Abstract: In order to prevent a replacement of the needle plate in the situation not suitable for replacing the needle plate, a needle plate detachable mechanism has a needle plate fixing unit for fixing a needle plate on a sewing machine body; a releasing unit for releasing a fixed state of the needle plate; and a fixing-release limiting unit for limiting a release of the fixed state of the needle plate when the needle is positioned below an upper surface of the needle plate or when the sewing machine motor is driven.

Abstract: First irradiation which causes an emission output from a flash lamp to reach its maximum value over a time period in the range of 1 to 20 milliseconds is performed to increase the temperature of a front surface of a semiconductor wafer from a preheating temperature to a target temperature for a time period in the range of 1 to 20 milliseconds. This achieves the activation of the impurities. Subsequently, second irradiation which gradually decreases the emission output from the maximum value over a time period in the range of 3 to 50 milliseconds is performed to maintain the temperature of the front surface within a ±25° C. range around the target temperature for a time period in the range of 3 to 50 milliseconds. This prevents the occurrence of process-induced damage while suppressing the diffusion of the impurities.

Abstract: Contactless power supply device of the present invention includes: contactless power supply section that supplies AC power in a contactless manner; contactless power receiving section that receives the AC power in a contactless manner; first DC transformer circuit that transforms, to DC load voltage, DC reception-power voltage obtained from the contactless power receiving section and supplies the DC load voltage to first electric load, and that has a reverse transfer function of transferring regenerative power generated by the first electric load in a reverse direction; and second DC transformer circuit that transforms the DC reception-power voltage to DC load voltage and supplies the DC load voltage to second electric load. Accordingly, the generated regenerative power is allocated and made available to the other electric load, and a power storage section is not necessary, which suppresses an increase in the weight and size of the power-receiving-side device.

Abstract: Included are a bottom portion having a traveling portion, a body portion having a first pillar portion and a second pillar portion extending in a vertical direction, respectively, from one end and another end in a horizontal direction of the bottom portion, and a top portion including one end connected to an end of the first pillar portion opposite to the bottom portion and including another end connected to an end of the second pillar portion opposite to the bottom portion, an article storage portion that forms an opening with the first pillar portion, the second pillar portion, the top portion, and the bottom portion in such a way that the opening penetrates the body portion, and fixing portions provided in the first and second pillar portions to sandwich the opening and pair up with each other, for fixing an article storage auxiliary instrument.

Abstract: Glass flakes of the present invention include glass flake substrates and a coating covering at least a portion of the surface of each of the glass flake substrates and composed of a binder. The binder includes a silane coupling agent, an epoxy resin, and a carbodiimide compound as essential components and includes, as an optional component, a crosslinking agent other than a carbodiimide compound. The total amount of the carbodiimide compound and the crosslinking agent is 20 mass % or less with respect to the total mass of the binder.

Abstract: The present invention provides, in a method for measuring a subject substance by using a binding partner that specifically recognizes a substance to be measured, a detection agent for amplifying a signal from a reporter substance that indirectly binds to the substance to be measured via the binding partner, and a signal amplification method using the detection agent. The present invention pertains to the detection agent in which the binding partner which specifically recognizes a substance to be measured is immobilized on gold nanoparticles together with a plurality of the reporter substances.

Abstract: Over a front surface of a silicon semiconductor wafer is deposited a high dielectric constant film with a silicon oxide film, serving as an interface layer, provided between the semiconductor wafer and the high dielectric constant film. After a chamber houses the semiconductor wafer, a chamber's pressure is reduced to be lower than atmospheric pressure. Subsequently, a gaseous mixture of ammonia and nitrogen gas is supplied into the chamber to return the pressure to ordinary pressure, and the front surface is irradiated with a flash light, thereby performing post deposition annealing (PDA) on the high dielectric constant film. Since the pressure is reduced once to be lower than atmospheric pressure and then returned to ordinary pressure, a chamber's oxygen concentration is lowered remarkably during the PDA. This restricts an increase in thickness of the silicon oxide film underlying the high dielectric constant film by oxygen taken in during the PDA.

Abstract: A contactless electric power supply device configured to widen a range in which power supply is possible to a moving body in a connection direction by supplying electric power from a supply coil to the moving body provided with the receiving coil in a contactless manner and connecting power supply modules provided with the supply coil, wherein, when at least one of the receiving coils is positioned to be able to receiver power from at least one of the supply coils, the contactless electric power supply device performs communication from the power supply module to an alternating module that supplies alternating current and performs communication from the alternating module to the power supply module, and causes a semiconductor switch provided on the power supply module to conduct electricity.

Abstract: Provided is a three-dimensional shaped article with relatively high strength and relatively high accuracy. A sintering and shaping method includes: a shaping layer forming process of forming a shaping layer by using a sintering and shaping material in which inorganic particles are included; a process of applying a liquid binding agent, in which a thermoplastic resin and inorganic particles are included, to a desired region of the shaping layer; a process of curing the liquid binding agent, which is applied, to form a shaping cross-sectional layer (shaping portion); a process of removing a region (non-shaping portion) of the shaping layer to which the liquid binding agent is not applied; and a process of heating the shaping cross-sectional layer that is laminated for a sintering treatment.

Abstract: According to an illustrative embodiment an information processing device is provided. The device includes a processor for controlling acquisition of first information which indicates a service not registered in an integrated circuit of the device and a service registered in the integrated circuit of the device, the first information being acquired from within the device, controlling acquisition of second information which indicates a service registered in the integrated circuit of the device, and controlling display based on the first information and second information.

Abstract: Hydrogen annealing for heating a semiconductor wafer on which a thin film containing a dopant is deposited to an annealing temperature under an atmosphere containing hydrogen is performed. A native oxide film is inevitably formed between the thin film containing the dopant and the semiconductor wafer, however, by performing hydrogen annealing, the dopant atoms diffuse relatively easily in the native oxide film and accumulate at the interface between the front surface of the semiconductor wafer and the native oxide film. Subsequently, the semiconductor wafer is preheated to a preheating temperature under a nitrogen atmosphere, and then, flash heating treatment in which the front surface of the semiconductor wafer is heated to a peak temperature for less than one second is performed. The dopant atoms are diffused and activated in a shallow manner from the front surface of the semiconductor wafer, thus, the low-resistance and extremely shallow junction is obtained.

Abstract: A method for defibrating a fiber body includes: a supply step of supplying a liquid to a fiber body containing fibers; and a defibrating step of defibrating the fiber body to which the liquid is supplied, and in the supply step, the liquid is supplied to the fiber body so that a rate in tensile strength of the fiber body immediately before defibrated in the defibrating step to the fiber body before the liquid is supplied thereto is 60.0% or less.

Abstract: A waste paper recycling apparatus includes a liquid ejection device which receives a first liquid and a second liquid different from the first liquid; a receiving portion receiving a selection operation which selects one of the first liquid and the second liquid which is adhered to a predetermined region of a sheet containing fibers formed from waste paper; and a control portion which controls the liquid ejection device to adhere the liquid selected by the selection operation to the predetermined region. In the waste paper recycling apparatus, the first liquid contains a binder which binds fibers together, and the second liquid contains a pigment and a binder which binds fibers together.

Abstract: A fiber body forming method includes a step of preparing a web which contains fibers and which has a bulk density of 0.09 g/cm3 or more; and a step of applying a liquid containing a binder which binds the fibers together to the web.

Abstract: A fiber body forming method includes a step of applying a liquid to a web containing fibers, the liquid contains resin particles which bind the fibers, and the liquid has a surface tension of 50 mN/m or less at 20° C.