Patents by Inventor Shinichi Nishimura

Shinichi Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210329183
    Abstract: A pixel is included, the pixel including a photoelectric conversion portion configured to convert incident light to a charge by photoelectric conversion and accumulate the charge, a charge transfer unit configured to transfer the charge generated in the photoelectric conversion portion, a diffusion layer to which the charge is transferred through the charge transfer unit, the diffusion layer having a predetermined storage capacitance, a conversion unit configured to convert the charge transferred to the diffusion layer to a pixel signal, and connection wiring configured to connect the diffusion layer and the conversion unit. The connection wiring is connected to the diffusion layer and the conversion unit through contact wiring extending in a vertical direction with respect to a semiconductor substrate on which the diffusion layer is formed and is formed closer to the semiconductor substrate than other wiring provided in the pixel.
    Type: Application
    Filed: June 30, 2021
    Publication date: October 21, 2021
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takeshi YANAGITA, Masaaki TAKIZAWA, Yuuji NISHIMURA, Shinichi ARAKAWA, Yuugo NAKAMURA, Yohei CHIBA
  • Publication number: 20210324913
    Abstract: A sliding member of the present invention includes a base material and a coating layer that is formed on the base material. The coating layer includes a particle aggregate, and the particle aggregate contains two or more kinds of precipitation hardened copper alloy particles that have different compositions. The sliding member has high coating strength and superior wear resistance.
    Type: Application
    Filed: June 13, 2019
    Publication date: October 21, 2021
    Applicants: NISSAN MOTOR CO., LTD., FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Yoshinori IZAWA, Junichi ARAI, Katsunori OTOBE, Shinichi NISHIMURA
  • Patent number: 11150835
    Abstract: According to one embodiment, a memory system includes a nonvolatile memory and a controller. The controller acquires, from a host, write data having the same first size as a data write unit of the nonvolatile memory and obtained by dividing write data associated with one write command having a first identifier indicating a first write destination block in a plurality of write destination blocks into a plurality of write data or combining write data associated with two or more write commands having the first identifier. The controller writes the acquired write data having the first size to the first write destination block by a first write operation.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: October 19, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Shinichi Kanno, Hideki Yoshida, Naoki Esaka, Hiroshi Nishimura
  • Patent number: 11148195
    Abstract: A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape. A sliding member includes the laminate in at least one sliding portion. A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: October 19, 2021
    Assignees: NISSAN MOTOR CO., LTD., FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Yoshinori Izawa, Junichi Arai, Yutaka Mabuchi, Katsunori Otobe, Shinichi Nishimura
  • Publication number: 20210293274
    Abstract: A sliding member of the present invention includes a base material and a coating layer that is formed on the base material. The coating layer includes a particle aggregate that contains precipitation hardened copper alloy particles. The precipitation hardened copper alloy particles contain cobalt (Co) and silicon (Si) The sliding member has high coating strength and superior wear resistance.
    Type: Application
    Filed: June 19, 2019
    Publication date: September 23, 2021
    Applicants: NISSAN MOTOR CO., LTD., FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Yoshinori IZAWA, Junichi ARAI, Katsunori OTOBE, Shinichi NISHIMURA
  • Publication number: 20210291263
    Abstract: A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape. A sliding member includes the laminate in at least one sliding portion. A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 23, 2021
    Applicants: NISSAN MOTOR CO., LTD., FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Yoshinori IZAWA, Junichi ARAI, Yutaka MABUCHI, Katsunori OTOBE, Shinichi NISHIMURA
  • Patent number: 11111570
    Abstract: A ferritic stainless steel plate having a sheet thickness t of 5.0 to 12.0 mm, including a chemical composition consisting of, in mass percent, C: 0.001 to 0.010%, Si: 0.01 to 1.0%, Mn: 0.01 to 1.0%, P: 0.04% or less, S: 0.010% or less, Cr: 10.0 to 20.0%, Ni: 0.01 to 1.0%, Ti: 0.10 to 0.30%, V: 0.01 to 0.40%, Al: 0.005 to 0.3%, N: 0.001 to 0.02%, and as necessary, one or more of B, Mo, Cu, Mg, Sn, Sb, Zr, Ta, Nb, Hf, W, Co, Ca, REM, and Ga, with the balance being Fe and unavoidable impurities, wherein in a steel micro-structure, on a cross section parallel to a rolling direction, an area ratio of structures each satisfying: major grain diameter/minor grain diameter being less than 5.0 is 90% or more, and an average minor grain diameter of the structures is 55 ?m or less. The ferritic stainless steel sheet is excellent in toughness and suitable for an automobile exhaust flange member and the like.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: September 7, 2021
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Shinichi Teraoka, Shinichi Tamura, Akihiro Nishimura
  • Publication number: 20210233748
    Abstract: In the present invention, a gas passing groove, a high-voltage electrode groove and a ground electrode groove formed in an electrode unit base are each spiral in plan view. A high-voltage electrode is embedded in the high-voltage electrode grove, and a ground electrode is embedded in the ground electrode groove. The high-voltage electrode and the ground electrode are arranged on sides of opposite side surfaces of the gas passing groove in the electrode unit base to oppose each other with a portion of the electrode unit base and the gas passing groove therebetween, and are spiral in plan view along with the gas passing groove.
    Type: Application
    Filed: June 25, 2018
    Publication date: July 29, 2021
    Applicant: Toshiba Mitsubishi-Electric Industrial Systems Corporation
    Inventors: Kensuke WATANABE, Shinichi NISHIMURA, Ren ARITA
  • Patent number: 11013105
    Abstract: An image pickup unit includes an image pickup element and a wiring board. The image pickup element includes an analog circuit. The analog circuit includes an analog ground wiring. The image pickup element is mounted on the wiring board. The wiring board includes a first ground wiring that is connected to the analog ground wiring and forms a closed loop with the analog ground wiring in a side view of the image pickup unit, and a second ground wiring that is connected to the first ground wiring via only a first via conductor.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: May 18, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Wenying Ye, Yasuhiko Sano, Shinichi Nishimura, Takafumi Kishi
  • Patent number: 11007497
    Abstract: A gas jetting apparatus capable of uniformly jetting, even onto a treatment-target object having a high-aspect-ratio groove, a gas into the groove. The gas jetting apparatus includes a gas jetting cell unit for jetting a gas toward a treatment-target object. The gas jetting cell unit includes a first cone-shaped member and a second cone-shaped member. A gap is formed between a side surface of a first cone shape and a side surface of the second cone-shaped member. Apex sides of the cone-shaped members face the treatment-target object.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: May 18, 2021
    Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
    Inventors: Yoichiro Tabata, Kensuke Watanabe, Shinichi Nishimura
  • Patent number: 10971338
    Abstract: In an active gas generating apparatus, a power feeder is provided above metal electrodes in an integrated high-voltage electrode unit. When seen in plan view, the power feeder has a shape that entirely covers the metal electrodes in the integrated high-voltage electrode unit. Each of power feeding units is provided below the metal electrodes in an integrated ground electrode unit. When seen in plan view, each of the power feeding units has a shape that entirely covers the metal electrodes of the integrated ground electrode unit.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: April 6, 2021
    Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
    Inventors: Ren Arita, Kensuke Watanabe, Shinichi Nishimura
  • Publication number: 20210057192
    Abstract: In the present invention, a high-voltage side electrode component further includes a conductive film disposed on an upper surface of a dielectric electrode independently of a metal electrode. The conductive film is disposed between at least one gas ejection port and the metal electrode in plan view, and the conductive film is set to ground potential.
    Type: Application
    Filed: May 30, 2018
    Publication date: February 25, 2021
    Applicant: Toshiba Mitsubishi-Electric Industrial Systems Corporation
    Inventors: Ren ARITA, Kensuke WATANABE, Shinichi NISHIMURA
  • Patent number: 10927454
    Abstract: A method of forming a nitride film wherein (a) a silane-based gas is supplied to a processing chamber through a gas supply port; (b) a nitrogen radical gas from a radical generator is supplied to the processing chamber through a radical gas pass-through port; and (c) the silane-based gas supplied in (a) is reacted with the nitrogen radical gas supplied in (b), without causing a plasma phenomenon in the processing chamber, to form a nitride film on a wafer.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: February 23, 2021
    Assignees: Toshiba Mitsubishi-Electric Industrial Systems Corporation, Tohoku University
    Inventors: Shinichi Nishimura, Kensuke Watanabe, Yoshihito Yamada, Akinobu Teramoto, Tomoyuki Suwa, Yoshinobu Shiba
  • Patent number: 10927893
    Abstract: A sliding member includes a base substrate and a coating layer formed on the base substrate. The coating layer includes a copper alloy part derived from a plurality of precipitation hardening copper alloy particles. The copper alloy parts are bonded to each other via interfaces between the copper alloy parts. The copper alloy part contains nickel and silicon as additive elements. The copper alloy part contains 2 to 5 percent by mass of nickel. A sliding member for an internal combustion engine includes the sliding member at a sliding part of the internal combustion engine.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: February 23, 2021
    Assignees: NISSAN MOTOR CO., LTD., FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Yoshinori Izawa, Junichi Arai, Katsunori Otobe, Shinichi Nishimura
  • Patent number: 10896826
    Abstract: The method of the present invention improves quality and reliability of resin mold-type semiconductor devices. The method includes the steps of placing a lead frame such that cavities of a mold match with device formation regions of the lead frame, respectively, and forming encapsulation bodies that encapsulate semiconductor chips by flowing encapsulating resin into the cavities. The mold with an upper mold half and a lower mold half clamped together has a plurality of first gates that allow the cavities to communicate with a runner, and a dummy-cavity gate that allows a dummy cavity to communicate with the runner. During a resin molding process, from the time when the resin starts flowing into the mold to the time when the encapsulation bodies are formed, an orifice of each cavity gate is larger in size than an orifice of the dummy-cavity gate.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: January 19, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Shoji Hashizume, Shinichi Nishimura
  • Patent number: 10889896
    Abstract: With respect to a dielectric electrode, gas-jetting holes and gas-jetting holes formed in two rows along the X direction are provided as three or more gas-jetting holes along the X direction in a central region. By providing a difference in the X direction between the position where the gas-jetting hole is formed and the position where the gas-jetting hole is formed, the gas-jetting holes and the gas-jetting holes disposed in two rows are provided such that gas-jetting holes and gas-jetting holes are alternately disposed along the X direction.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: January 12, 2021
    Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
    Inventors: Shinichi Nishimura, Kensuke Watanabe, Yoshihito Yamada
  • Patent number: 10840065
    Abstract: An active gas generator that generates active gas by activating supplied material gas through discharge in a discharge space formed between a high-voltage side electrode component and a ground side electrode component of an active gas generation electrode group. A combined structure of covers completely separates the discharge space from an alternating-current voltage application space, and includes, independently from the alternating-current voltage application space, a material gas flow path for a material gas supply path, through which externally supplied material gas is guided to the discharge space. A housing contact space formed between a metal housing and each of the covers and an electrode component installation table is completely separated from the alternating-current voltage application space and the discharge space.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: November 17, 2020
    Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
    Inventors: Kensuke Watanabe, Yoshihito Yamada, Shinichi Nishimura
  • Publication number: 20200343078
    Abstract: The present invention has features (1) to (3). The feature (1) is that “an active gas generation electrode group is formed in such a manner that a ground side electrode component supports a high-voltage side electrode component”. The feature (2) is that “stepped parts are provided in a discharge space outside region of a dielectric electrode in the high-voltage side electrode component, and project downward, and by a formation height of these stepped parts, the gap length of a discharge space is defined”. The feature (3) is that “the high-voltage side electrode component and the ground side electrode component are formed to have the thickness of a discharge space formation region relatively thin and the thickness of a discharge space outside region relatively thick”.
    Type: Application
    Filed: January 10, 2018
    Publication date: October 29, 2020
    Applicant: Toshiba Mitsubishi-Electric Industrial Systems Corporation
    Inventors: Kensuke WATANABE, Shinichi NISHIMURA, Ren ARITA, Yoshihito YAMADA, Yoichiro TABATA
  • Patent number: 10793953
    Abstract: In an activated gas generation apparatus, metal electrodes are formed on a bottom surface of a dielectric electrode, and are disposed so as to face each other with a central region of the dielectric electrode interposed therebetween in plan view. The metal electrodes face each other along the Y direction. A wedge-shaped stepped part is provided so as to protrude upward in the central region on an upper surface of the dielectric electrode. The wedge-shaped stepped part is formed so as to have a shorter formation width in the Y direction as approaching each of a plurality of gas spray holes in plan view.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: October 6, 2020
    Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
    Inventors: Kensuke Watanabe, Shinichi Nishimura, Yoichiro Tabata
  • Publication number: 20200291515
    Abstract: A gas ejector of a gas supply apparatus includes a nozzle portion. The opening of a first-stage restricting cylinder constituting the nozzle portion has a circular cross-sectional shape with a diameter r1. A second-stage restricting cylinder is continuously formed with the first-stage restricting cylinder along a Z direction. The opening of the second-stage restricting cylinder has a circular cross-sectional shape with a diameter r2, and supplies a source gas supplied from the first-stage restricting cylinder to a low-vacuum processing chamber below. At this time, the diameter r2 is set to satisfy “r2>r1”.
    Type: Application
    Filed: June 1, 2020
    Publication date: September 17, 2020
    Applicant: Toshiba Mitsubishi-Electric Industrial Systems Corporation
    Inventors: Shinichi NISHIMURA, Kensuke WATANABE, Yoichiro TABATA