Abstract: According to one embodiment, the imprinting apparatus of the embodiment provides an irradiation part, a pattern slippage quantity-detecting part, and a control part. The irradiation part fills the resist, which is dropped as a transfer material on the substrate to be treated, in the template pattern and cures the resist by irradiating the curing light. The pattern slippage quantity-detecting part detects the pattern slippage quantity between the substrate to be treated and the template. The control part controls the irradiation part so as to irradiate intermittently the curing light to each shot and revises the position relation between the substrate to be treated and the template so as to dissolve the pattern slippage between the substrate to be treated and the template based on the pattern slippage quantity detected during stopping of the curing light irradiation.

Abstract: According to one embodiment, a droplet dispensing control method includes detecting an amount of positional deviation between a stage on which a substrate is mounted and a template as a template positional deviation amount and detecting an amount of positional deviation between a movement direction of the stage and a nozzle array direction as a nozzle positional deviation amount. The method further includes calculating a stage movement direction correction value and an ejection timing correction value of the imprint material as correction values for eliminating the positional deviation of the landing position of the imprint material. The method further includes controlling the movement direction of the stage using the stage movement direction correction value and controlling the ejection timing of the imprint material using the ejection timing correction value.

Abstract: An imprint method, in which pattern forming is performed by having a light curable material applied on a sample face of a substrate being a processing target hardened by being exposed to light in a state where the light curable material and a pattern formed surface of a template contact each other, the pattern formed surface having a concave-convex pattern formed thereon; wherein in one exposure performed with respect to a predetermined shot of the light curable material, an exposure amount at a light curable material on a first region which contacts a pattern formed region including the concave-convex pattern of the template is greater than an exposure amount at a light curable material on a second region which at least contacts a part of a pattern periphery region of the template, the pattern periphery region existing in a periphery of the pattern formed region of the template.

Abstract: In an imprint method of an embodiment, in the imprinting of an imprint shot including an outermost peripheral region of a substrate where resist is not desired to be entered at the time of imprinting, light curing the resist is applied to a light irradiation region with a predetermined width including a boundary between the outermost peripheral region and a pattern formation region more inside than the outermost peripheral region, whereby the resist which is to enter inside the outermost peripheral region is cured. Then, light curing the resist filled in a template pattern is applied onto a template.

Abstract: A patterning method according to an embodiment of the present invention comprises: acquiring information about a surface state of an underlying film formed on a substrate; determining, based on the surface state, whether irregularity/foreign matter is present in each shot region in which a pattern is to be formed; and solidifying a resist agent while a first template, when it is determined that no irregularity/foreign matter is present in the shot region, or a second template that is different from the first template, when it is determined that irregularity/foreign matter is present in the shot region, is brought close to the underlying film on the shot region at a certain distance with the resist agent therebetween.

Abstract: An imprint method includes contacting a template on a first substrate. The template includes a pattern to be transferred on the first substrate. The first substrate includes a first semiconductor substrate, and a first light curable resin coated on the first semiconductor substrate. The method further includes separating the template from the first substrate, and removing particles adhered on the template. The particle removal includes: pressing the template on an adhesive member which is distinct from the first substrate. The adhesive member includes a dummy substrate, a particle removing film formed on the dummy substrate and configured to remove the particles, and a second light curable resin coated on the particle removing film. The second light curable resin is thicker than the first light curable resin.

Abstract: According to one embodiment, a nanoimprint method includes: performing imprinting by use of a first template, to form a pattern on a first substrate to be transferred; measuring an alignment deviation of the pattern with respect to the first substrate to be transferred; performing alignment-deviation correction based on the measured alignment deviation, to produce a third template by use of the first template; and performing imprinting by use of the third template, to form a pattern on a second substrate to be transferred.

Abstract: According to one embodiment, a droplet dispensing control method includes detecting an amount of positional deviation between a stage on which a substrate is mounted and a template as a template positional deviation amount and detecting an amount of positional deviation between a movement direction of the stage and a nozzle array direction as a nozzle positional deviation amount. The method further includes calculating a stage movement direction correction value and an ejection timing correction value of the imprint material as correction values for eliminating the positional deviation of the landing position of the imprint material. The method further includes controlling the movement direction of the stage using the stage movement direction correction value and controlling the ejection timing of the imprint material using the ejection timing correction value.

Abstract: In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.

Abstract: Certain embodiments provide an imprint recipe creating device comprising first to fifth creation units. The first creation unit creates inside-standard-shot information by use of filling amount information and residual film thickness information. The second creation unit creates first inside-substrate-surface information by use of shot position information, edge information, and the inside-standard-shot information. The third creation unit creates first correction information by use of unevenness information indicating unevenness in a substrate and unevenness distribution information indicating variations in depth of the unevenness inside the substrate surface. The fourth creation unit creates second correction information by use of post-process information indicating the variations in processing size. The fifth creation unit synthesizes the first inside-substrate-surface information, the first correction information and the second correction information, to create second inside-substrate-surface information.

Abstract: The fluorescent dye-containing particle of the present invention includes a porous matrix composed mainly of metal oxide, an organic fluorescent dye contained in the porous matrix, and a water-soluble polymer contained in the porous matrix. The fluorescent dye-containing particle can be produced by the steps of: preparing a dye-containing sol solution containing a sol solution obtained by hydrolysis of a metal compound, an organic fluorescent dye, and a water-soluble polymer; and forming a particle from the dye-containing sol solution by spray drying process.

Abstract: An imprint system has a design data storing section which stores template information and remaining film thickness set value information, a vaporization-to-be-compensated storing section which stores a plurality of distributions of applied amounts for compensating vaporization, an arithmetic section which calculates a distribution of an applied amount for filling a pattern based upon the template information, calculates a distribution of an applied amount for forming a remaining film thickness based upon the remaining film thickness set value information, calculates a pattern density of the template from the template information, extracts a distribution of an applied amount for compensating vaporization, corresponding to this pattern density, from the vaporization-to-be-compensated storing section, and adds up this extracted distribution of an applied amount for compensating vaporization, the distribution of an applied amount for filling a pattern, and the distribution of an applied amount for forming a remai

Abstract: A semiconductor device manufacturing method has forming a first resist pattern on the semiconductor substrate, and then, forming a first pattern on the semiconductor substrate by the use of the first resist pattern, and forming a second resist pattern on the semiconductor substrate by using an imprinter, and then, forming a second pattern on the semiconductor substrate by the use of the second resist pattern. The forming the first pattern, the first pattern smaller than a design pattern corresponding to the design data for forming a plurality of patterns on a semiconductor substrate being formed.

Abstract: An imprint system has a design data storing section which stores template information and remaining film thickness set value information, a vaporization-to-be-compensated storing section which stores a plurality of distributions of applied amounts for compensating vaporization, an arithmetic section which calculates a distribution of an applied amount for filling a pattern based upon said template information, calculates a distribution of an applied amount for forming a remaining film thickness based upon said remaining film thickness set value information, calculates a pattern density of the template from said template information, extracts a distribution of an applied amount for compensating vaporization, corresponding to this pattern density, from said vaporization-to-be-compensated storing section, and adds up this extracted distribution of an applied amount for compensating vaporization, said distribution of an applied amount for filling a pattern, and said distribution of an applied amount for forming a

Abstract: An imprint system has a design data storing section which stores template information and remaining film thickness set value information, a vaporization-to-be-compensated storing section which stores a plurality of distributions of applied amounts for compensating vaporization, an arithmetic section which calculates a distribution of an applied amount for filling a pattern based upon the template information, calculates a distribution of an applied amount for forming a remaining film thickness based upon said remaining film thickness set value information, calculates a pattern density of the template from the template information, extracts a distribution of an applied amount for compensating vaporization, corresponding to this pattern density, from the vaporization-to-be-compensated storing section, and adds up this extracted distribution of an applied amount for compensating vaporization, the distribution of an applied amount for filling a pattern, and the distribution of an applied amount for forming a rema

Abstract: A template formed of an optically-transparent material according to an embodiment includes a contact surface which contacts a resist material, a concave portion for resist pattern formed on the contact surface in which the resist material is filled and cured so as to form a resist pattern part, and a concave portion for alignment mark formed on the contact surface which is used for an optical alignment of the template, includes an opening and a bottom portion and has a shape that an area of the opening is larger than that of the bottom portion or a shape that a depth thereof is deeper than that of the concave portion for resist pattern.

Abstract: A patterning method according to an embodiment of the present invention comprises: acquiring information about a surface state of an underlying film formed on a substrate; determining, based on the surface state, whether irregularity/foreign matter is present in each shot region in which a pattern is to be formed; and solidifying a resist agent while a first template, when it is determined that no irregularity/foreign matter is present in the shot region, or a second template that is different from the first template, when it is determined that irregularity/foreign matter is present in the shot region, is brought close to the underlying film on the shot region at a certain distance with the resist agent therebetween.

Abstract: A template includes a substrate, an element pattern formed on a surface of the substrate, and a light absorbing portion formed on or inside the substrate.

Abstract: A semiconductor device manufacturing method has forming a first resist pattern on the semiconductor substrate, and then, forming a first pattern on the semiconductor substrate by the use of the first resist pattern, and forming a second resist pattern on the semiconductor substrate by using an imprinter, and then, forming a second pattern on the semiconductor substrate by the use of the second resist pattern. The forming the first pattern, the first pattern smaller than a design pattern corresponding to the design data for forming a plurality of patterns on a semiconductor substrate being formed.

Abstract: An imprint method includes contacting a template on a substrate, the template including a pattern to be transferred on the substrate, separating the template from the substrate, and removing particle adhered on the template before contacting the template on the substrate, the removing the particle including pressing the template on an adhesive member and separating the pressed template from the adhesive member, wherein adhesiveness of the adhesive member to the template is higher than adhesiveness of the adhesive member to the substrate.