Abstract: An image sensor module includes a ceramic substrate, an image sensor, a conductive film, and a bottom plate. The ceramic substrate includes an upper surface, a lower surface opposite to the upper surface, a side surface connected between the upper surface and the lower surface. The ceramic substrate has a through hole through the upper and lower surfaces, a receiving recess on the lower surface, and an air hole on the side surface. The through hole communicates with the receiving recess, and the air hole communicates with the receiving recess. The image sensor is received in the receiving recess and is electrically connected to the ceramic substrate. The bottom plate is positioned on the lower surface and electrically connected to the ceramic substrate by the conductive film.

Abstract: An image sensor module includes a rigid-flex board, an image sensor, and a supporting plate. The rigid-flex board defines a through hole, and includes a plurality of connecting pads adjacent to the through hole. The image sensor is positioned on one side of the rigid-flex board, and includes an image surface and a plurality of pins adjacent to the image surface. The image surface faces the through hole, and the pins are connected to the connecting pads. The supporting plate is positioned on the side of the rigid-flex board. The image sensor is positioned between the supporting plate and the rigid-flex board.

Abstract: An image sensor module includes a rigid-flex board, an image sensor, a supporting plate, and a metal layer. The rigid-flex board defines a through hole penetrating its upper surface and its lower surface. An upper pad is positioned on an upper side surface of the rigid-flex board. The image sensor is positioned on the lower surface, and includes an image surface facing the through hole. A metal layer covers on a top surface and/or a bottom surface of the supporting plate, and a lower pad is positioned on a lower side surface of the supporting plate and connects to the metal layer. The supporting plate is positioned on the lower surface, and the image sensor is received between the rigid-flex board and the supporting plate. The metal sheet is electrically connected between the lower pad and the upper pad.

Abstract: An image sensor module includes a rigid-flex board, an image sensor, a supporting plate, and a glue. The rigid-flex board defines a through hole, and includes a plurality of connecting pads adjacent to the through hole. The image sensor is positioned on one side of the rigid-flex board, and includes an image surface and a plurality of pins adjacent to the image surface. The image surface faces the through hole, and the pins are connected to the connecting pads. The supporting plate defines a receiving recess. The supporting plate is positioned on the side of the rigid-flex board. The image sensor is received in the receiving recess. The glue fills between the supporting plate and the rigid-flex board.

Abstract: A device for assembling a camera module includes a base and a buffer layer. The camera module includes a flexible printed circuit board (FPCB), a lens module positioned on the FPCB, and a stiffener adhering to the FPCB, opposite to the lens module. The lens module includes a first stepped surface facing away from the FPCB. The base includes a supporting surface for supporting the FPCB and defines a holding groove in the supporting surface for holding the lens module. The holding groove forms a second stepped surface for supporting the first stepped surface. The buffer layer is positioned on the second stepped surface and is elastically compressed when the camera module is subjected to a hot pressing process, which secures the stiffener adhering to the FPCB, to provide relief against, and extend the duration of, various pressures applied to the camera module.

Abstract: A circuit board assembly includes a flexible circuit board, a conductive adhesive, and a number of reinforcing plates. The flexible circuit board includes a first surface and a second surface. A number of board pads are mounted on the first surface. The conductive adhesive is coated on the first surface and entirely covers all of the board pads. The reinforcing plates are positioned on the second surface. Each of the reinforcing plates spatially corresponds to a respective one of the board pads. The reinforcing plates provide both physical grounding and stiffening of the circuit board assembly.

Abstract: A flexible printed circuit board (FPCB) assembly includes a FPCB, a dielectric layer, a stiffener, and a conductive adhesive layer. The FPCB includes a surface and a conductive layer positioned on the surface of the FPCB. The conductive layer includes a circuit portion and a grounding portion connected to the circuit portion. The circuit portion is entirely covered by the dielectric layer and the grounding portion is exposed outside the dielectric layer. The conductive adhesive is positioned on the stiffener and includes a first adhering portion and a second adhering portion. A thickness of the second adhering portion is greater than the first adhering portion. A thickness difference between the second adhering portion and the first adhering portion is substantially equal to a thickness the dielectric layer. The first adhering portion is adhered to the dielectric layer and the second adhering portion is adhered to the grounding portion.

Abstract: A circuit board assembly includes a flexible circuit board, a dielectric layer and a reinforcing plate. The flexible circuit board includes a surface. A copper plating layer is positioned on the surface. The copper plating layer includes a circuit portion and a grounding portion. The circuit portion is entirely covered by the dielectric layer. The grounding portion is exposed outside the dielectric layer. The dielectric layer includes a bonding portion. The reinforcing plate includes a connection surface. The connection surface defines a cavity spatially corresponding to the bonding portion. The connection surface also includes an extending portion which is bulgy with respect to a bottom surface of the cavity. The extending portion spatially corresponds to the grounding portion. The bonding portion is received in the cavity with the extending portion in contact with and electrically connecting to the grounding portion by means of a conductive adhesive.

Abstract: A circuit board assembly includes a flexible circuit board and a reinforcing plate. The flexible circuit board includes a surface. A conductive layer is positioned on the surface. The conductive layer includes a circuit portion entirely covered by a dielectric layer and a grounding portion exposed outside the dielectric layer. The reinforcing plate is mounted on the dielectric layer. The reinforcing plate includes a connection surface connected to the dielectric layer and a supporting surface facing away from the connection surface. Projections extend from the connection surface. The location of all of the projections correspond to the location of the grounding portion, and all of the projections are in electrical contact with the grounding portion by means of a conductive adhesive.

Abstract: A protection cap for protecting a camera module slides over a lens barrel receiving at least one lens. The protection cap is made of elastic material and is hollow. The protection cap includes an enclosed end and an open end. The lens barrel is passed through the open end and the open end sleeves over the camera module. The enclosed end protects the camera module against damage and contamination.

Abstract: A camera module (200) includes a lens module and a base (210) with a sensor installed thereon. The base is provided with at least two supporting protrusions (222) extending therefrom. Each protrusion is oriented the lens module, and the lens module is fixedly to and contacts with the at least two supporting protrusions. A colloid layer surrounding the sensor is sandwiched between the second end of the holder and the base. Electronic components are disposed on the circuit board and covered by the colloid layer.

Abstract: A camera module (200) includes a lens module and a base (210) with a sensor installed thereon. The base is provided with at least two supporting protrusions (222) extending therefrom. Each protrusion is oriented the lens module, and the lens module is fixedly to and contacts with the at least two supporting protrusions. A colloid layer surrounding the sensor is sandwiched between the second end of the holder and the base. Electronic components are disposed on the circuit board and covered by the colloid layer.