Abstract: An optical projector module proofed against distortion caused by heat building up in and around the light-emitting element includes a printed circuit board (PCB), a light emitting element, and an optical structure. The optical structure on the PCB includes a supporting member almost completely enclosing the light emitting element. The supporting member includes an embedded metal heat dissipating layer extending to cover outside surfaces of the supporting member. The metal heat dissipating layer occupies more than 70% of the outside surfaces of the supporting member, and being metallic the dissipating layer is able to conduct electricity.

Abstract: A voice coil motor of reduced thickness includes a pedestal and a housing. The side walls of the pedestal are formed with a metal sheet. The housing includes top and side plates, the side plates perpendicularly extending from an edge of the top plate. The side plate is notched, the housing covers the pedestal, and the at least one notch exposes a portion of the metal sheet for purposes of attachment between fixation area the housing and the pedestal fixation area.

Abstract: A circuit board includes an assembly and a labeling area. The assembly area is for installation of the elements. The labeling area is for marking of the circuit board. A paint layer is coated on a surface of the labeling area. A two-dimensional code is printed on the paint layer. A camera module having the circuit board and a method for labeling the circuit board are also provided.

Abstract: An imaging module allows heated internal gas to escape out of a camera/imaging module when heat is applied to the module during an adhesive curing manufacturing step without making manufacture more difficult due to molding issues. The imaging module includes a lens holder with top and bottom surfaces. The bottom surface defines an opening at a bottom of the lens holder. The opening extends through the inside and outside walls of the lens holder. The opening allows heated internal gas to escape out of a camera/imaging module.

Abstract: A lens module to exclude stray and internally-reflected light and thereby avoid flares and stains in images includes a lens unit, a circuit board, an image sensor, an optical filter, and a hollow mounting frame. The lens unit includes hollow lens holder and lens therein. The image sensor is connected onto the circuit board. The optical filter is at one side of the mounting frame, opposing side is fixed to the circuit board to enclose the image sensor. A light blocking layer is formed on four sides of a surface of the optical filter facing away from the image sensor. A structurally-significant dustproof adhesive layer fills a first gap between the mounting frame and the optical filter and a second gap between the mounting frame and the shielding layer. The lens holder is connected to the mounting frame.

Abstract: A lens holder able to equalize air pressure at all times with the ambient atmosphere includes a packaging member and a support member. The packaging member has upper and lower surfaces, and the packaging member includes a first through hole and a groove in communication with the first through hole. The support member has first and second surfaces and includes a second through hole and a vent hole in communication with the second through hole. The packaging member is mounted to the second surface of the support member, the first through hole is in communication with the second through hole, and the vent hole of the support member is in communication with the groove of the packaging member. A camera module including the lens holder is also provided.

Abstract: A method for assembling a lens module to be free of dust and other pollutants includes providing a circuit board, an image sensor, an optical filter, and a mounting frame. The image sensor is connected to the circuit board. The optical filter is glued to the top side of the mounting frame, and the bottom side of the mounting frame is connected to the circuit board. The optical filter, the mounting frame, and the circuit board define a closed space receiving the image sensor. A lens is mounted in a lens holder to form a lens unit and the lens holder is attached to the circuit board, to position the lens above the image sensor, thereby obtaining the finished lens module.

Abstract: An optical projector module protected against image distortion caused by heat building up in the light-emitting element includes a printed circuit board, and a light emitting element and an optical member mounted on the printed circuit board. The optical member includes a supporting structure which forms a housing. The housing contains the light emitting element, and a dissipating member made of electrically and thermally conductive metal is embedded on an inner surface of the housing. The housing extends outside of the housing and forms a path to carry away heat generated.

Abstract: A camera device allowing for easy and reliable mating to a circuit board includes a printed circuit board, an imaging sensor mounted on the printed circuit board, a supporting bracket mounted on the printed circuit board and surrounding the imaging sensor, and a lens module received in the supporting bracket. The printed circuit board includes a first portion and an extending portion connecting with the first portion, the first portion defines a first location and a second location. The first location surrounds the imaging sensor, and the second location is located outside of the first location and adjacent to the extending portion. The supporting bracket includes a main body and a fixing lug forming at side surface of the main body, bottom of the base and bottom of the fixing lug are coplanar.

Abstract: A optical projector device less vulnerable to deformation of projected light by generated heat includes a printed circuit board, a light source, and an optical module. The heat-generating light source emits a laser beam, the optical module being mounted on the printed circuit board and surrounding the light source. The optical module comprises a lens holder, a collimating optical element received in the lens holder, and a diffractive optical element away from the light source. The lens holder comprises an outer lens holder and an inner lens holder fixed in the outer lens holder, and the diffractive optical element is received in the inner lens holder, this arrangement enables the dissipation of any heat-expansion force away from these elements.

Abstract: The present invention relates to a camera module. The camera module includes a circuit board; an image sensor electrically connected to the circuit board; at least one lens holder disposed on the circuit board; at least one lens module received in the at least one lens holder; wherein the circuit board comprises a heat dissipation area in the central thereof and a wiring area besides the heat dissipation area, the wiring area being electrically insulated from the heat dissipation area, the wiring area comprises a plurality of conducting traces, the heat dissipation area defines a plurality of dissipating holes, each dissipating hole is provided with a thermally conductive pillar; and the image sensor is mounted on the heat dissipation area, heat generated by the image sensor is able to dissipate via the thermally conductive pillar.

Abstract: A camera module which collects incoming dirt and dust so as to prevent the accumulation of same on an optical element of the image-capturing process includes a microscope base and an optical filter unit. The microscope base includes a supporting portion. A first gap is formed in the supporting portion. The optical filter unit filter and adhesive layer formed on the optical filter. The optical filter is bonded on the supporting portion by the adhesive layer. The optical filter comprises a filter area in the optical filter. A surface of the adhesive layer facing away from the optical filter is adhesive. A second gap is formed in the adhesive layer. The filter area is exposed from the second gap. Parts of the adhesive layer and the filter area are exposed from the first gap.

Abstract: A small-scale camera device with heat-dissipating properties includes a pedestal bracket and a camera module mounted on the pedestal bracket. The pedestal bracket includes a top plate and a side plate extending perpendicularly from edges of the top plate. The side plate includes an inner side surface and an outer side surface opposite to the inner side surface. The bottom of the side plate defines a plurality of first receiving recesses, each of the first receiving recesses carries a heat dissipation member.

Abstract: A light shielding member includes a transparent plate. The transparent plate includes a first surface and a second surface opposite to the first surface; the first surface of the transparent plate comprises a first light permeable area and a light shielding area surrounding the first light permeable area. The light shielding member further comprises a opaque adhesive layer formed on the light shielding area.

Abstract: A camera module which collects incoming dirt and dust so as to prevent the accumulation of same on an optical element of the image-capturing process includes a microscope base and an optical filter unit. The microscope base includes a supporting portion. A first gap is formed in the supporting portion. The optical filter unit filter and adhesive layer formed on the optical filter. The optical filter is bonded on the supporting portion by the adhesive layer. The optical filter comprises a filter area in the optical filter. A surface of the adhesive layer facing away from the optical filter is adhesive. A second gap is formed in the adhesive layer. The filter area is exposed from the second gap. Parts of the adhesive layer and the filter area are exposed from the first gap.

Abstract: A durable camera module comprises a lens holder and a lens barrel. An opening is defined in the lens holder. The opening passes through the lens holder along an axial direction of the lens holder. At least one notch is defined in a side wall of the lens holder. The at least one notch extends radially through the side wall of the lens holder. The lens barrel is received in the opening. A first adhesive layer is formed between the lens barrel and lens holder. The first adhesive layer is positioned at an end of the lens holder and surrounds the lens barrel. A second adhesive layer is formed in each of the at least one notch, the second adhesive layer is bonded to the lens barrel.

Abstract: A durable camera module comprises a lens holder and a lens barrel. An opening is defined in the lens holder. The opening passes through the lens holder along an axial direction of the lens holder. At least one notch is defined in a side wall of the lens holder. The at least one notch extends radially through the side wall of the lens holder. The lens barrel is received in the opening. A first adhesive layer is formed between the lens barrel and lens holder. The first adhesive layer is positioned at an end of the lens holder and surrounds the lens barrel. A second adhesive layer is formed in each of the at least one notch, the second adhesive layer is bonded to the lens barrel.

Abstract: A lens module includes a circuit, a sensor mounted on the circuit, a base mounted on the circuit, a motor mounted on the base, and a lens unit mounted on the motor. The base has a first surface, a second surface opposite to the first surface and an outer surface connected with the first surface and the second surface. The base forms a plurality of heat dissipation layers, the heat dissipation layers are made of metal materials. The heat dissipation layers are spaced from each other. The heat dissipation layers are formed on the first surface and the outer surface of the base.

Abstract: A double-camera imaging device includes a base bracket and two camera units. The base bracket comprises a base plate, each camera unit comprises a printed circuit board, and the two camera units are fixed on the base plate and spaced apart each other via the printed circuit boards fixed on the base plate. The base bracket is configured to protect the two camera units from external force attack.

Abstract: A double-camera imaging device includes a base bracket and two camera units. The base bracket comprises a base plate, each camera unit comprises a printed circuit board, and the two camera units are fixed on the base plate and spaced apart each other via the printed circuit boards fixed on the base plate. The base bracket is configured to protect the two camera units from external force attack.