Abstract: A memory circuit may comprise a memory array comprising a plurality of memory cells, an input/output (I/O) circuit, and a power management circuit. The I/O circuit can be operatively coupled to the memory array and configured to read or write each of the memory cells. The power management circuit can be operatively coupled to the memory array and the I/O circuit. The power management circuit can be configured to provide a first gate control signal and a second gate control signal based on a received first supply voltage and a received second supply voltage. The first supply voltage can be substantially higher than two times the second supply voltage.

Abstract: Methods for reading a memory are provided. In response to a first address signal, a first signal is obtained according to first data of the memory and a second signal is obtained according to second data of the memory by a decoding circuit. Binary representation of the first signal is complementary to that of the second signal. A first sensing signal is provided according to a reference signal and the first signal and a second sensing signal is provided according to the reference signal and the second signal by a sensing circuit. An output corresponding to the first sensing signal or the second sensing signal is output in response to a control signal, by an output buffer.

Abstract: An IC device includes an active area positioned in a substrate, first and second contact structures overlying and electrically connected to the active area, a conductive element overlying and electrically connected to each of the first and second contact structures, an anti-fuse transistor device including a dielectric layer between a gate structure and the active area, a first selection transistor overlying the active area adjacent to each of the anti-fuse transistor device and the first contact structure, and a second selection transistor overlying the active area adjacent to each of the anti-fuse transistor device and the second contact structure.

Abstract: In some aspects of the present disclosure, a bandgap reference circuit includes a first current mirror and a first resistor coupled to the first current mirror to provide a proportional to absolute temperature (PTAT) voltage. The circuit includes a second current mirror and a bipolar junction transistor (BJT) device coupled to the second current mirror to provide a complementary to the absolute temperature (CTAT) voltage. The circuit includes an output node to provide a bandgap voltage that is a weighted sum of the PTAT voltage and the CTAT voltage. The circuit includes a second resistor coupled between the output node and a first node, wherein the first node is coupled between the first resistor and the first current mirror. The circuit includes a third resistor coupled between the output node and a second node, wherein the second node is coupled between the BJT device and the second current mirror.

Abstract: In some aspects of the present disclosure, a bandgap reference circuit includes a first current mirror and a first resistor coupled to the first current mirror to provide a proportional to absolute temperature (PTAT) voltage. The circuit includes a second current mirror and a bipolar junction transistor (BJT) device coupled to the second current mirror to provide a complementary to the absolute temperature (CTAT) voltage. The circuit includes an output node to provide a bandgap voltage that is a weighted sum of the PTAT voltage and the CTAT voltage. The circuit includes a second resistor coupled between the output node and a first node, wherein the first node is coupled between the first resistor and the first current mirror. The circuit includes a third resistor coupled between the output node and a second node, wherein the second node is coupled between the BJT device and the second current mirror.

Abstract: In some aspects of the present disclosure, a bandgap reference circuit includes a first current mirror and a first resistor coupled to the first current mirror to provide a proportional to absolute temperature (PTAT) voltage. The circuit includes a second current mirror and a bipolar junction transistor (BJT) device coupled to the second current mirror to provide a complementary to the absolute temperature (CTAT) voltage. The circuit includes an output node to provide a bandgap voltage that is a weighted sum of the PTAT voltage and the CTAT voltage. The circuit includes a second resistor coupled between the output node and a first node, wherein the first node is coupled between the first resistor and the first current mirror. The circuit includes a third resistor coupled between the output node and a second node, wherein the second node is coupled between the BJT device and the second current mirror.

Abstract: A memory bit cell includes a first memory cell including a first antifuse transistor and a first selection transistor, the first antifuse transistor being selectable between a first state or a second state in response to a word line program signal, the first selection transistor being configured to provide access to the first antifuse transistor in response to a word line read signal; a second memory cell including a second antifuse transistor and a second selection transistor, the second antifuse transistor being selectable between the first state or the second state in response to the word line program signal, the second selection transistor being configured to provide access to the second antifuse transistor in response to the word line read signal; a first word line to selectively provide the word line program signal; a second word line to selectively provide the word line read signal; and a bit line.

Abstract: A method for manufacturing a high-electron-mobility transistor includes the following steps: providing a semiconductor substrate, wherein the semiconductor substrate includes a channel layer and a barrier layer on the channel layer; forming a protective layer on the semiconductor substrate at a position corresponding to a gate opening; forming an overlay layer on the semiconductor substrate in an area around the protective layer, and removing the protective layer to form the gate opening; and forming a p-type layer in and at the gate opening and on the overlay layer. Compared with the prior art, the method for manufacturing a high-electron-mobility transistor lowers the technical threshold of manufacture, allows the threshold voltage (Vth) and ON-resistance (Rds(ON)) of each such transistor to be individually controlled at the desired levels, and can improve product yield effectively.

Abstract: A memory bit cell includes a first memory cell including a first antifuse transistor and a first selection transistor, the first antifuse transistor being selectable between a first state or a second state in response to a word line program signal, the first selection transistor being configured to provide access to the first antifuse transistor in response to a word line read signal; a second memory cell including a second antifuse transistor and a second selection transistor, the second antifuse transistor being selectable between the first state or the second state in response to the word line program signal, the second selection transistor being configured to provide access to the second antifuse transistor in response to the word line read signal; a first word line to selectively provide the word line program signal; a second word line to selectively provide the word line read signal; and a bit line.

Abstract: A communication method of a wireless camera comprising: connecting a pluggable device to a computing device, wherein the computing device is configured to be electrically connected to a display device; when the pluggable device determines that there is no pairing connection between the pluggable device and a wireless camera, transmitting a designated image to the computing device by the pluggable device, so that the computing device controls the display device to display the designated image, wherein the designated image has pairing data; capturing and analyzing the designated image to obtain the pairing data by the wireless camera, and establishing the pairing connection by the wireless camera according to the pairing data.

Abstract: A semiconductor field-effect transistor, a power amplifier comprising the same and a manufacturing method thereof are provided herein. The semiconductor field-effect transistor contains an n-type doped layer arranged close to the edge of the two-dimensional electron gas area in a channel layer; said n-type doped layer is arranged to adjust the distribution of electron concentration in the transistor, and to improve the RF linearity of the overall component; thereby not only the threshold voltage can be controlled through the adjustment of the charge, but the contact and series resistance can also be reduced.

Abstract: Methods for reading a memory are provided. In response to a first address signal, a first signal is obtained according to first data of the memory and a second signal is obtained according to second data of the memory by a decoding circuit. Binary representation of the first signal is complementary to that of the second signal. A first sensing signal is provided according to a reference signal and the first signal and a second sensing signal is provided according to the reference signal and the second signal by a sensing circuit. An output corresponding to the first sensing signal or the second sensing signal is output in response to a control signal, by an output buffer.

Abstract: An IC device includes an active area positioned in a substrate, first and second contact structures overlying and electrically connected to the active area, a conductive element overlying and electrically connected to each of the first and second contact structures, an anti-fuse transistor device including a dielectric layer between a gate structure and the active area, a first selection transistor overlying the active area adjacent to each of the anti-fuse transistor device and the first contact structure, and a second selection transistor overlying the active area adjacent to each of the anti-fuse transistor device and the second contact structure.

Abstract: Memories are provided. A memory includes a first memory array, a second memory array and a read circuit. The first memory array is configured to store first data. The second memory array is configured to store second data that is complementary to the first data. The read circuit includes a decoding circuit, a sensing circuit and an output buffer. The decoding circuit is configured to provide a first signal according to the first data and a second signal according to the second data in response to an address signal. The sensing circuit is configured to provide a first sensing signal according to a reference signal and the first signal, and a second sensing signal according to the reference signal and the second signal. The output buffer is configured to provide the first sensing signal or the second sensing signal as an output according to a control signal.

Abstract: A method of manufacturing an anti-fuse device includes forming an anti-fuse structure on a substrate, forming a first transistor at a first position away from the anti-fuse device in a first direction, and forming a second transistor at a second position away from the anti-fuse device in a second direction opposite the first direction. Forming the anti-fuse structure includes forming first and second S/D structures in an active area, the first transistor includes the first S/D structure, and the second transistor includes the second S/D structure. The method includes constructing a first electrical connection between gate structures of the first and second transistors and a second electrical connection between a third S/D structure of the first transistor and a fourth S/D structure of the second transistor.

Abstract: A memory bit cell includes a first memory cell including a first antifuse transistor and a first selection transistor, the first antifuse transistor being selectable between a first state or a second state in response to a word line program signal, the first selection transistor being configured to provide access to the first antifuse transistor in response to a word line read signal; a second memory cell including a second antifuse transistor and a second selection transistor, the second antifuse transistor being selectable between the first state or the second state in response to the word line program signal, the second selection transistor being configured to provide access to the second antifuse transistor in response to the word line read signal; a first word line to selectively provide the word line program signal; a second word line to selectively provide the word line read signal; and a bit line.

Abstract: A memory bit cell includes a first memory cell including a first antifuse transistor and a first selection transistor, the first antifuse transistor being selectable between a first state or a second state in response to a word line program signal, the first selection transistor being configured to provide access to the first antifuse transistor in response to a word line read signal; a second memory cell including a second antifuse transistor and a second selection transistor, the second antifuse transistor being selectable between the first state or the second state in response to the word line program signal, the second selection transistor being configured to provide access to the second antifuse transistor in response to the word line read signal; a first word line to selectively provide the word line program signal; a second word line to selectively provide the word line read signal; and a bit line.

Abstract: A memory circuit array includes a first read device and a first program device. The first read device is coupled to a first bit line. The first read device includes a first transistor coupled to a first word line, and a second transistor coupled to the first word line. The first program device is coupled to the first read device. The first program device includes a third transistor coupled to a second word line, and a fourth transistor coupled to the second word line.

Abstract: Memories are provided. A memory includes a first memory array, a second memory array and a read circuit. The first memory array is configured to store first data. The second memory array is configured to store second data that is complementary to the first data. The read circuit includes a decoding circuit, a sensing circuit and an output buffer. The decoding circuit is configured to provide a first signal according to the first data and a second signal according to the second data in response to an address signal. The sensing circuit is configured to provide a first sensing signal according to a reference signal and the first signal, and a second sensing signal according to the reference signal and the second signal. The output buffer is configured to provide the first sensing signal or the second sensing signal as an output according to a control signal.

Abstract: A method of manufacturing an anti-fuse device includes forming an anti-fuse structure on a substrate, forming a first transistor at a first position away from the anti-fuse device in a first direction, and forming a second transistor at a second position away from the anti-fuse device in a second direction opposite the first direction. Forming the anti-fuse structure includes forming first and second S/D structures in an active area, the first transistor includes the first S/D structure, and the second transistor includes the second S/D structure. The method includes constructing a first electrical connection between gate structures of the first and second transistors and a second electrical connection between a third S/D structure of the first transistor and a fourth S/D structure of the second transistor.