Patents by Inventor Shinsuke Suzuki

Shinsuke Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7715390
    Abstract: An RPF Neighbor having the least traffic flow is estimated and a multicast distribution path via the RPF Neighbor is selected so as to split the load between routers constituting the Equal-cost Multipath and lines.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: May 11, 2010
    Assignee: Alaxala Networks Corporation
    Inventor: Shinsuke Suzuki
  • Patent number: 7709351
    Abstract: A method of manufacturing a semiconductor device includes the steps of: preparing a bonding sheet having one or more holes that penetrate from a first surface to an opposite second surface thereof, and a semiconductor wafer having a semiconductor element; affixing the bonding sheet to a predetermined surface of the semiconductor wafer; and evacuating gas present between the bonding sheet and the semiconductor wafer via the one or more holes.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: May 4, 2010
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Shinsuke Suzuki
  • Publication number: 20100061369
    Abstract: In a multicast network which permits client nodes to join only a source-specific multicast group, when a multicast group join request is received from a client node provided with an any-source multicast management protocol, a multicast router translates the join request into a join request for a source-specific multicast group by applying a source server address of the multicast group searched from a multicast source address table on the basis of an address of an incoming line of the join request and the multicast group address designated in the join request.
    Type: Application
    Filed: November 17, 2009
    Publication date: March 11, 2010
    Inventor: Shinsuke Suzuki
  • Publication number: 20090289099
    Abstract: A wire bonding apparatus includes a heat block and a heat plate provided on the heat block. A recess is provided in the heat plate to receive the first semiconductor chip and wires without contact therewith when the lead frame is provided on the heat plate such that the first main surface of the lead frame faces toward heat plate. A duct is provided in the heat plate to connect the recess to the outside of the heat plate. A gas supplied through the duct is heated by a heater and discharged into the recess.
    Type: Application
    Filed: November 13, 2008
    Publication date: November 26, 2009
    Inventor: Shinsuke Suzuki
  • Patent number: 7623517
    Abstract: In a multicast network which permits client nodes to join only a source-specific multicast group, when a multicast group join request is received from a client node provided with an any-source multicast management protocol, a multicast router translates the join request into a join request for a source-specific multicast group by applying a source server address of the multicast group searched from a multicast source address table on the basis of an address of an incoming line of the join request and the multicast group address designated in the join request.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: November 24, 2009
    Assignee: Hitachi, Ltd.
    Inventor: Shinsuke Suzuki
  • Publication number: 20090135820
    Abstract: An RPF Neighbor having the least traffic flow is estimated and a multicast distribution path via the RPF Neighbor is selected so as to split the load between routers constituting the Equal-cost Multipath and lines.
    Type: Application
    Filed: July 24, 2008
    Publication date: May 28, 2009
    Inventor: Shinsuke Suzuki
  • Publication number: 20090041058
    Abstract: An internetwork arrangement including: a prefix request unit for requesting an IPv6 address prefix from each of one or more first internetwork apparatuses; a prefix generation unit for generating a second prefix required to create an IPv6 address in the user apparatus utilizing a service, the second prefix having a length different from that of said IPv6 address prefix, on the basis of each of the one or more arbitrary IPv6 address prefixes, which differ for every service, given as notice by said one or more first internetwork apparatuses; and a prefix sending unit for giving notice of one or more generated second prefixes to the connected user apparatus utilizing said service.
    Type: Application
    Filed: October 17, 2008
    Publication date: February 12, 2009
    Inventors: Naoya IKEDA, Shuji Ono, Shinsuke Suzuki, Mika Mizutani
  • Patent number: 7469812
    Abstract: A wire bonding apparatus includes a heat block (121) and a heat plate (122) provided on the heat block (121). A recess (1221) is provided in the heat plate (122) to receive the first semiconductor chip (41) and wires (51) without contact therewith when the lead frame (50) is provided on the heat plate (122) such that the first main surface (501) of the lead frame (50) faces toward heat plate. A duct (13) is provided in the heat plate (122) to connect the recess (1221) to the outside of the heat plate (122). A gas supplied through the duct (13) is heated by a heater (14) and discharged into the recess (1221).
    Type: Grant
    Filed: January 13, 2005
    Date of Patent: December 30, 2008
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Shinsuke Suzuki
  • Publication number: 20080199630
    Abstract: The present invention is to provide a method of producing a separating agent for an enantiomeric isomer having a high optical resolution power together with sufficient solvent resistance. That is, a method of producing a separating agent for an enantiomeric isomer comprising the steps of allowing the porous carrier to carry the optically active polymer compound by bringing the porous carrier into contact with a dope of the optically active polymer compound and exposing a product to radiation.
    Type: Application
    Filed: April 22, 2008
    Publication date: August 21, 2008
    Inventors: Shinsuke Suzuki, Atsushi Onishi, Kazumi Suzuki
  • Patent number: 7407576
    Abstract: The present invention is to provide a method of producing a separating agent for an enantiomeric isomer having a high optical resolution power together with sufficient solvent resistance. That is, a method of producing a separating agent for an enantiomeric isomer comprising the steps of allowing the porous carrier to carry the optically active polymer compound by bringing the porous carrier into contact with a dope of the optically active polymer compound and exposing a product to radiation.
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: August 5, 2008
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Shinsuke Suzuki, Atsushi Onishi, Kazumi Suzuki
  • Publication number: 20080175240
    Abstract: In a first-hop router, a reachability monitor monitors RP (Rendezvous-Point) reachability, and the number of times when a response time is not shorter than a predetermined time is stored in a RP management table. An RP selection process controls not to select RP whose reachability from the first-hop router is not stable, so that PIM Register transmission to an unstable RP is suppressed.
    Type: Application
    Filed: November 28, 2007
    Publication date: July 24, 2008
    Inventor: Shinsuke SUZUKI
  • Publication number: 20080162854
    Abstract: The invention improves safety of an electronic controller using a nonvolatile memory MRAM able to easily perform reading and writing operations at high speed. Therefore, MRAM for writing a control program from an external tool has a correction code adding writing circuit, a decoding reading-out circuit, and error registers for writing an error generating address number thereto as error data. When the error generating address is designated and confirmation reading-out is performed and an error is generated as before, an overlapping abnormality judgment is made and abnormality notification is performed. A program memory area of MRAM is normally in a writing inhibition state. When the external tool is connected, the inhibition state is released. The error registers are arranged in a data memory area set to no writing inhibition object.
    Type: Application
    Filed: August 29, 2007
    Publication date: July 3, 2008
    Applicant: Mitsubishi Electric Corporation
    Inventors: Koji HASHIMOTO, Katsuya Nakamoto, Shoso Tsunekazu, Shinsuke Suzuki
  • Publication number: 20080090984
    Abstract: A glucan derivative (e.g., a cellulose acylate derivative) which is useful for a thermoplastic resin, is inhibited in hygroscopicity at a high level and is excellent in compatibility with a plasticizer or solubility in a solvent is provided. In the glucan derivative which comprises an acyl group and a graft chain formed from at least one graft component selected from a lactone and a hydroxycarboxylic acid, each bonding to a glucose unit of a glucan (e.g., a cellulose) constituting the glucan derivative, a hydroxyl group in the graft chain is protected with a protecting group. The graft chain may be formed from a C4-16lactone. The hydroxyl group in the graft chain may be protected with an acyl group (e.g., a C2-8alkylcarbonyl group such as acetyl group). The degree of substitution of the acyl group may be from 1 to 2.99, and the degree of substitution of the graft chain may be from 0.01 to 2.
    Type: Application
    Filed: August 26, 2005
    Publication date: April 17, 2008
    Inventors: Hajime Namikoshi, Hiroshi Katayama, Koichi Umemoto, Shinsuke Suzuki
  • Patent number: 7328014
    Abstract: A communication method and system allowing MN (mobile nodes) to acquire a home address in a visited network. The communication system includes a home network installed with a home agent for holding mobile terminal location information and, a visited network installed with a radio communications device for communicating with that mobile terminal, and gateway equipment in the visited network for forming an interface with the home network. The radio communication device includes an access request transfer unit for forwarding access requests from a mobile terminal of the visited network to the gateway equipment which makes an acquisition request to the home agent for an identifier of that mobile terminal, and forwards that acquired identifier to that mobile terminal.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: February 5, 2008
    Assignee: Hitachi, Ltd.
    Inventors: Yukiko Takeda, Hidenori Inouchi, Keisuke Takeuchi, Shinsuke Suzuki
  • Publication number: 20070177600
    Abstract: Flow information of excessive traffic detected by a traffic monitor of a packet forwarding apparatus is entirely delivered to a manager server. By combining input/output port information of the flow and topology information, the manager server calculates from where the flow is inputted and to where the flow is outputted. By further combining results of judgment of traffic contents, the manager server controls the traffic at an optimal position according to the traffic contents. The problems of inefficiency can be avoided by managing the flow information by the manager server in a concentrated way. Adding the flow information to the network topology drawing for each flow, it is possible for the network administrator to more easily understand the statuses of flows on the network.
    Type: Application
    Filed: January 10, 2007
    Publication date: August 2, 2007
    Inventors: Shinsuke Suzuki, Toshio Shimojo
  • Publication number: 20070164926
    Abstract: A display control device for controlling the display of an image in a display device includes a decision unit configured to decide whether the state of a scaling of a moving-image portion in a display object image or an image to be displayed in the display device has changed; and a display control unit configured to select a screen mode for displaying the display object image in response to the change in the scaling state of the moving-image portion in the display object image, and to display the display object image in the screen mode in the display device.
    Type: Application
    Filed: September 28, 2006
    Publication date: July 19, 2007
    Applicant: Sony Corporation
    Inventor: Shinsuke Suzuki
  • Publication number: 20070048903
    Abstract: A multi-chip package type semiconductor device includes an insulating substrate having first and second conductive patterns thereon, a first semiconductor chip on the insulating substrate and having a first terminal pad and a relay pad isolated from the first terminal pad. The device further includes a second semiconductor chip on the first semiconductor chip having a second terminal pad. The first semiconductor chip is connected to the first pattern by a first bonding wire. The second semiconductor chip is connected to the second pattern by a second bonding wire, which connects the second pattern to the relay pad, and a third bonding wire, which connects the relay pad to the second terminal pad. The lengths of the first, second and third bonding wire are approximately the same.
    Type: Application
    Filed: October 2, 2006
    Publication date: March 1, 2007
    Inventors: Mitsuru Komiyama, Shinsuke Suzuki
  • Publication number: 20060274768
    Abstract: Prior art quarantine networks were implemented by two methods, the IEEE802.1x method and the DHCP method, but these methods both have different problems. The problem with the IEEE802.1x method is that it is difficult to make the transition from an existing management framework. The problem with the DHCP method is that it is difficult to prevent attacks on the network itself, and to repeat client quarantine. The present invention implements client login authentication and client security status quarantine independently, and controls layer-2 connectivity based on the respective results. This permits quarantine using an existing management framework, as well as enhancing network protection by layer-2 connection control and permitting repeat quarantine of the client using the same IP address. Moreover, by incorporating other layer-2 connectivity control mechanisms, flexible layer-2 connectivity control outside the quarantine network can also be implemented.
    Type: Application
    Filed: May 31, 2006
    Publication date: December 7, 2006
    Inventors: Shinsuke Suzuki, Takeshi Shibata, Hidemitsu Higuchi, Takao Miyabe
  • Publication number: 20060263941
    Abstract: A method of manufacturing a semiconductor device includes the steps of: preparing a bonding sheet having one or more holes that penetrate from a first surface to an opposite second surface thereof, and a semiconductor wafer having a semiconductor element; affixing the bonding sheet to a predetermined surface of the semiconductor wafer; and evacuating gas present between the bonding sheet and the semiconductor wafer via the one or more holes.
    Type: Application
    Filed: March 29, 2006
    Publication date: November 23, 2006
    Applicant: OKI ELECTRIC INDUSTRY CO., LTD.
    Inventor: Shinsuke SUZUKI
  • Patent number: 7115977
    Abstract: A multi-chip package type semiconductor device includes an insulating substrate having first and second conductive patterns thereon, a first semiconductor chip on the insulating substrate and having a first terminal pad and a relay pad isolated from the first terminal pad. The device further includes a second semiconductor chip on the first semiconductor chip having a second terminal pad. The first semiconductor chip is connected to the first pattern by a first bonding wire. The second semiconductor chip is connected to the second pattern by a second bonding wire, which connects the second pattern to the relay pad, and a third bonding wire, which connects the relay pad to the second terminal pad. The lengths of the first, second and third bonding wire are approximately the same.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: October 3, 2006
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Mitsuru Komiyama, Shinsuke Suzuki