Patents by Inventor Shinpei Watanabe
Shinpei Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10348183Abstract: A semiconductor device includes a plurality of H-bridge circuits and a logic circuit which is commonly used for the plurality of H-bridge circuits. The logic circuit controls driving of each of the plurality of H-bridge circuits on the basis of signals which are input thereinto in such a manner that a combination of respective driving states of the plurality of H-bridge circuits meets a predetermined condition.Type: GrantFiled: February 21, 2018Date of Patent: July 9, 2019Assignee: RENESAS ELECTRONICS CORPORATIONInventor: Shinpei Watanabe
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Patent number: 10224969Abstract: The transmitter circuit according to one embodiment includes a pulse generating circuit generating a pulse signal based on edges of input data, a first output driver outputting, based on the pulse signal, a first output pulse signal according to one of the edges to a first end of an external insulating coupling element, a second output driver outputting, based on the pulse signal, a second output pulse signal according to other one of the edges to a second end of the insulating coupling element, and an output stop circuit stopping the first and second output pulse signals from being output for a prescribed period from when a power supply voltage is turned on.Type: GrantFiled: October 9, 2017Date of Patent: March 5, 2019Assignee: Renesas Electronics CorporationInventors: Koichi Takeda, Hirokazu Nagase, Shinpei Watanabe
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Patent number: 10115684Abstract: A semiconductor device includes a first semiconductor chip including a first plurality of wiring layers, and a first coil, a first bonding pad, and first dummy wires formed in an uppermost layer of the first plurality of the wiring layers, and a second semiconductor chip including a second plurality of wiring layers, a second coil, a second bonding pad, and second dummy wires formed in an uppermost layer of the second plurality of the wiring layers. The first semiconductor chip and the second semiconductor chip face each other via an insulation sheet. The first coil and the second coil are magnetically coupled with each other.Type: GrantFiled: February 3, 2017Date of Patent: October 30, 2018Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Shinpei Watanabe, Shinichi Uchida, Tadashi Maeda, Kazuo Henmi
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Publication number: 20180301978Abstract: A semiconductor device includes a plurality of H-bridge circuits and a logic circuit which is commonly used for the plurality of H-bridge circuits. The logic circuit controls driving of each of the plurality of H-bridge circuits on the basis of signals which are input thereinto in such a manner that a combination of respective driving states of the plurality of H-bridge circuits meets a predetermined condition.Type: ApplicationFiled: February 21, 2018Publication date: October 18, 2018Applicant: Renesas Electronics CorporationInventor: Shinpei WATANABE
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Publication number: 20180041233Abstract: The transmitter circuit according to one embodiment includes a pulse generating circuit generating a pulse signal based on edges of input data, a first output driver outputting, based on the pulse signal, a first output pulse signal according to one of the edges to a first end of an external insulating coupling element, a second output driver outputting, based on the pulse signal, a second output pulse signal according to other one of the edges to a second end of the insulating coupling element, and an output stop circuit stopping the first and second output pulse signals from being output for a prescribed period from when a power supply voltage is turned on.Type: ApplicationFiled: October 9, 2017Publication date: February 8, 2018Applicants: RENESAS ELECTRONICS CORPORATION, RENESAS ELECTRONICS CORPORATIONInventors: Koichi TAKEDA, Hirokazu NAGASE, Shinpei WATANABE
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Patent number: 9813084Abstract: The transmitter circuit according to one embodiment includes a pulse generating circuit generating a pulse signal based on edges of input data, a first output driver outputting, based on the pulse signal, a first output pulse signal according to one of the edges to a first end of an external insulating coupling element, a second output driver outputting, based on the pulse signal, a second output pulse signal according to other one of the edges to a second end of the insulating coupling element, and an output stop circuit stopping the first and second output pulse signals from being output for a prescribed period from when a power supply voltage is turned on.Type: GrantFiled: March 10, 2016Date of Patent: November 7, 2017Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Koichi Takeda, Hirokazu Nagase, Shinpei Watanabe
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Publication number: 20170148751Abstract: A semiconductor device includes a first semiconductor chip including a first plurality of wiring layers, and a first coil, a first bonding pad, and first dummy wires formed in an uppermost layer of the first plurality of the wiring layers, and a second semiconductor chip including a second plurality of wiring layers, a second coil, a second bonding pad, and second dummy wires formed in an uppermost layer of the second plurality of the wiring layers. The first semiconductor chip and the second semiconductor chip face each other via an insulation sheet. The first coil and the second coil are magnetically coupled with each other.Type: ApplicationFiled: February 3, 2017Publication date: May 25, 2017Inventors: Shinpei WATANABE, Shinichi Uchida, Tadashi Maeda, Kazuo Henmi
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Patent number: 9589887Abstract: Dielectric breakdown is prevented between opposing two semiconductor chips, to improve the reliability of a semiconductor device. A first semiconductor chip has a wiring structure including a plurality of wiring layers, a first coil formed in the wiring structure, and an insulation film formed over the wiring structure. A second semiconductor chip has a wiring structure including a plurality of wiring layers, a second coil formed over the wiring structure, and an insulation film formed over the wiring structure. The first semiconductor chip and the second semiconductor chip are stacked via an insulation sheet with the insulation film of the first semiconductor chip and the insulation film of the second semiconductor chip facing each other. The first coil and the second coil are magnetically coupled with each other. Then, in each of the first and second semiconductor chips, wires and dummy wires are formed at the uppermost-layer wiring layer.Type: GrantFiled: September 23, 2015Date of Patent: March 7, 2017Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Shinpei Watanabe, Shinichi Uchida, Tadashi Maeda, Kazuo Henmi
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Patent number: 9466591Abstract: A semiconductor device includes a first semiconductor chip that includes a first main surface, a first inductor formed on the first main surface, and a first external connection terminal formed on the first main surface; a second semiconductor chip that includes a second main surface, a second inductor formed on the second main surface, a second external connection terminal formed on the second main surface; and a first insulating film that is located between the first semiconductor chip and the second semiconductor chip, wherein the first semiconductor chip and the second semiconductor chip overlap each other such that the first main surface and the second main face each other, the semiconductor device includes a facing region in which the first semiconductor chip and the second semiconductor chip overlap each other when seen in a plan view.Type: GrantFiled: January 6, 2016Date of Patent: October 11, 2016Assignee: Renesas Electronics CorporationInventors: Shinpei Watanabe, Shinichi Uchida, Tadashi Maeda, Shigeru Tanaka
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Publication number: 20160277043Abstract: The transmitter circuit according to one embodiment includes a pulse generating circuit generating a pulse signal based on edges of input data, a first output driver outputting, based on the pulse signal, a first output pulse signal according to one of the edges to a first end of an external insulating coupling element, a second output driver outputting, based on the pulse signal, a second output pulse signal according to other one of the edges to a second end of the insulating coupling element, and an output stop circuit stopping the first and second output pulse signals from being output for a prescribed period from when a power supply voltage is turned on.Type: ApplicationFiled: March 10, 2016Publication date: September 22, 2016Inventors: Koichi TAKEDA, Hirokazu NAGASE, Shinpei WATANABE
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Publication number: 20160118368Abstract: A semiconductor device includes a first semiconductor chip that includes a first main surface, a first inductor formed on the first main surface, and a first external connection terminal formed on the first main surface; a second semiconductor chip that includes a second main surface, a second inductor formed on the second main surface, a second external connection terminal formed on the second main surface; and a first insulating film that is located between the first semiconductor chip and the second semiconductor chip, wherein the first semiconductor chip and the second semiconductor chip overlap each other such that the first main surface and the second main face each other, the semiconductor device includes a facing region in which the first semiconductor chip and the second semiconductor chip overlap each other when seen in a plan view.Type: ApplicationFiled: January 6, 2016Publication date: April 28, 2016Inventors: Shinpei WATANABE, Shinichi UCHIDA, Tadashi MAEDA, Shigeru TANAKA
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Publication number: 20160093570Abstract: Dielectric breakdown is prevented between opposing two semiconductor chips, to improve the reliability of a semiconductor device. A first semiconductor chip has a wiring structure including a plurality of wiring layers, a first coil formed in the wiring structure, and an insulation film formed over the wiring structure. A second semiconductor chip has a wiring structure including a plurality of wiring layers, a second coil formed over the wiring structure, and an insulation film formed over the wiring structure. The first semiconductor chip and the second semiconductor chip are stacked via an insulation sheet with the insulation film of the first semiconductor chip and the insulation film of the second semiconductor chip facing each other. The first coil and the second coil are magnetically coupled with each other. Then, in each of the first and second semiconductor chips, wires and dummy wires are formed at the uppermost-layer wiring layer.Type: ApplicationFiled: September 23, 2015Publication date: March 31, 2016Inventors: Shinpei WATANABE, Shinichi UCHIDA, Tadashi MAEDA, Kazuo HENMI
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Patent number: 9252200Abstract: In a first semiconductor chip, a first multilayer interconnect layer is formed on a first substrate, and a first inductor is formed in the first multilayer interconnect layer. In a second semiconductor chip, a second multilayer interconnect layer is formed on a second substrate. A second inductor is formed in the second multilayer interconnect layer. The first semiconductor chip and the second semiconductor chip overlap each other in a direction in which the first multilayer interconnect layer and the second multilayer interconnect layer face each other. In addition, the first inductor and the second inductor overlap each other when seen in a plan view. At least one end of a first insulating film does not overlap the end of a facing region, in a Y direction.Type: GrantFiled: October 23, 2014Date of Patent: February 2, 2016Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Shinpei Watanabe, Shinichi Uchida, Tadashi Maeda, Shigeru Tanaka
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Publication number: 20150130022Abstract: In a first semiconductor chip, a first multilayer interconnect layer is formed on a first substrate, and a first inductor is formed in the first multilayer interconnect layer. In a second semiconductor chip, a second multilayer interconnect layer is formed on a second substrate. A second inductor is formed in the second multilayer interconnect layer. The first semiconductor chip and the second semiconductor chip overlap each other in a direction in which the first multilayer interconnect layer and the second multilayer interconnect layer face each other. In addition, the first inductor and the second inductor overlap each other when seen in a plan view. At least one end of a first insulating film does not overlap the end of a facing region, in a Y direction.Type: ApplicationFiled: October 23, 2014Publication date: May 14, 2015Inventors: Shinpei Watanabe, Shinichi Uchida, Tadashi Maeda, Shigeru Tanaka
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Patent number: 8010557Abstract: IP addresses included in a route table are segmented so as to be able to be retrieved all together, and are retrieved at a high rate. As means for retrieving the IP address, a pointer table 200, a secondary pointer table, a local table, and a route table are provided, and a table with a numerical value comparing function is also provided when the further segmentation is necessary. In the retrieval for the ACL table, a fixed length data table of fixed length data configured in the ACL table is generated, and the ACL table is retrieved by using a retrieving method for retrieving the route table. Such tables are provided with a table manager 600 as means for efficiently composing and managing the table, and managing to prevent the retrieving operation from being obstructed.Type: GrantFiled: June 17, 2008Date of Patent: August 30, 2011Assignee: IPT CorporationInventor: Shinpei Watanabe
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Publication number: 20090234841Abstract: IP addresses included in a route table are segmented so as to be able to be retrieved all together, and are retrieved at a high rate. As means for retrieving the IP address, a pointer table 200, a secondary pointer table, a local table, and a route table are provided, and a table with a numerical value comparing function is also provided when the further segmentation is necessary. In the retrieval for the ACL table, a fixed length data table of fixed length data configured in the ACL table is generated, and the ACL table is retrieved by using a retrieving method for retrieving the route table. Such tables are provided with a table manager 600 as means for efficiently composing and managing the table, and managing to prevent the retrieving operation from being obstructed.Type: ApplicationFiled: June 17, 2008Publication date: September 17, 2009Inventor: Shinpei Watanabe
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Patent number: 7565343Abstract: Fixed-length data (560) contained in a database (560) are segmented into a number of pieces of data that are searchable at a time and searching is performed at high speed. As means for it, a pointer table (500), a secondary pointer table, a local table, and a fixed-length-data table are provided, and when more segmentation is required, a table having a numeric-value comparing function is further provided. As means for performing efficient configuration/management of the tables and for performing management that does not interfere with a search operation, an empty-house table (700), an empty-room table (720), a room-management table (740), and a structure-management table (760) may be provided.Type: GrantFiled: March 31, 2004Date of Patent: July 21, 2009Assignee: IPT CorporationInventor: Shinpei Watanabe
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Patent number: 7541765Abstract: A motor control circuit includes: a detector outputting a detection signal in accordance with the motor rpm; a counter counting the number of clocks in accordance with a rotational cycle represented by the detection signal; a controller counting a DC motor based on the count value; and a divider dividing a frequency of a basic clock based on a preset division value to generate a counting clock. The divider generates a counting clock having a frequency corresponding to a rotational cycle, and the counter counts the number of counting clocks.Type: GrantFiled: November 14, 2006Date of Patent: June 2, 2009Assignee: NEC Electronics CorporationInventor: Shinpei Watanabe
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Patent number: 7469243Abstract: Embodiments of the present invention provide method and device for searching fixed length data. The device includes a hash operation means for operating and outputting a hash value of inputted fixed length data, a data table memory consisting of N numbers of memory banks, where N is an integer that is more than and equal to 2, the data table memory for storing a data table holding a large number of fixed length data, a pointer table memory for storing a memory pointer table holding a memory address at which each fixed length datum is stored with the hash value as an index, and a comparison means for simultaneously comparing a plurality of fixed length data stored at the same memory address in the N numbers of memory banks with a single fixed length datum inputted to the hash operation means, the comparison means for outputting results of the comparison.Type: GrantFiled: January 27, 2004Date of Patent: December 23, 2008Assignee: International Business Machines CorporationInventors: Masaya Mori, Shinpei Watanabe, Yoshihisa Takatsu, Toshio Sunaga
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Patent number: 7460538Abstract: A communication control apparatus includes search information associated with a tree structure. A mask prefix is associated with at least one entry, each entry including information on the mask length of a mask prefix associated therewith and a sort key. Each entry is assigned to a node in the tree structure according to a sorting order. Each node is linked to a different node at the next lower hierarchy via a branch based on the entry of the node. A destination address of the packet received is first extracted, and a search target node specified by a search control for an entry having information on the best matched prefix of the extracted address is then searched for. After completion of the node-by-node search process, a transfer route is determined for the packet received based on the longest prefix amongst the most appropriate prefixes of all the current search target nodes.Type: GrantFiled: February 17, 2004Date of Patent: December 2, 2008Assignee: International Business Machines CorporationInventors: Yoshihisa Takatsu, Shinpei Watanabe, Masaya Mori, Toshio Sunaga