Abstract: An object of the invention is to provide a brake apparatus which can facilitate slope starting and slope climbing and which can be produced small in size and light in weight. In addition, another object of the invention is to provide a brake apparatus which can obtain a stable brake force under any conditions including running in the rain.

Abstract: The present invention provides a bonding wire for a semiconductor device, having a core wire and a periphery consisting of a conductive metal mainly composed of an element common to both and/or an alloy or alloys of said metal and, between the core wire and the periphery, a diffusion layer or an intermetallic compound layer composed of the elements constituting the core wire and the periphery and a bonding wire for a semiconductor device characterized by having a core wire consisting of a first conductive metal or an alloy mainly composed of the first conductive metal, a periphery consisting of a second conductive metal different from the first conductive metal of the core wire or an alloy mainly composed of the second conductive metal, and, between the core wire and the periphery, a diffusion layer or an intermetallic compound layer, and a method of producing the same.

Abstract: The present invention provides a semiconductor device, using a bonding wire for linking a semiconductor terminal to a connecting terminal for an outside circuit, capable of preventing short circuits of the bonding wires and excellent in strength and fatigue resistance of the bonding joints to cope with the downsizing of the terminals and the bonding materials, in which device the bonding wires are reinforced, partially or wholly, with a reinforcing material after bonding work and joint bulbs bonded to the terminals using bonding material are plated, and a method to produce the same.