Abstract: A probe card includes a base wiring layer, a rewiring layer, and a contactor. The base wiring layer has a non-contactor area and a contactor area that projects to a higher level than the non-contactor area. The rewiring layer is formed on a surface of the base wiring layer so that the contactor area is higher than the non-contactor area. The contactor is provided on a surface of the rewiring layer in a contactor area thereof.

Abstract: The present invention provides a high expansion foam fire-extinguishing system including: an emission nozzle (9) to which a foam solution (Wg) prepared by mixing water (W) with a foam concentrate (16) containing a surface active agent (18) is sent under pressure; a flow passage (2); and a foam screen (7) upon which the foam solution discharged from the emission nozzle impinges, in which the foam concentrate used is one of one in which a mixing ratio of the foam concentrate with respect to the foam solution is an adjusted mixing ratio higher than a standard mixing ratio and one in which a content rate of the surface active agent with respect to the foam concentrate is a design content rate that is higher than a standard content rate, and in which a mixing ratio of the surface active agent is a concentration for design foam expansion ratio.

Abstract: A variable capacitance element of the invention includes: a columnar vibrator formed inside a cylindrical hole of a supporting wall; a first circular driving electrode disposed above the columnar vibrator; a first circular capacitive electrode disposed in the middle of the columnar vibrator; a second circular driving electrode disposed on the periphery of the cylindrical hole of the supporting wall; and a second circular capacitive electrode disposed on an inner side surface of the supporting wall. An electrostatic force is increased or decreased sequentially in the circumferential direction of the second driving electrode that is divided into four parts by sequentially increasing or decreasing the driving voltage in the circumferential direction of the second driving electrode. As a result, the columnar vibrator is rotated to change the electrostatic capacitance between the first capacitive electrode and the second capacitive electrode.

Abstract: A method according to the present invention for producing a semiconductor-chip-mounting circuit 1 includes mainly three steps. In a first step, contacts 2 each in the form of a conical helix are formed by solder-plating the surface of connecting terminals 12 on a mounting circuit 10. In a second step, a continuity test is performed by pressing bumps 21 against the contacts 2. In a final third step, the contacts 2 pressed are melted to connect the connecting terminals 12 to the bumps 21. That is, the semiconductor chip 20 is connected to the mounting circuit 10 while maintaining a state in which they pass the continuity test, thereby significantly reducing the occurrence of defective continuity in the semiconductor-chip-mounting circuit 1.

Abstract: A Contact according to an aspect of the present invention is formed by laminating a shape memory alloy film on a surface of a metal spring film, and the shape thereof is a conical spiral. A manufacturing method therefor is composed of 11 steps including a step of preparing a sacrificial metal film, a step of forming a resist cone, a step of patterning a resist film, a step of preparing a shape memory alloy film, and the like. Since an organic resist material has poor heat resistance, the sacrificial metal film is formed in advance, the resist is removed before sputtering of the shape memory alloy film, the sacrificial metal film is removed after sputtering of a shape memory alloy and a heat treatment, which are performed at high temperatures, so as to lift off an excess shape memory alloy film.

Abstract: A glass substrate has a pair of main surfaces opposite to each other. Two island-shaped portions made of silicon are buried in the glass substrate. The tow island-shaped portions are exposed from the two main surfaces of the glass substrate, respectively. An electrode is formed on one main surface of the glass substrate so as to be electrically connected to one exposed portion of one island-shaped portion, and another electrode is formed thereon so as to be electrically connected to one exposed portion of the other island-shaped portion. Still another electrode is formed on the other main surface of the glass substrate so as to be electrically connected to the other exposed portion of the one island-shaped portion. A silicon substrate having a pressure sensing diaphragm is bonded to the other main surface of the glass substrate.

Abstract: A wiring board in which silver is deposited near a via-conductor includes a ceramic substrate having a via-hole, a via-conductor disposed in the via-hole, and a metal thin-film pattern which is disposed on the ceramic substrate such that the metal thin-film pattern is connected to the via-conductor. The via-conductor contains silver or a material principally containing silver. A silver deposit that is a piece of the via-conductor is disposed on a surface portion of the ceramic substrate that is located near the via-hole. A catalyst layer containing a metal material is disposed over an exposed face of the via-conductor and the surface portion of the ceramic substrate. A metal layer is disposed on the catalyst layer. The metal thin-film pattern is disposed over the metal layer and the ceramic substrate.

Abstract: Provided is a wiring portion capable of suppressing diffusion from occurring in a wiring portion or between the wiring portion and a substrate. In the wiring substrate, a first high melting point metal portion 18 having a melting point higher than Au and Ag is provided between an Au wiring portion 15 and an Ag wiring portion 17. The higher the melting point of the first high melting point metal portion 18, the lower a coefficient thereof, that is, the harder diffusion occurs. In addition, the first high melting point metal portion 19 functions as a barrier material which adequately suppresses Ag from being diffused from the Ag wiring portion 17. By providing the first high melting point metal portion 18 between the Au wiring portion 15 and the Ag wiring portion 17, it is possible to more efficiently suppress Ag from diffusion, in comparison with a case where the Ag wiring portion and the Au wiring portion are in contact with each other.

Abstract: There is provided a structure for mounting a semiconductor part having improved productivity, in which a bump is detached from a land portion and a method of manufacturing a mounting substrate used therein. The structure for mounting the semiconductor part includes a mounting substrate 1 having an insulating substrate 2 on which a wiring pattern 3 and a land portion 4 are provided, a semiconductor part 5 mounted on the mounting substrate 1 using a bump 7 and the land portion 4, and an underfill 8 inserted between the semiconductor part 5 and the insulating substrate 2. An undercut portion 4c having an inverse tapered shape from the insulating substrate 2 to an upper surface of the land portion 4 is provided in an edge 4a of the land portion 4 in which the bump 7 is located, and the bump is inserted into the undercut portion. Accordingly, since the couple between the bump 7 and the land portion 4 becomes stronger, the bump is not detached from the land portion 4 when the underfill 8 expands or contracts.

Abstract: An image-editing service system comprises a server, a user terminal, an administrator terminal, a worker terminal, and the server including a database for storing the image information sent from worker terminal, a first image generating section for generating a first image based on the image information stored in the database, a display section for displaying an image display frame so as to display the first image in a display window of the user terminal and displaying a window information so as to display a display condition of the first image which is allowed to be input, a second image generating section for generating a second image regard to the first image based on the display condition inputted by the user terminal and, a window information generating section for displaying the first image and the second image simultaneously.

Abstract: A connection terminal structure of a wiring board according to the invention includes a second terminal area portion that is made of a metallic material having poor solder wettability and is formed on a first terminal area portion, and a third terminal area portion for soldering-connection that is made of a noble metal having excellent solder wettability and is formed on the second terminal area portion. Accordingly, since the third terminal area portion for soldering-connection, made of a noble metal, is formed on the second terminal area portion, which is an unsoldering surface, the third terminal area portion firmly adheres to the second terminal area portion serving as an unsoldering surface. Therefore, the third terminal area portion is not peeled off, and the third terminal area portion made of a noble metal has excellent solderability. For this reason, since preliminary soldering is not required, it is possible to obtain a connection terminal structure of a wiring board having excellent productivity.

Abstract: A glass substrate has a pair of main surfaces opposite to each other. Two island-shaped portions made of silicon are buried in the glass substrate. The tow island-shaped portions are exposed from the two main surfaces of the glass substrate, respectively. An electrode is formed on one main surface of the glass substrate so as to be electrically connected to one exposed portion of one island-shaped portion, and another electrode is formed thereon so as to be electrically connected to one exposed portion of the other island-shaped portion. Still another electrode is formed on the other main surface of the glass substrate so as to be electrically connected to the other exposed portion of the one island-shaped portion. A silicon substrate having a pressure sensing diaphragm is bonded to the other main surface of the glass substrate.

Abstract: A design ordering system including a user terminal which is connected to a network and is for ordering designs; an order server which is connected to the network and is for managing receipt of the design orders; an order manager terminal which is connected to the network, and is for placing orders for the design creation work based on the design order; a worker terminal which is connected to the network and is for creating designs based on the orders placed for the design creation work; a corrector terminal for correcting the created design, wherein the order server has a common screen which is accessible from the user terminal; the order manager terminal; the worker terminal and the corrector terminal.

Abstract: The information input device comprises: a design template having template information which can be changed by at least input information; and information input section for inputting template information; and an information processing section for processing the input information that is input by the information input section in accordance with the template information.

Abstract: A recording apparatus can mount a special recording material, such as a compact disc (CD) or the like, in a state of being accommodated in a tray and perform recording on the special recording material. In this recording apparatus, by an operation of mounting a tray guide into the main body of the recording apparatus, an arm of the tray guide is inserted between a spur base for holding a spur, and a platen for holding sheet discharge rollers. The spur base thereby raises to separate the spur from the sheet discharge roller, and a space to allow passage of the tray is formed.

Abstract: An order-receiving system comprising: a network; a user terminal which is connected to the network and is for inputting design determining information, uploading images for use in a design, and ordering the design; an order manager terminal which is connected to the network, and is for receiving the design orders, ordering design creation work based on the design orders and for doing order management via the order server, and which includes a design distribution screen for distributing images for use in the design, or design order work to workers; and a worker terminal which is connected to the network and is for creating the design based on the order placed for the design creation work, and e-mails are issued, and by including order progress information in the title of the issued e-mails, the e-mail title can be extracted or sorted by order progress information.

Abstract: A recording apparatus can mount a special recording material, such as a compact disc (CD) or the like, in a state of being accommodated in a tray and perform recording on the special recording material. In this recording apparatus, by an operation of mounting a tray guide into the main body of the recording apparatus, an arm of the tray guide is inserted between a spur base for holding a spur, and a platen for holding sheet discharge rollers. The spur base thereby raises to separate the spur from the sheet discharge roller, and a space to allow passage of the tray is formed.

Abstract: In order to provide an electronic circuit board capable of preventing the breakdown voltage of a capacitor element from dropping and excellent in high frequency performance, a positive type photoresist is spin-coated over the surface of an alumina substrate and is exposed to light and developed to form an insulating layer partially, followed by formation of a capacitor element by successively stacking a lower electrode, a dielectric layer and an upper electrode over this insulating layer, further followed by formation of a resistance element, an inductor element and a transmission line, each in a filmy state, over the surface of the alumina substrate.

Abstract: The invention provides a gyroscope that brings about the miniaturization of a device, improvement of detection sensitivity, and reduction of driving voltage. A gyroscope of the present invention is provided with a tuning fork formed of conductive material having a plurality of legs and a support, a top glass substrate and a bottom glass substrate for holding the tuning fork in-between, a plurality of driving electrodes for driving the plurality of legs in capacitance coupling with the legs, and a plurality of detecting electrodes, each detecting electrode is disposed so as to face to the end face of each leg in the extending direction correspondingly to each leg.

Abstract: In order to provide an electronic circuit board capable of preventing the breakdown voltage of a capacitor element from dropping and excellent in high frequency performance, a positive type photoresist is spin-coated over the surface of an alumina substrate and is exposed to light and developed to form an insulating layer partially, followed by formation of a capacitor element by successively stacking a lower electrode, a dielectric layer and an upper electrode over this insulating layer, further followed by formation of a resistance element, an inductor element and a transmission line, each in a filmy state, over the surface of the alumina substrate.