Patents by Inventor Shingo Nakamura
Shingo Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11948754Abstract: A three-terminal capacitor includes a main body having a cylindrical or substantially cylindrical shape extending in a first direction and including first and second inner electrodes alternately laminated together with dielectric layers interposed therebetween, a pair of first outer electrodes on two end surfaces of the main body in the first direction and electrically connected to the first inner electrodes, and a second outer electrode electrically connected to the second inner electrodes. The main body includes a projecting portion projecting in a direction perpendicular or substantially perpendicular to the first direction at a position between the pair of first outer electrodes. The second outer electrode is provided on one surface of the projecting portion viewable when viewed in the first direction.Type: GrantFiled: October 14, 2021Date of Patent: April 2, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Shingo Ito, Koichi Ikeda, Ken Takakura, Satoshi Yoshida, Syuichi Nabekura, Takahiro Hirao, Masanori Nakamura, Kyosuke Uno, Haruhiko Ueno, Yohei Mukobata
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Publication number: 20240107799Abstract: A novel functional panel that is highly convenient, useful, or reliable is provided. The functional panel includes a base material and a pair of pixels, and the base material covers the pair of pixels and has a light-transmitting property. The pair of pixels includes one pixel and another pixel, and the one pixel includes a light-emitting device and a first microlens. The light-emitting device emits light toward the base material, and the first microlens is interposed between the base material and the light emission and converges light. The first microlens includes a first surface and a second surface; the second surface is closer to the light-emitting device than the first surface is; and the second surface has a smaller radius of curvature than the first surface. The other pixel includes a photoelectric conversion device and a second microlens. The second microlens is interposed between the base material and the photoelectric conversion and converges external light incident from the base material side.Type: ApplicationFiled: December 8, 2023Publication date: March 28, 2024Inventors: Shunpei YAMAZAKI, Daiki NAKAMURA, Ryo HATSUMI, Rai SATO, Shingo EGUCHI, Koji KUSUNOKI
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Publication number: 20240096243Abstract: A novel display panel that is highly convenient, useful, or reliable is provided. The display panel includes a display region, a first support, and a second support, the display region includes a first region, a second region, and a third region, the first region and the second region each have a belt-like shape extending in one direction, and the third region is sandwiched between the first region and the second region. The first support overlaps with the first region and is less likely to be warped than the third region, and the second support overlaps with the second region and is less likely to be warped than the third region. The second support can pivot on an axis extending in the one direction with respect to the first support.Type: ApplicationFiled: November 21, 2023Publication date: March 21, 2024Inventors: Shingo EGUCHI, Taiki NONAKA, Daiki NAKAMURA, Nozomu SUGISAWA, Kazuhiko FUJITA, Shunpei YAMAZAKI
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Publication number: 20240076253Abstract: A fluoroalkyne compound can be efficiently synthesized from a fluoroalkane compound by a method for producing a fluoroalkyne compound represented by formula (1): R1C?CR2??(1) wherein R1 and R2 are the same or different and each is a fluorine atom or a fluoroalkyl group, the method comprising subjecting a fluoroalkane compound represented by formula (2): R1CHX1CFX2R2??(2) wherein R1 and R2 are as defined above; and X1 is a fluorine atom and X2 is a hydrogen atom, or X1 is a hydrogen atom and X2 is a fluorine atom, to a dehydrofluorination reaction in the presence of an ether solvent, the method satisfying at least one requirement selected from the group consisting of the following: (I) the fluoroalkyl group is a C1-C4 fluoroalkyl group, and (II) the ether solvent is a chain ether compound, and the dehydrofluorination reaction is performed in the presence of the solvent containing a chain ether and a base comprising a hydroxide and/or alkoxide of an alkali metal and/or alkaline earth metal.Type: ApplicationFiled: October 27, 2023Publication date: March 7, 2024Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Yuusuke ETOU, Shingo NAKAMURA
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Patent number: 11919547Abstract: A vehicle control device includes a driving controller controls one of or both steering and acceleration/deceleration of the vehicle, and a mode determinator determines any of a plurality of driving modes including a first driving mode and a second driving mode as a driving mode of the vehicle, in which tasks imposed on a driver in the second driving mode are less significant than in the first driving mode and one of or both steering and acceleration/deceleration of the vehicle are controlled by the driving controller, the driving controller controls the vehicle in the second driving mode, and the driving mode is changed to the first driving mode when an abnormality occurs in a combination switch, combination switch related equipment which is connected between the driving controller and the combination switch via a communication line, or communication which is performed by the combination switch and the driving controller.Type: GrantFiled: December 28, 2020Date of Patent: March 5, 2024Assignee: HONDA MOTOR CO., LTD.Inventors: Yuichi Komori, Yoshifumi Nakamura, Takuma Kobayashi, Shingo Ito, Ayumu Horiba, Tadahiko Kanoh
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Patent number: 11921312Abstract: There are provided a light emitting unit that enhances the uniformity of in-plane colors, as well as a display and a lighting apparatus that include such a light emitting unit thereon. The light emitting unit includes: a plurality of light emitting sections each having a light source and a wavelength conversion member, the wavelength conversion member converting a wavelength of light emitted from the light source; an optical component having a light incident surface in opposition to the plurality of light emitting sections; and a color unevenness prevention structure suppressing direct entering of light from the light source into the optical component.Type: GrantFiled: July 7, 2021Date of Patent: March 5, 2024Assignee: SATURN LICENSING LLCInventors: Shingo Ohkawa, Tomoharu Nakamura, Gen Yonezawa
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Patent number: 11908755Abstract: In one example, a semiconductor device comprises a substrate comprising a top side, a bottom side, and a conductive structure, a body over the top side of the substrate, an electronic component over the top side of the substrate and adjacent to the body, wherein the electronic component comprises an interface element on a top side of the electronic component, a lid over the interface element and a seal between the top side of the electronic component and the lid, and a buffer on the top side of the substrate between the electronic component and the body. Other examples and related methods are also disclosed herein.Type: GrantFiled: February 21, 2020Date of Patent: February 20, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Sang Jae Jang, Weilung Lu, Burt Barber, Adrian Arcedera, Shingo Nakamura
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Patent number: 11862892Abstract: A method includes providing a substrate having substrate terminals and providing a first component having a first terminal and a second terminal. The method includes providing a clip structure having a first clip, a second clip, and a clip connector coupling the first clip to the second clip. The method includes coupling the first clip to the first terminal and a substrate terminal and coupling the second clip to another substrate terminal. The method includes encapsulating the structure and removing a portion of the clip connector. In some examples, the first portion of the clip connector includes a first portion surface, the second portion of the clip connector includes a second portion surface, and the first portion surface and the second portion surface are exposed from a top side of the encapsulant. Other examples and related structures are also disclosed herein.Type: GrantFiled: February 11, 2023Date of Patent: January 2, 2024Inventors: Masaya Tazawa, Shingo Nakamura
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Publication number: 20230242466Abstract: A halogenated alkene compound and a fluorinated alkyne compound are obtained at a high conversion rate and high selectivity by employing any of the following methods (1) to (4): (1) a halogenated butane compound represented by CX1X2X3CHX4CFHCX5X6X7, wherein X1, X2, X3, X4, X5, X6, and X7 are the same or different and each is a halogen atom, to a dehydrofluorination reaction; (2) a halogenated butene compound represented by CX1X2X3CX4?CHCX5X6X7, wherein X1, X2, X3, X4, X5, X6, and X7 are as defined above, to a dehydrohalogenation reaction; (3) a halogenated alkane compound represented by CHX8A1CHX9A2, wherein A1 and A2 are each a fluorine atom or a perfluoroalkyl group, and X8 and X9 are the same or different and each is a halogen atom, to a dehydrohalogenation reaction in the presence of a catalyst in a gas phase; and (4) a halogenated alkene compound represented by CX8A1=CHA2, wherein A1, A2, and X8 are as defined above, to a dehydrohalogenation reaction in the presence of a catalyst.Type: ApplicationFiled: April 13, 2023Publication date: August 3, 2023Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Yuusuke ETOU, Shingo NAKAMURA
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Publication number: 20230198193Abstract: A method includes providing a substrate having substrate terminals and providing a first component having a first terminal and a second terminal. The method includes providing a clip structure having a first clip, a second clip, and a clip connector coupling the first clip to the second clip. The method includes coupling the first clip to the first terminal and a substrate terminal and coupling the second clip to another substrate terminal. The method includes encapsulating the structure and removing a portion of the clip connector. In some examples, the first portion of the clip connector includes a first portion surface, the second portion of the clip connector includes a second portion surface, and the first portion surface and the second portion surface are exposed from a top side of the encapsulant. Other examples and related structures are also disclosed herein.Type: ApplicationFiled: February 11, 2023Publication date: June 22, 2023Inventors: Masaya TAZAWA, Shingo NAKAMURA
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Patent number: 11655199Abstract: A halogenated alkene compound and a fluorinated alkyne compound are obtained at a high conversion rate and high selectivity by employing any of the following methods (1) to (4): (1) a halogenated butane compound represented by CX1X2X3CHX4CFHCX5X6X7, wherein X1, X2, X3, X4, X5, X6, and X7 are the same or different and each is a halogen atom, to a dehydrofluorination reaction; (2) a halogenated butene compound represented by CX1X2X3CX4?CHCX5X6X7, wherein X1, X2, X3, X4, X5, X6, and X7 are as defined above, to a dehydrohalogenation reaction; (3) a halogenated alkane compound represented by CHX8A1CHX9A2, wherein A1 and A2 are each a fluorine atom or a perfluoroalkyl group, and X8 and X9 are the same or different and each is a halogen atom, to a dehydrohalogenation reaction in the presence of a catalyst in a gas phase; and (4) a halogenated alkene compound represented by CX8A1=CHA2, wherein A1, A2, and X8 are as defined above, to a dehydrohalogenation reaction in the presence of a catalyst.Type: GrantFiled: August 20, 2021Date of Patent: May 23, 2023Assignee: DAIKIN INDUSTRIES, LTD.Inventors: Yuusuke Etou, Shingo Nakamura
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Patent number: 11611170Abstract: In one example, a method of manufacturing a semiconductor device includes providing a substrate having substrate terminals and providing a component having a first component terminal and a second component terminal adjacent to a first major side of the component. The method includes providing a clip structure having a first clip, a second clip, and a clip connector coupling the first clip to the second clip. The method includes coupling the first clip to the first component terminal and a first substrate terminal and coupling the second clip to a second substrate terminal. The method includes encapsulating the component, portions of the substrate, and portions of the clip structure. the method includes removing a sacrificial portion of the clip connector while leaving a first portion of the clip connector attached to the first clip and leaving a second portion of the clip connector attached to the second clip.Type: GrantFiled: March 23, 2021Date of Patent: March 21, 2023Assignee: Amkor Technology Singapore Holding Pte. LtdInventors: Masaya Tazawa, Shingo Nakamura
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Publication number: 20220384284Abstract: In one example, a semiconductor device comprises a cavity substrate comprising a base and a sidewall to define a cavity, an electronic component on a top side of the base in the cavity, a lid over the cavity and over the sidewall, and a valve to provide access to the cavity, wherein the valve has a plug to provide a seal between a cavity environment and an exterior environment outside the cavity. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 17, 2022Publication date: December 1, 2022Applicant: Amkor Technology Japan, Inc.Inventors: Shojiro Hanada, Shingo Nakamura
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Publication number: 20220311168Abstract: In one example, a method of manufacturing a semiconductor device includes providing a substrate having substrate terminals and providing a component having a first component terminal and a second component terminal adjacent to a first major side of the component. The method includes providing a clip structure having a first clip, a second clip, and a clip connector coupling the first clip to the second clip. The method includes coupling the first clip to the first component terminal and a first substrate terminal and coupling the second clip to a second substrate terminal. The method includes encapsulating the component, portions of the substrate, and portions of the clip structure. the method includes removing a sacrificial portion of the clip connector while leaving a first portion of the clip connector attached to the first clip and leaving a second portion of the clip connector attached to the second clip.Type: ApplicationFiled: March 23, 2021Publication date: September 29, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Masaya TAZAWA, Shingo NAKAMURA
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Publication number: 20220289649Abstract: In the presence of a catalyst and a cycloalkane compound represented by formula (3): wherein R3, R4, R5, R6, R7, R8, R9, and R10 are the same or different and each is a halogen atom, an alkyl group, or a fluoroalkyl group; an alkene compound represented by formula (2): wherein X, X2, R1, and R2 are as defined above; is reacted with a hydrogen-containing gas to hydrogenate the alkene compound represented by formula (2), whereby an alkane compound represented by R1CHX1CHX2R2, wherein X1 and X2 are the same or different and each is a halogen atom, and R1 and R2 are the same or different and each is an alkyl group or a fluoroalkyl group; can he synthesized in such a manner that (S),(R)-isomer, (R),(R)-isomer, and (S),(S)-isomer are co-produced.Type: ApplicationFiled: May 26, 2022Publication date: September 15, 2022Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Yuusuke ETOU, Shingo NAKAMURA
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Publication number: 20220281786Abstract: An object of the present disclosure is to provide a method for dehydrating a composition containing a fluorine-based hydrocarbon compound, such as HFC-134a. The dehydration method includes the step of bringing a composition containing a fluorine-based hydrocarbon compound into contact with a zeolite.Type: ApplicationFiled: May 25, 2022Publication date: September 8, 2022Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Yuusuke ETOU, Shingo NAKAMURA
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Patent number: 11367664Abstract: In one example, a semiconductor device comprises a cavity substrate comprising a base and a sidewall to define a cavity, an electronic component on a top side of the base in the cavity, a lid over the cavity and over the sidewall, and a valve to provide access to the cavity, wherein the valve has a plug to provide a seal between a cavity environment and an exterior environment outside the cavity. Other examples and related methods are also disclosed herein.Type: GrantFiled: December 19, 2019Date of Patent: June 21, 2022Assignee: Amkor Technology Japan, Inc.Inventors: Shojiro Hanada, Shingo Nakamura
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Publication number: 20220119327Abstract: An object of the present disclosure is to provide a chlorinated alkane at a high conversion rate (yield) and with high selectivity. Provided is a method for producing an alkane, the method including the step of subjecting an alkene to a chlorination reaction, the chlorination reaction step being performed by light irradiation using light having a wavelength in the visible light range.Type: ApplicationFiled: December 28, 2021Publication date: April 21, 2022Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Yuusuke ETOU, Shingo NAKAMURA
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Publication number: 20220119325Abstract: An object of the present disclosure is to provide a chlorinated alkane at a high conversion rate (yield) and with high selectivity. Provided is a method for producing an alkane, the method including the step of subjecting an alkene to a chlorination reaction, the chlorination reaction step being performed using zeolite as a catalyst.Type: ApplicationFiled: December 28, 2021Publication date: April 21, 2022Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Yuusuke ETOU, Shingo NAKAMURA
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Publication number: 20220115301Abstract: In one example, an electronic device comprises a first substrate comprising a base, an electronic component over the first substrate and comprising a top side and a bottom side, a first terminal and a second terminal on the top side, and a third terminal on the bottom side, wherein the third terminal is coupled with the first substrate. The electronic device further comprises a second substrate over the electronic component, and an encapsulant over the first substrate, contacting a lateral side of the electronic component and contacting the second substrate. A first lead is coupled with and extends over the base of the first substrate, a second lead of the second substrate is coupled to the first terminal of the electronic component, and the first lead and the second lead are exposed from a top side of the encapsulant. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: August 10, 2021Publication date: April 14, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Shaun Bowers, Yoshio Matsuda, Hyung Il Jeon, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Woo Lee, Yong Ho Son, Miki Nakashima, Kazuaki Nagasawa, Shingo Nakamura, Sophie Olson, Jin Young Khim