Patents by Inventor Shinji Tanaka
Shinji Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230291158Abstract: It is aimed to reduce a projection area of a board-side connector on a mounting surface of a circuit board. A connector device (A) is provided with a board-side connector (10), a mating connector (30) facing the board-side connector (10), an adapter (40) rockably supported in the mating connector (30), a tip part of the adapter being connected to the board-side connector (10), a first guide portion (12) and a second guide portion (21) provided on a tip part of the board-side connector (10) and having outer peripheral surfaces inclined to reduce a diameter toward a tip side, and a guided portion (50) provided on the tip part of the adapter (40) and configured to correct a position shift of the adapter (40) with respect to the board-side connector (10) by sliding in contact with the first and second guide portions (12, 21).Type: ApplicationFiled: July 16, 2021Publication date: September 14, 2023Inventors: Shinji TANAKA, Yutaka KOBAYASHI
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Publication number: 20230291148Abstract: It is aimed for miniaturization. A connector device is provided with a first connector (10), a second connector (40) provided to face the first connector (10), an adapter (20) for connecting the first and second connectors (10, 40), resilient holding portions (14) formed in the first connector (10), having a shape retention force capable of holding the adapter (20) in a fixed posture with respect to the first connector (10) and being resiliently deformable, and a first guide portion (42) and second guide portions (47) for absorbing position shifts of the first and second connectors (10, 40) by inclining the adapter (20) with respect to the first connector (10) while resiliently deforming the resilient holding portions (14).Type: ApplicationFiled: July 16, 2021Publication date: September 14, 2023Inventors: Shinji TANAKA, Yutaka KOBAYASHI
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Publication number: 20230291149Abstract: It is aimed for miniaturization. A connector device is provided with a first connector, a second connector provided to face the first connector, an adapter for connecting the first and second connectors, posture holding portions provided on the first connector and the adapter and configured to hold the adapter in a constant posture with respect to the first connector by coming into contact with each other, a resilient holding portion provided on the adapter and configured to hold the first posture holding portion of the first connector and the movable posture holding portion of the adapter in a state in contact with each other by a resilient force, and a first guide portion and a second guide portion for correcting position shifts of the second connector and the adapter by inclining the adapter while resiliently deforming the resilient holding portion.Type: ApplicationFiled: July 16, 2021Publication date: September 14, 2023Inventors: Shinji TANAKA, Yutaka KOBAYASHI
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Publication number: 20230282273Abstract: In the semiconductor device according to an embodiment, a memory cell is controlled such that, for the part whose output value can be fixed based on the value stored in the memory cell without performing the information processing, the operation processing is stopped so as to stop the charging and discharging to and from the data line, and for the part whose output value needs to be fixed by performing the information processing, the information processing accompanied by charging and discharging to and from the data line is appropriately performed.Type: ApplicationFiled: February 15, 2023Publication date: September 7, 2023Inventors: Shinji TANAKA, Daiki KITAGATA
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Publication number: 20230272870Abstract: A resin tube connection device includes a resin tube, a resin expanding portion and a metal sleeve. The resin expanding portion has a sealing surface being able to come into contact with a contact surface. Further, the resin expanding portion has a second flow path that communicates with a first flow path of the resin tube and opens in the sealing surface. The sealing surface projects farther than an end surface of the metal sleeve in an axial direction. The maximum length of a contact region where the resin expanding portion and the metal sleeve come into contact with each other in the axial direction in an outer surface is larger than the thickness of a resin layer in a radial direction.Type: ApplicationFiled: March 2, 2021Publication date: August 31, 2023Inventors: Kenichi YASUNAGA, Shinji TANAKA, Jun YANAGIBAYASHI, Ryo HOSONO
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Publication number: 20230253042Abstract: A semiconductor device includes a memory array having a plurality of associative memory cells arranged in a matrix form for storing entries. The memory array is divided into a plurality of memory blocks for sequentially performing a retrieval operation along a column direction, and further includes a plurality of match lines corresponding to the respective memory blocks and provided correspondingly to each memory cell row, a plurality of search lines corresponding to the respective memory blocks and provided correspondingly to each memory cell column, and a plurality of match amplifiers corresponding to the respective memory blocks and provided to the plurality of match lines. The match line provided correspondingly to the preceding memory block is set to become shorter than the match line provided correspondingly to the subsequent memory block.Type: ApplicationFiled: February 2, 2023Publication date: August 10, 2023Inventors: Shinji TANAKA, Yohei SAWADA, Masao MORIMOTO
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Publication number: 20230187688Abstract: Provided is a method of producing a solid electrolyte having high ionic conductivity using a liquid phase method, including a first step of mixing two or more compounds satisfying (1) and a complexing agent 1 satisfying (2), and a second step of further mixing in a complexing agent 2 satisfying (3) after the first step. (1) A compound containing one or more selected from a group consisting of a lithium element, a sulfur element, a phosphorus element and a halogen element. (2) A complexing agent capable of forming a complex containing Li3PS4 and a halogen element. (3) A complexing agent other than the complexing agent 1, capable of forming a complex containing Li3PS4.Type: ApplicationFiled: May 12, 2021Publication date: June 15, 2023Applicant: IDEMITSU KOSAN CO..LTD.Inventors: Hiroaki YAMADA, Yusuke lSEKl, Fumio YAMAKAWA, Masao AIDA, Shinji TANAKA
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Patent number: 11676681Abstract: A semiconductor device including an SRAM capable of sensing a defective memory cell that does not satisfy desired characteristics is provided. The semiconductor device includes a memory cell, a bit line pair being coupled to the memory cell and having a voltage changed towards a power-supply voltage and a ground voltage in accordance with data of the memory cell in a read mode, and a specifying circuit for specifying a bit line out of the bit line pair. In the semiconductor device, a wiring capacitance is coupled to the bit line specified by the specifying circuit and a voltage of the specified bit line is set to a voltage between a power voltage and a ground voltage in a test mode.Type: GrantFiled: July 22, 2021Date of Patent: June 13, 2023Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Shinji Tanaka, Yuichiro Ishii, Makoto Yabuuchi
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Publication number: 20230136988Abstract: An object of the present invention is to provide a compound having an anti-inflammatory activity or a pharmacologically acceptable salt thereof. The solution of the present invention is a compound of general formula (1) or a pharmacologically acceptable salt thereof. wherein the symbols in the formula are defined below: R1: e.g., a C1-C6 alkyl group; R2: a C1-C6 alkyl group; A: e.g., an oxygen atom; and R3: e.g., a C1-C6 alkyl group.Type: ApplicationFiled: October 13, 2022Publication date: May 4, 2023Applicant: Daiichi Sankyo Company, LimitedInventors: Keiji Saito, Katsuyoshi Nakajima, Toru Taniguchi, Osamu Iwamoto, Satoshi Shibuya, Yasuyuki Ogawa, Kazumasa Aoki, Nobuya Kurikawa, Shinji Tanaka, Momoko Ogitani, Eriko Kioi, Kaori Ito, Natsumi Nishihama, Tsuyoshi Mikkaichi, Wataru Saitoh
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Publication number: 20230134481Abstract: A connector is provided with a first housing (10), a second housing (20) connectable to the first housing (10), a guide functional unit (45) for enabling the first and second housings (10, 20) to approach/separate from each other in a relatively unrotatable state, a rotary member (30) for surrounding the first and second housings (10, 20), the rotary member being rotatable about an axis parallel to a connecting direction of the first and second housings (10, 20), and a cam functional unit (46) for causing the first and second housings (10, 20) to approach each other as the rotary member (30) is relatively rotated with respect to the first and second housings (10, 20).Type: ApplicationFiled: February 26, 2021Publication date: May 4, 2023Inventors: Shinji TANAKA, Shinji NOZAKI
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Publication number: 20230084143Abstract: The present invention provides a surface treatment method that improves antimicrobial activity of copper or a copper alloy and enhances immediate effects of antimicrobial actions on the surface of the copper or the copper alloy. A surface treatment method for copper or a copper alloy according to the present invention comprises preparing a reducing agent solution containing a biological reducing substance, and treating the surface of the copper or the copper alloy with the reducing agent solution. The present invention also provides a surface treatment liquid for sterilizing copper or a copper alloy, in which the surface treatment liquid contains a biological reducing substance. The present invention also provides a sterilization method that comprises bringing copper or a copper alloy treated by the surface treatment method into contact with a surface of an object to sterilize the surface of the object.Type: ApplicationFiled: November 18, 2022Publication date: March 16, 2023Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCEInventors: Akiko YAMAMOTO, Keiichiro OISHI, Shinji TANAKA
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Publication number: 20230058950Abstract: An object of the present invention is to provide a compound that has a specific chemical structure having an activation effect on SIRT6 and is useful as an active component for preventing and treating inflammatory diseases, and the present invention relates to a compound represented by Formula (1) or a pharmaceutically acceptable salt thereof, where each symbol in Formula (1) has the same definition as that described in the specification.Type: ApplicationFiled: January 23, 2020Publication date: February 23, 2023Applicant: DAIICHI SANKYO COMPANY, LIMITEDInventors: Junya KAWAI, Osamu IWAMOTO, Yuma UMEZAKI, Katsuyoshi NAKAJIMA, Hiroyuki TSURUOKA, Keiji SAITO, Nobuya KURIKAWA, Natsumi NISHIHAMA, Shinji TANAKA, Momoko OGITANI, Tomohiro HONDA, Wataru SAITOH, Tsuyoshi SONEDA, Nobuyuki OHKAWA
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Publication number: 20230045630Abstract: An imaging device includes pixels. Each of the pixels includes a first electrode, a second electrode, a photoelectric conversion layer that is located between the first electrode and the second electrode, that contains a donor semiconductor material and an acceptor semiconductor material, and that generates a pair of an electron and a hole, a first charge blocking layer located between the first electrode and the photoelectric conversion layer, a second charge blocking layer located between the second electrode and the photoelectric conversion layer, and a charge storage region that is electrically connected to the second electrode and that stores the hole. The difference between the electron affinity of the acceptor semiconductor material and the electron affinity of the first charge blocking layer is larger than the difference between the ionization potential of the donor semiconductor material and the ionization potential of the second charge blocking layer.Type: ApplicationFiled: October 7, 2022Publication date: February 9, 2023Inventors: HIROAKI IIJIMA, YUKO KISHIMOTO, MASAYA HIRADE, SHINJI TANAKA
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Publication number: 20230023447Abstract: A connector is provided with a housing into which a terminal fitting is inserted, and a retainer to be mounted into the housing. The retainer includes a rear stop portion for restricting a rearward movement of the terminal fitting and a front stop portion for restricting a forward movement of the terminal fitting.Type: ApplicationFiled: November 11, 2020Publication date: January 26, 2023Inventors: Tetsuya MIYAMURA, Yutaka KOBAYASHI, Daisuke SAITO, Masanori MORIYASU, Shinji TANAKA
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Publication number: 20230014356Abstract: A connector is provided with a housing, a circuit board to be arranged along a width direction in a board insertion portion of the housing, and a connecting member to be arranged in the housing and including a contact point portion to be connected to a conductive portion of the circuit board. The connecting member is configured to be swingable in the width direction.Type: ApplicationFiled: November 11, 2020Publication date: January 19, 2023Inventors: Tetsuya MIYAMURA, Yutaka KOBAYASHI, Daisuke SAITO, Masanori MORIYASU, Shinji TANAKA
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Publication number: 20230006383Abstract: A card edge connector includes: a housing including a board accommodation space and a connection terminal including a resilient contact piece configured to contact a circuit board inserted into the board accommodation space, the connection terminal being mounted into the housing. The connection terminal is movable between a connection position where the resilient contact piece is in contact with a surface of the circuit board and a retraction position where the resilient contact piece is separated from the circuit board. A first interference preventing portion and a second interference preventing portion are formed between a moving path of the resilient contact piece and the board accommodation space. The first interference preventing portion and the second interference preventing portion restrict the interference of the resilient contact piece and an inserting end part of the circuit board inserted into the board accommodation space in a moving process of the connection terminal.Type: ApplicationFiled: November 11, 2020Publication date: January 5, 2023Inventors: Tetsuya MIYAMURA, Yutaka KOBAYASHI, Daisuke SAITO, Masanori MORIYASU, Shinji TANAKA
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Publication number: 20220416456Abstract: It is aimed to prevent a reduction in connection reliability. A terminal fitting is to be mounted into a housing having a board accommodation space and is provided with a connection terminal including a resilient contact piece to be brought into contact with a circuit board inserted into the board accommodation space and a protection terminal separate from the connection terminal and attached to the connection terminal. The connection terminal is movable with respect to the protection terminal between a protection position where the resilient contact piece is accommodated in the protection terminal and a connection position where the resilient contact piece is exposed to outside of the protection terminal to be contactable with the circuit board.Type: ApplicationFiled: November 11, 2020Publication date: December 29, 2022Inventors: Tetsuya MIYAMURA, Yutaka KOBAYASHI, Daisuke SAITO, Masanori MORIYASU, Shinji TANAKA
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Patent number: 11535939Abstract: The present invention provides a surface treatment method that improves antimicrobial activity of copper or a copper alloy and enhances immediate effects of antimicrobial actions on the surface of the copper or the copper alloy. A surface treatment method for copper or a copper alloy according to the present invention comprises preparing a reducing agent solution containing a biological reducing substance, and treating the surface of the copper or the copper alloy with the reducing agent solution. The present invention also provides a surface treatment liquid for sterilizing copper or a copper alloy, in which the surface treatment liquid contains a biological reducing substance. The present invention also provides a sterilization method that comprises bringing copper or a copper alloy treated by the surface treatment method into contact with a surface of an object to sterilize the surface of the object.Type: GrantFiled: May 30, 2018Date of Patent: December 27, 2022Assignee: NATIONAL INSTITUTE FOR MATERIALS SCIENCEInventors: Akiko Yamamoto, Keiichiro Oishi, Shinji Tanaka
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Publication number: 20220356964Abstract: A bioinert pipe includes a flow path inside, an inner wall of the flow path is composed of a resin tube and an outer peripheral surface of the resin tube is covered with a metal tube. The bioinert pipe includes an end portion extension member attached to an end portion of the metal tube, and the end portion extension member is made from a material harder than the resin tube and has a first surface and a second surface. The first surface is facing and in contact with an end surface of the metal tube and the second surface is directed opposite to the first surface. a through hole having an inner diameter substantially the same as an inner diameter of the metal tube is provided so as to pass from the first surface to the second surface in the end portion extension member. An edge of the through hole on the second surface of the end portion extension member has a chamfered shape, and the resin tube is inserted into the through hole.Type: ApplicationFiled: April 21, 2022Publication date: November 10, 2022Inventors: Jun YANAGIBAYASHI, Shinji TANAKA, Ryo HOSONO, Kenichi YASUNAGA
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Patent number: 11472784Abstract: An object of the present invention is to provide a compound having an anti-inflammatory activity or a pharmacologically acceptable salt thereof. The solution of the present invention is a compound of general formula (1) or a pharmacologically acceptable salt thereof. wherein the symbols in the formula are defined below: R1: e.g., a C1-C6 alkyl group; R2: a C1-C6 alkyl group; A: e.g., an oxygen atom; and R3: e.g., a C1-C6 alkyl group.Type: GrantFiled: March 25, 2021Date of Patent: October 18, 2022Assignee: Daiichi Sankyo Company, LimitedInventors: Keiji Saito, Katsuyoshi Nakajima, Toru Taniguchi, Osamu Iwamoto, Satoshi Shibuya, Yasuyuki Ogawa, Kazumasa Aoki, Nobuya Kurikawa, Shinji Tanaka, Momoko Ogitani, Eriko Kioi, Kaori Ito, Natsumi Nishihama, Tsuyoshi Mikkaichi, Wataru Saitoh