Patents by Inventor Shinichi Hirose

Shinichi Hirose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180061736
    Abstract: The disclosed method of manufacturing an electronic device includes: placing a resin film on a component; and while heating the resin film to be softened, pressing end portions of a plurality of carbon nanotubes against the softened resin film to bring the end portions into contact with the component, and causing the softened resin film to climb up side surfaces of the carbon nanotubes.
    Type: Application
    Filed: July 26, 2017
    Publication date: March 1, 2018
    Applicant: FUJITSU LIMITED
    Inventors: Shinichi Hirose, Daiyu Kondo
  • Publication number: 20170186664
    Abstract: A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.
    Type: Application
    Filed: March 10, 2017
    Publication date: June 29, 2017
    Applicant: FUJITSU LIMITED
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Masaaki Norimatsu, Yukie Sakita, Shinichi Hirose, Yohei Yagishita
  • Patent number: 9635784
    Abstract: A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: April 25, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Masaaki Norimatsu, Yukie Sakita, Shinichi Hirose, Yohei Yagishita
  • Publication number: 20160130493
    Abstract: There is provided a method of manufacturing a heat radiation sheet, the method including: forming a base film on a substrate; growing a plurality of carbon nanotubes on the base film; and vaporizing at least a part of the base film by heating the base film to coat the carbon nanotube with a coating film containing a material of the vaporized base film.
    Type: Application
    Filed: October 29, 2015
    Publication date: May 12, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Shinichi Hirose, Yoshihiro Mizuno
  • Patent number: 9137926
    Abstract: An electronic device includes: a semiconductor device; a heat-conductive resin, disposed above the semiconductor device, including a heat conductor and a resin; a linear carbon piece, disposed above the heat-conductive resin, to be thermally in contact with the heat conductor; and a heat spreader, disposed above the linear carbon piece, including a depressed portion having the heat-conductive resin.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: September 15, 2015
    Assignee: FUJITSU LIMITED
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Seiki Sakuyama, Yoshihiro Mizuno, Masaaki Norimatsu, Yukie Sakita, Koji Asano, Shinichi Hirose, Yohei Yagishita
  • Patent number: 9105600
    Abstract: A sheet structure has: a bundle structure including a plurality of linear structures made of carbon which are oriented in a predetermined direction; a covering layer covering the plurality of linear structures made of carbon; and a filling layer provided between the plurality of linear structures made of carbon covered with the covering layer. The thickness of the covering layer is not uniform in a direction crossing the predetermined direction.
    Type: Grant
    Filed: April 10, 2013
    Date of Patent: August 11, 2015
    Assignee: FUJITSU LIMITED
    Inventors: Yoshitaka Yamaguchi, Seiki Sakuyama, Yoshihiro Mizuno, Taisuke Iwai, Yukie Sakita, Masaaki Norimatsu, Koji Asano, Shinichi Hirose, Yohei Yagishita
  • Patent number: 8958207
    Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: February 17, 2015
    Assignee: Fujitsu Limited
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Shinichi Hirose, Daiyu Kondo, Ikuo Soga, Yohei Yagishita, Yukie Sakita
  • Patent number: 8837149
    Abstract: A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: September 16, 2014
    Assignee: Fujitsu Limited
    Inventors: Shinichi Hirose, Taisuke Iwai, Yoshitaka Yamaguchi, Yohei Yagishita, Yukie Sakita, Masaaki Norimatsu
  • Patent number: 8810212
    Abstract: The present invention provides a switching power supply device that is capable of steadily operating even when a low supply voltage is employed. The present invention also provides a microcomputer equipped with the switching power supply device. A switching regulator includes an inductor that inputs an external supply voltage at one end, a main switch that is coupled to another end of the inductor, an auxiliary switch that is coupled to the other end of the inductor in parallel with the main switch, and a rectifying/smoothing circuit having a diode and a capacitor. A switching operation of the main switch is controlled by a control signal generated from a PFM control circuit, which is driven by an internal supply voltage. A switching operation of the auxiliary switch is controlled by a control signal generated from a ring oscillator, which is driven by the external supply voltage.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: August 19, 2014
    Assignee: Renesas Electronics Corporation
    Inventor: Shinichi Hirose
  • Patent number: 8749979
    Abstract: The sheet structure includes a plurality of linear structures of carbon atoms, a filling layer filled in gaps between the linear structures for supporting the plurality of linear structures, and a coating film formed over at least one ends of the plurality of linear structures and having a thermal conductivity of not less than 1 W/m·K.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: June 10, 2014
    Assignee: Fujitsu Limited
    Inventors: Taisuke Iwai, Daiyu Kondo, Yoshitaka Yamaguchi, Ikuo Soga, Shinichi Hirose
  • Patent number: 8743546
    Abstract: The sheet structure includes a plurality of linear structure bundles 12 each of which comprises a plurality of linear structures of carbon atoms arranged, spaced from each other at a first gap and which are arranged at a second gap which is larger than the first gap; and a filling layer 14 filled in the first gap and the second gap and supporting the plurality of linear structure bundles 12.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: June 3, 2014
    Assignee: Fujitsu Limited
    Inventors: Taisuke Iwai, Daiyu Kondo, Yoshitaka Yamaguchi, Ikuo Soga, Shinichi Hirose
  • Publication number: 20140140008
    Abstract: A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.
    Type: Application
    Filed: January 28, 2014
    Publication date: May 22, 2014
    Applicant: FUJITSU LIMITED
    Inventors: Yoshitaka Yamaguchi, TAISUKE IWAI, Masaaki Norimatsu, Yukie Sakita, Shinichi Hirose, Yohei Yagishita
  • Publication number: 20130307136
    Abstract: A sheet structure has: a bundle structure including a plurality of linear structures made of carbon which are oriented in a predetermined direction; a covering layer covering the plurality of linear structures made of carbon; and a filling layer provided between the plurality of linear structures made of carbon covered with the covering layer. The thickness of the covering layer is not uniform in a direction crossing the predetermined direction.
    Type: Application
    Filed: April 10, 2013
    Publication date: November 21, 2013
    Applicant: FUJITSU LIMITED
    Inventors: Yoshitaka YAMAGUCHI, Seiki SAKUYAMA, Yoshihiro MIZUNO, Taisuke IWAI, Yukie SAKITA, Masaaki NORIMATSU, Koji ASANO, Shinichi HIROSE, Yohei YAGISHITA
  • Patent number: 8511216
    Abstract: A hydraulic actuator unit includes a first electric motor assembly formed by mounting one of a pair of electric motors to one of a pair of electric motor covers, wherein the first electric motor assembly is detachably mounted to a pump case so as to rotate a first control shaft around its axis line, and a second electric motor assembly formed by mounting the other one of the pair of electric motors to the other one of the pair of electric motor covers, wherein the second electric motor assembly is detachably mounted to the pump case so as to rotate a second control shaft around its axis line.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: August 20, 2013
    Assignee: Kanzaki Kokyukoki Mfg. Co., Ltd.
    Inventors: Kengo Sasahara, Toshifumi Yasuda, Minoru Kamada, Masaaki Inoue, Takashi Nishizawa, Fumitoshi Ishino, Masaya Itou, Shinichi Hirose, Jun Matsuura, Ryota Iwaibara
  • Publication number: 20120325454
    Abstract: A heat dissipating structure includes a heat source; a heat dissipating part disposed to oppose to the heat source; a concave portion formed in at least one of opposing surfaces of the heat source and the heat dissipating part; and a heat conducting structure comprising a filler layer of thermoplastic material disposed between the heat source and the heat dissipating part and contacting with the opposing surfaces of the heat source and the heat dissipating part, and an assembly of carbon nanotubes that are distributed in the thermoplastic material, oriented perpendicularly to the surfaces of the filler layer, contacting, at both ends, with the opposing surfaces of the heat source and the heat dissipating part, and limited its distribution in the opposing surfaces by the concave portion.
    Type: Application
    Filed: September 5, 2012
    Publication date: December 27, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Taisuke IWAI, Daiyu Kondo, Yoshitaka Yamaguchi, Shinichi Hirose, Yukie Sakita, Yohei Yagishita, Masaki Norimatsu
  • Patent number: 8332202
    Abstract: A technique for enhancing the execution efficiency of simulation of a hybrid system. A continuous system simulator receives a request for evaluation of an event generating conditional expression for an event to be processed by a discrete system simulator, from the discrete system simulator. The event generating conditional expression is evaluated by referring to the value of a first variable describing a continuous system. Until evaluation of the event generating conditional expression indicates true, the continuous system simulator repeats simulation of advancing the current time by a step time interval and evaluation of the event generating conditional expression. When evaluation of the event generating conditional expression indicates true, the continuous system simulator sends current time data and the value of a second variable describing the continuous system which is referred to by the discrete simulator, to the discrete simulator.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: December 11, 2012
    Assignee: International Business Machines Corporation
    Inventors: Shinichi Hirose, Hiroshi Ishikawa, Ryo Kawahara, Hiroaki Nakamura
  • Patent number: 8309894
    Abstract: An electric heating module for a room air conditioning system and methods are presented in which the duty cycle of the electric heater banks are controlled to limit the inrush current during the startup phase of the heater or to supplement the heat generated by the heat pump when the heat capacity of the heat pump nears the heat loss of the room being heated.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: November 13, 2012
    Assignee: General Electric Company
    Inventors: Tom C. Zimmer, Tim N. Johnson, Robert Lafleur, Brice Alan Bowley, Shinichi Hirose, Masanobu Amazutsumi, Gregory Michael Thomas, Tohru Ariga
  • Publication number: 20120236502
    Abstract: According to an aspect of the embodiments, a sheet-shaped structure includes a bundle structure that includes a plurality of line-shaped structures of carbon atoms, a covering layer that covers the line-shaped structures in longitudinal directions of the line-shaped structures, respectively, and a filling layer that is disposed between the line-shaped structures covered with the covering layer.
    Type: Application
    Filed: February 23, 2012
    Publication date: September 20, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Masaaki Norimatsu, Shinichi Hirose, Yohei Yagishita, Yukie Sakita
  • Publication number: 20120218713
    Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.
    Type: Application
    Filed: May 7, 2012
    Publication date: August 30, 2012
    Applicant: Fujitsu Limited
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Shinichi Hirose, Daiyu Kondo, Ikuo Soga, Yohei Yagishita, Yukie Sakita
  • Publication number: 20120218715
    Abstract: A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.
    Type: Application
    Filed: November 30, 2011
    Publication date: August 30, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Shinichi HIROSE, Taisuke Iwai, Yoshitaka Yamaguchi, Yohei Yagishita, Yukie Sakita, Masaaki Norimatsu