Abstract: A variable capacitor includes a plurality of variable capacitor elements connected in parallel with one another, the variable capacitor elements each including a fixed electrode and a movable electrode facing each other, a beam supporting the movable electrode displaceably, and a drive electrode supplied with a drive voltage to change spacing between the fixed electrode and the movable electrode. The variable capacitor further includes a drive control unit configured to sequentially apply an AC drive voltage to the drive electrodes of the variable capacitor elements with a predetermined phase difference for each element. The sum of capacitances of the variable capacitor elements is an output capacitance.

Abstract: A wiper device includes pivot shafts to which wiper arms are secured, pivot holders, which rotationally support the pivot shafts, coupling shafts, and a pipe frame having cylindrical ends. The cylindrical ends of the pipe frame are coupled to the coupling shafts. The coupling shafts each include a swaging part, which is swaged to the corresponding cylindrical end, and a flat portion, which is located at part of the coupling shaft exposed from the pipe frame. The flat portions have a predetermined angle with respect to the swaging direction of the swaging and are parallel to the axis of the coupling shafts.

Abstract: Disclosed is a wireless communications device with strong realtime performance, giving rise to no latency in communications even if communications errors arise in the communication frame MAC header. MAC header information is used to determine whether or not the destination address of a received data frame is the address of a concerned wireless communications device (1). MAC header information allocated among a plurality of MAC headers is employed in selecting MAC header information without errors. If all MAC header information is in error, a majority determination processing unit (13) is used to effect a majority determination of the MAC header information and generate correct MAC header information. A received data extraction unit (14) removes the received frame header, etc., extracts the received data, and outputs same to an external device.

Abstract: An electronic component socket includes a housing having a housing portion surrounded with a side wall and a bottom wall; multiple terminals to be disposed so as to pass through the bottom wall of the housing; and a metal plate configured to form at least a portion of the bottom wall of the housing, having multiple through-holes containable with the multiple terminals; with the plurality of terminals including a contact portion contactable with an electrode of an electronic component containable with the housing, and a connection portion connectable with a round of a substrate allocatable on the opposite side of the housing of the bottom wall; and with the metal plate being embedded in the housing so that a portion thereof is exposed.

Abstract: A connection method for interconnecting end portions of a thermoplastic resin long body in which conductive unstretchable members are embedded within the thermoplastic resin along a longitudinal direction, wherein the unstretchable members in each of specific sections in the both end portions of the thermoplastic resin long body are heated using an induction heating portion so that the thermoplastic resin coating the unstretchable members is removed by melting for the unstretchable members to be exposed, after which the both end portions are interconnected while they are held in a state where the unstretchable members being exposed in the respective end portions are butt-connected to each other.

Abstract: A connection method for interconnecting end portions of a thermoplastic resin long body in which conductive unstretchable members are embedded within the thermoplastic resin along a longitudinal direction, wherein the unstretchable members in each of specific sections in the both end portions of the thermoplastic resin long body are heated using an induction heating portion so that the thermoplastic resin coating the unstretchable members is removed by melting for the unstretchable members to be exposed, after which the both end portions are interconnected while they are held in a state where the unstretchable members being exposed in the respective end portions are butt-connected to each other.

Abstract: A multilayer ceramic circuit board includes ceramic wiring layers which are stacked together, one or two or more lifting layers which have a planar shape and which are disposed as an inner layer inside the stacked ceramic wiring layers or as a lower layer lower than a bottom ceramic wiring layer, and a protruding portion formed on a surface of a top ceramic wiring layer due to the disposition of the one or two or more lifting layers. The protruding portion smoothly protrudes and has a large area and high flatness. The multilayer ceramic circuit board is formed by disposing lifting layers as an inner layer of a plurality green sheets or as a lower layer lower than a bottom green sheet, and firing under pressure the resulting laminate in a state constrained by an elastic constraining sheet and a rigid constraining sheet.

Abstract: A high expansion foam fire-extinguishing system including: an emission nozzle (9) to which a foam solution (Wg) prepared by mixing water (W) with a foam concentrate (16) containing a surface active agent (18) is sent under pressure; a flow passage (2); and a foam screen (7) upon which the foam solution discharged from the emission nozzle impinges. The foam concentrate used is one of one in which a mixing ratio of the foam concentrate with respect to the foam solution is an adjusted mixing ratio higher than a standard mixing ratio and one in which a content rate of the surface active agent with respect to the foam concentrate is a design content rate that is higher than a standard content rate, and in which a mixing ratio of the surface active agent is a concentration for design foam expansion ratio.

Abstract: A probe card includes a base wiring layer, a rewiring layer, and a contactor. The base wiring layer has a non-contactor area and a contactor area that projects to a higher level than the non-contactor area. The rewiring layer is formed on a surface of the base wiring layer so that the contactor area is higher than the non-contactor area. The contactor is provided on a surface of the rewiring layer in a contactor area thereof.

Abstract: A connection method for interconnecting end portions of a thermoplastic resin long body in which conductive unstretchable members are embedded within the thermoplastic resin along a longitudinal direction, wherein the unstretchable members in each of specific sections in the both end portions of the thermoplastic resin long body are heated using an induction heating portion so that the thermoplastic resin coating the unstretchable members is removed by melting for the unstretchable members to be exposed, after which the both end portions are interconnected while they are held in a state where the unstretchable members being exposed in the respective end portions are butt-connected to each other.

Abstract: In order to prevent foaming ratio from being degraded, there is provided a high expansion foam fire-extinguishing system (B) including: a foam generator body (1) formed to a tubular shape; a foam forming screen (2) arranged at a distal end (1a) side of the foam generator body (1); an emission nozzle (3) arranged at a back end (1b) side of an interior of the foam generator body, for radiating a foam solution (W) in an emission pattern (WP) that spreads in a conical shape towards the foam forming screen (2); and an intermediate screen (4) arranged between the foam forming screen (2) and the emission nozzle (3), in which the intermediate screen (4) is arranged in a liquid droplet speed regulating region from a landing position (P0) at which an outer periphery of the emission pattern (WP) hits an inner wall (1f) of the foam generator body to a limit position (P1) at which liquid droplets can pass through a mesh of the intermediate screen (4).

Abstract: A method according to the present invention for producing a semiconductor-chip-mounting circuit 1 includes mainly three steps. In a first step, contacts 2 each in the form of a conical helix are formed by solder-plating the surface of connecting terminals 12 on a mounting circuit 10. In a second step, a continuity test is performed by pressing bumps 21 against the contacts 2. In a final third step, the contacts 2 pressed are melted to connect the connecting terminals 12 to the bumps 21. That is, the semiconductor chip 20 is connected to the mounting circuit 10 while maintaining a state in which they pass the continuity test, thereby significantly reducing the occurrence of defective continuity in the semiconductor-chip-mounting circuit 1.

Abstract: A glass substrate has a pair of main surfaces opposite to each other. Two island-shaped portions made of silicon are buried in the glass substrate. The two island-shaped portions are exposed from the two main surfaces of the glass substrate, respectively. An electrode is formed on one main surface of the glass substrate so as to be electrically connected to one exposed portion of one island-shaped portion, and another electrode is formed thereon so as to be electrically connected to one exposed portion of the other island-shaped portion. Still another electrode is formed on the other main surface of the glass substrate so as to be electrically connected to the other exposed portion of the one island-shaped portion. A silicon substrate having a pressure sensing diaphragm is bonded to the other main surface of the glass substrate.

Abstract: A Contact according to an aspect of the present invention is formed by laminating a shape memory alloy film on a surface of a metal spring film, and the shape thereof is a conical spiral. A manufacturing method therefor is composed of 11 steps including a step of preparing a sacrificial metal film, a step of forming a resist cone, a step of patterning a resist film, a step of preparing a shape memory alloy film, and the like. Since an organic resist material has poor heat resistance, the sacrificial metal film is formed in advance, the resist is removed before sputtering of the shape memory alloy film, the sacrificial metal film is removed after sputtering of a shape memory alloy and a heat treatment, which are performed at high temperatures, so as to lift off an excess shape memory alloy film.

Abstract: A variable capacitance element of the invention includes: a columnar vibrator formed inside a cylindrical hole of a supporting wall; a first circular driving electrode disposed above the columnar vibrator; a first circular capacitive electrode disposed in the middle of the columnar vibrator; a second circular driving electrode disposed on the periphery of the cylindrical hole of the supporting wall; and a second circular capacitive electrode disposed on an inner side surface of the supporting wall. An electrostatic force is increased or decreased sequentially in the circumferential direction of the second driving electrode that is divided into four parts by sequentially increasing or decreasing the driving voltage in the circumferential direction of the second driving electrode. As a result, the columnar vibrator is rotated to change the electrostatic capacitance between the first capacitive electrode and the second capacitive electrode.

Abstract: A multilayer ceramic circuit board includes ceramic wiring layers which are stacked together, one or two or more lifting layers which have a planar shape and which are disposed as an inner layer inside the stacked ceramic wiring layers or as a lower layer lower than a bottom ceramic wiring layer, and a protruding portion formed on a surface of a top ceramic wiring layer due to the disposition of the one or two or more lifting layers. The protruding portion smoothly protrudes and has a large area and high flatness. The multilayer ceramic circuit board is formed by disposing lifting layers as an inner layer of a plurality green sheets or as a lower layer lower than a bottom green sheet, and firing under pressure the resulting laminate in a state constrained by an elastic constraining sheet and a rigid constraining sheet.

Abstract: A probe card includes a flat plate-shaped wiring board, a columnar base portion, and a thee-dimensional spiral contactor. The base portion is interposed between a wiring pattern of the wiring board and the bottom of the contactor.

Abstract: A contact of the invention includes a spring portion and a conductive portion. The spring portion is formed on the surface of a wiring substrate of a probe card, using ceramic. The conductive portion is formed thinly so as to cover at least the surface of the spring portion that faces the bump. Thus, as one of the features of a manufacturing method of the contact, the spring portion is formed at room temperature by an aerosol deposition method.

Abstract: There is provided a structure for mounting a semiconductor part having improved productivity, in which a bump is detached from a land portion and a method of manufacturing a mounting substrate used therein. The structure for mounting the semiconductor part includes a mounting substrate 1 having an insulating substrate 2 on which a wiring pattern 3 and a land portion 4 are provided, a semiconductor part 5 mounted on the mounting substrate 1 using a bump 7 and the land portion 4, and an underfill 8 inserted between the semiconductor part 5 and the insulating substrate 2. An undercut portion 4c having an inverse tapered shape from the insulating substrate 2 to an upper surface of the land portion 4 is provided in an edge 4a of the land portion 4 in which the bump 7 is located, and the bump is inserted into the undercut portion. Accordingly, since the couple between the bump 7 and the land portion 4 becomes stronger, the bump is not detached from the land portion 4 when the underfill 8 expands or contracts.

Abstract: Provided is a wiring portion capable of suppressing diffusion from occurring in a wiring portion or between the wiring portion and a substrate. In the wiring substrate, a first high melting point metal portion 18 having a melting point higher than Au and Ag is provided between an Au wiring portion 15 and an Ag wiring portion 17. The higher the melting point of the first high melting point metal portion 18, the lower a coefficient thereof, that is, the harder diffusion occurs. In addition, the first high melting point metal portion 19 functions as a barrier material which adequately suppresses Ag from being diffused from the Ag wiring portion 17. By providing the first high melting point metal portion 18 between the Au wiring portion 15 and the Ag wiring portion 17, it is possible to more efficiently suppress Ag from diffusion, in comparison with a case where the Ag wiring portion and the Au wiring portion are in contact with each other.