature includes a second anchor portion surrounded by the second conductive feature. A depth difference ratio between a depth of the first anchor portion and a depth of the second anchor portion is less than approximately 10%.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: February 21, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: U-Ting Chiu, Yu-Shih Wang, Chun-Cheng Chou, Yu-Fang Huang, Chun-Neng Lin, Ming-Hsi Yeh