Abstract: Provided is a liquid ejection apparatus, liquid ejection method, dispensing apparatus, and compound introduction apparatus capable of inhibiting contamination of a liquid after being ejected. The liquid ejection apparatus has an ejection unit having an ejection part and an ejection energy generation element that ejects a liquid from the ejection part by using a principle of inkjet ejection into an internal space in a storage part capable of storing the ejected liquid. When ejecting the liquid, the ejection unit covers an opening portion of the storage part to thereby screen the internal space in the storage part from an external space.

Abstract: A heat dissipation sheet includes a first sheet composed of a plurality of first carbon nanotubes, and a second sheet composed of a plurality of second carbon nanotubes, wherein the first sheet and the second sheet are coupled in a stacked state, and the first carbon nanotubes and the second carbon nanotubes are different in an amount of deformation when pressure is applied.

Abstract: In order to provide a conductive heat radiation film that can stabilize the shape, a method of manufacturing a conductive heat radiation film 30 includes: a first heated film 28 including a plurality of first metal particles 27b; and a plurality of carbon nanotubes 24 including tips 24a adhered to the first heated film 28.

Abstract: A bonding structure includes: a plurality of carbon nanotubes; a first bonded member; and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.

Abstract: In order to provide a conductive heat radiation film that can stabilize the shape, a conductive heat radiation film 30 includes: a first heated film 28 including a plurality of first metal particles 27b; and a plurality of carbon nanotubes 24 including tips 24a adhered to the first heated film 28.

Abstract: A bonding structure includes: a plurality of carbon nanotubes; a first bonded member, and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.

Abstract: A heat dissipation sheet includes a first sheet composed of a plurality of first carbon nanotubes, and a second sheet composed of a plurality of second carbon nanotubes, wherein the first sheet and the second sheet are coupled in a stacked state, and the first carbon nanotubes and the second carbon nanotubes are different in an amount of deformation when pressure is applied.

Abstract: A heat dissipation sheet includes a first sheet composed of a plurality of first carbon nanotubes, and a second sheet composed of a plurality of second carbon nanotubes, wherein the first sheet and the second sheet are coupled in a stacked state, and the first carbon nanotubes and the second carbon nanotubes are different in an amount of deformation when pressure is applied.

Abstract: A heat dissipation sheet includes a carbon material layer configured to include a plurality of linear carbon materials arranged in parallel with each other, an adhesive resin layer configured to include a first surface to be in contact with an end of each of the plurality of linear carbon materials, a thickness of the adhesive resin layer being less than 1 ?m, and a release sheet configured to be in contact with a second surface among a plurality of surfaces of the adhesive resin layer, the second surface being over a side opposite to the first surface.

Abstract: In order to provide a conductive heat radiation film that can stabilize the shape, a conductive heat radiation film 30 includes: a first heated film 28 including a plurality of first metal particles 27b; and a plurality of carbon nanotubes 24 including tips 24a adhered to the first heated film 28.

Abstract: An electronic device includes a component, a resin film formed to the component, and a plurality of carbon nanotubes whose end portions pass through the resin film and are in contact with the component, wherein a first portion of each of the carbon nanotubes is covered with the resin film, the first portion has a first length which is greater than a thickness of the resin film, and an intermediate portion of each of the carbon nanotubes other than the first portion is uncovered with and exposed from the resin.

Abstract: There is provided a method of manufacturing a heat radiation sheet, the method including: forming a base film on a substrate; growing a plurality of carbon nanotubes on the base film; and vaporizing at least a part of the base film by heating the base film to coat the carbon nanotube with a coating film containing a material of the vaporized base film.

Abstract: A bonding structure includes: a plurality of carbon nanotubes; a first bonded member, and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.

Abstract: A carbon nanotube structure includes a plurality of carbon nanotubes, and a graphite film that binds one ends of the plurality of carbon nanotubes. And a heat dissipation sheet includes a plurality of carbon nanotube structures arranged in a sheet form, wherein each of the carbon nanotube structures includes a plurality of carbon nanotubes, and a graphite film that binds one ends of the plurality of carbon nanotubes.

Abstract: The disclosed method of manufacturing an electronic device includes: placing a resin film on a component; and while heating the resin film to be softened, pressing end portions of a plurality of carbon nanotubes against the softened resin film to bring the end portions into contact with the component, and causing the softened resin film to climb up side surfaces of the carbon nanotubes.

Abstract: A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.

Abstract: A method of manufacturing an electronic device includes: placing a resin film on a component; and while heating the resin film to be softened, pressing end portions of a plurality of carbon nanotubes against the softened resin film to bring the end portions into contact with the component, and causing the softened resin film to climb up side surfaces of the carbon nanotubes.

Abstract: A heat dissipation sheet includes a first sheet composed of a plurality of first carbon nanotubes, and a second sheet composed of a plurality of second carbon nanotubes, wherein the first sheet and the second sheet are coupled in a stacked state, and the first carbon nanotubes and the second carbon nanotubes are different in an amount of deformation when pressure is applied.

Abstract: A heat dissipating structure includes a heat source; a heat dissipating part disposed to oppose to the heat source; a concave portion formed in at least one of opposing surfaces of the heat source and the heat dissipating part; and a heat conducting structure comprising a filler layer of thermoplastic material disposed between the heat source and the heat dissipating part and contacting with the opposing surfaces of the heat source and the heat dissipating part, and an assembly of carbon nanotubes that are distributed in the thermoplastic material, oriented perpendicularly to the surfaces of the filler layer, contacting, at both ends, with the opposing surfaces of the heat source and the heat dissipating part, and limited its distribution in the opposing surfaces by the concave portion.

Abstract: A carbon nanotube structure includes a plurality of carbon nanotubes, and a graphite film that binds one ends of the plurality of carbon nanotubes. And a heat dissipation sheet includes a plurality of carbon nanotube structures arranged in a sheet form, wherein each of the carbon nanotube structures includes a plurality of carbon nanotubes, and a graphite film that binds one ends of the plurality of carbon nanotubes.