Abstract: Camera module with switchable light filters includes a lens, a body, a movable tray, a first filter, a second filter, a gear and a protective cover. The lens is disposed in the body. The body defines a first through hole corresponding to the lens and includes a first surface. The movable tray is positioned on the first surface and is used for receiving the first filter and the second filter. The gear is arranged on the first surface by a rotating shaft, the gear is configured to engage with the movable tray to switch the first filter and the second filter. The protective cover is disposed on the body and partially covers the gear.

Abstract: A camera module includes a voice coil motor, a lens module, a substrate, an imagine sensor, a circuit board and a conductive adhesive tape. The voice coil motor includes a conductive housing defining a first hole. The lens module is received in the first hole. The substrate supports the voice coil motor and defines a second hole. The circuit board includes a grounding area. The image sensor is supported by the circuit board, and is received in the second hole, and aligned with the lens module. The conductive adhesive tape covers the substrate and electrically connects the conductive housing to the grounding area.

Abstract: A camera module includes a circuit board, an image sensor, a bracket, a VCM, and a lens module. The image sensor is positioned on the circuit board. The bracket is mounted on the circuit board and receives the image sensor. The VCM is mounted on the bracket and includes a conductive housing and pins extending from the housing. The pins are electrically connected to the circuit board. The lens module is received in the VCM. The VCM with the lens module is supported on the bracket. The optical axis of the lens module is coinciding with a center of the image sensor. The bracket includes a plating layer and solder bumps. The plating layer is formed at least one of side surfaces of the bracket. The solder bumps electrically connect the plating layer to the circuit board and electrically connect the plating layer to the housing.

Abstract: Camera module with switchable light filters includes a lens module, a bearing rotating device, a visible light filter, and an infrared light filter. The bearing rotating device includes a rotating shaft, at least one guiding stick, and a bearing plate. The rotating bearing plate holds the two filters and defines an arcuated guiding slot. The circle center of the arcuated guiding slot is the rotating shaft. A visible light filter and an infrared light filter are switchable, their movement being governed by the guiding stick and the guiding slot, to respective alignment with an optical axis of the lens module. The camera module can rotate the bearing plate to switch the infrared filter for the visible filter where the acquisition of infrared light is required.

Abstract: Camera module with switchable light filters includes a lens, a body, a movable tray, a first filter, a second filter, a gear and a protective cover. The lens is disposed in the body. The body defines a first through hole corresponding to the lens and includes a first surface. The movable tray is positioned on the first surface and is used for receiving the first filter and the second filter. The gear is arranged on the first surface by a rotating shaft, the gear is configured to engage with the movable tray to switch the first filter and the second filter. The protective cover is disposed on the body and partially covers the gear.

Abstract: A digital camera able to filter out infrared light or receive infrared light as user requires includes a sensor and a base. The base includes a first receiving groove, the first receiving groove includes a bottom surface defining a first through slot, the first through slot being used for receiving the sensor. A filter bracket is set on the bottom surface, the filter bracket includes a first through hole and a second through hole corresponding to the first through slot. A visible light filter is set on the filter bracket and covers the first through hole and an infrared light filter covers the second through hole. A driver device moves the filter bracket from a first position to a second position as the user requires.

Abstract: Camera module with switchable light filters includes a lens module, a bearing rotating device, a visible light filter, and an infrared light filter. The bearing rotating device includes a rotating shaft, at least one guiding stick, and a bearing plate. The rotating bearing plate holds the two filters and defines an arcuated guiding slot. The circle center of the arcuated guiding slot is the rotating shaft. A visible light filter and an infrared light filter are switchable, their movement being governed by the guiding stick and the guiding slot, to respective alignment with an optical axis of the lens module. The camera module can rotate the bearing plate to switch the infrared filter for the visible filter where the acquisition of infrared light is required.

Abstract: A stamping head includes a stamping portion and a connection portion connected to the stamping portion. The stamping portion includes a top surface and four side surfaces. The stamping head defines a jag extending from a junction between a specific one of the side surfaces and the top surface toward a centre of the top surface. The jag passes through the specific side surface. When the stamping head presses a ACF onto a ceramic substrate, a residual air between the ACF and the ceramic substrate flows outside through the jag.

Abstract: A device for assembling a camera module includes a support base, a pressing head, a buffer tape, a winding device, a driver, and a controller. The support base is for supporting the camera module. The camera module includes a ceramic substrate positioned on the support base and an anisotropic conductive film (ACF) pasted on the ceramic substrate. The pressing head is positioned above the ACF and is configured to pressing the ACF. The buffer tape is positioned between the pressing head and the ACF. The winding device includes a winding-out roller and a winding-in roller. The buffer tape is wound on the winding-out roller. The controller is configured to control the driver to drive the winding device to wind the buffer tape out from the winding-out roller and into the winding-in roller in a predetermined manner.

Abstract: A camera module includes an image sensor, a circuit board, and a stiffener. The stiffener is located one side of the circuit board and includes a bottom plate grounded. The image sensor is located on another side of the circuit board. The stiffener includes a sidewall extending from the bottom plate. The sidewall and the bottom plate cooperatively hold the circuit board. An insulative coating is coated on the sidewall to avoid short circuiting.

Abstract: A camera module includes a circuit board, an image sensor, a bracket, a VCM, and a lens module. The image sensor is positioned on the circuit board. The bracket is mounted on the circuit board and receives the image sensor. The VCM is mounted on the bracket and includes a conductive housing and pins extending from the housing. The pins are electrically connected to the circuit board. The lens module is received in the VCM. The VCM with the lens module is supported on the bracket. The optical axis of the lens module is coinciding with a center of the image sensor. The bracket includes a plating layer and solder bumps. The plating layer is formed at least one of side surfaces of the bracket. The solder bumps electrically connect the plating layer to the circuit board and electrically connect the plating layer to the housing.

Abstract: A camera module includes a voice coil motor, a lens module, a substrate, an imagine sensor, a circuit board and a conductive adhesive tape. The voice coil motor includes a conductive housing defining a first hole. The lens module is received in the first hole. The substrate supports the voice coil motor and defines a second hole. The circuit board includes a grounding area. The image sensor is supported by the circuit board, and is received in the second hole, and aligned with the lens module. The conductive adhesive tape covers the substrate and electrically connects the conductive housing to the grounding area.

Abstract: An apparatus for assembling camera modules to flexible printed circuit boards (PCBs) includes a number of trays, a surface mounting device used in surface mount technology (SMT) for PCBs, and a hot pressing device. Workpieces, each of which includes a flexible PCB (FPCB) and a lens module positioned on the FPCB, are received in the trays. Each tray is sent to the surface mounting device. The surface mounting device loads and pastes a stiffener onto a FBCB, opposite to a lens module. The hot pressing device hot presses each stiffener to the respective workpiece, which is received in each tray sent from the surface mounting device, to fixedly secure the stiffener to the respective workpiece to form a camera module.

Abstract: A SMT tape includes a carrier tape, a number of separation pads, a number of workpieces, and a package tape. The carrier tape includes a package surface and defines a number of receiving grooves in the package surface and arranged along a length direction of the carrier tape. The separation pads are received in the receiving grooves and fixed to bottom surfaces of the receiving grooves respectively. Each separation pad includes a separation surface opposite to a bottom surface of the corresponding receiving groove and a number of protrusions protruding up from the separation surface. The workpieces are respectively received in the receiving grooves. Each workpiece includes a main body and an adhesive layer positioned between the corresponding separation pad and the main body. The package tape is adhered to the package surface and seals the receiving grooves.

Abstract: An image sensor module includes a substrate, an image sensor, and a connecting plate. The substrate includes a supporting portion and an extending portion extending from one side of the supporting portion. The supporting portion includes an upper surface and a lower surface opposite to the upper surface. The supporting portion defines a through hole penetrating the upper surface and the lower surface and a receiving recess communicating the through hole on the lower surface. The thickness of the extending portion is less than the thickness of the supporting portion. The image sensor is received in the receiving recess and is electrically connected to the substrate. The connecting plate is electrically connected to the extending portion, the thickness of the connecting plate is less than or equal to the thickness difference between the extending portion and the supporting portion.

Abstract: An image sensor module includes a rigid-flex board, an image sensor, a supporting plate, and a glue. The rigid-flex board defines a through hole, and includes a plurality of connecting pads adjacent to the through hole. The image sensor is positioned on one side of the rigid-flex board, and includes an image surface and a plurality of pins adjacent to the image surface. The image surface faces the through hole, and the pins are connected to the connecting pads. The supporting plate defines a receiving recess. The supporting plate is positioned on the side of the rigid-flex board. The image sensor is received in the receiving recess. The glue fills between the supporting plate and the rigid-flex board.

Abstract: An image sensor module includes a rigid-flex board, an image sensor, and a supporting plate. The rigid-flex board defines a through hole, and includes a plurality of connecting pads adjacent to the through hole. The image sensor is positioned on one side of the rigid-flex board, and includes an image surface and a plurality of pins adjacent to the image surface. The image surface faces the through hole, and the pins are connected to the connecting pads. The supporting plate is positioned on the side of the rigid-flex board. The image sensor is positioned between the supporting plate and the rigid-flex board.

Abstract: An image sensor module includes a ceramic substrate, an image sensor, a conductive film, and a bottom plate. The ceramic substrate includes an upper surface, a lower surface opposite to the upper surface, a side surface connected between the upper surface and the lower surface. The ceramic substrate has a through hole through the upper and lower surfaces, a receiving recess on the lower surface, and an air hole on the side surface. The through hole communicates with the receiving recess, and the air hole communicates with the receiving recess. The image sensor is received in the receiving recess and is electrically connected to the ceramic substrate. The bottom plate is positioned on the lower surface and electrically connected to the ceramic substrate by the conductive film.

Abstract: A camera module includes a shell, an ambient light sensor, and a lens module having a printed circuit board. The shell has a seat in its front surface, a first connector on its back surface, and circuits connecting the first connector to the seat by a laser direct structure technology. The ALS is soldered to the seat. The PCB is attached to the back surface of the shell and includes a second connector connected to the first connector.

Abstract: An image sensor module includes a ceramic substrate, an image sensor, a conductive film, a flexible print circuit board (FPCB), and a stiffening plate. The ceramic substrate includes an upper surface and a lower surface opposite to the upper surface, the ceramic substrate defines a transparent hole on the upper surface and a receiving recess on the lower surface. The transparent hole communicates with the receiving recess. The image sensor is received in the receiving recess and is electrically connected to the ceramic substrate. The FPCB is electrically connected to the lower surface of the ceramic substrate by the conductive film. The stiffening plate is positioned on one side of the FPCB opposite to the ceramic substrate.